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Chip Component Information
Chip components are installed at the fac-
a small spot of adhesive resin at the location
where each part is to be installed, and later
robots handle and place Parts using vacuum
suction.
For Single sided boards, solder Paste is ap-
plied and the board is then baked to harden
the resin and flow the solder. For double sided
boards, no solder Paste is applied, but the
board is baked (or exposed to ultra-violet
light) to eure the resin before dip soldering.
In our laboratories and Service shops, small
quantities of chip components are mounted
manually by applying a spot of resin, placing
with tweezers, and then soldering by very
small dual streams of hot air (without physi-
cal contact during soldering). We remove
suction iron, which applies a light steady vac-
uum at the iron tip, and then breaking the
adhesive with tweezers.
T h e special vacuum/desoldering equip-
ment is recommended if you expect to do a lot
of Chip replacements. Otherwise, it is usually
possible to remove and replace Chip compo-
nents with only a tapered, temperature-con-
trolled soldering iron, a set of tweezers and
braided topper solder wick. Soldering iron
temperature should be below 280" C (536" F).
D
not disconnect a Chip forcefully, or the
O
foil Pattern may peel off the board.
Never re-use a Chip component. Dispose of
all removed chip components immediately to
avoid mixing with new Parts.
Limit soldering time to 3 seconds or less to
avoid damaging the component and board.
Removing Chip Components
time, using solder wick whetted with non-
acidic fluxes as shown below. Avoid applying
pressure, and do not attempt to remove tin-
ning
the chip's electrode.
and gently twist the tweezers back and forth
(to break the adhesive bond) while alter-
nately heating each electrode. Be careful to
avoid peeling the foil traces from the board.
Dispose of the chip when removed.
and soldering iron to wick away any excess
the replacement part.
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