LG F1200 Service Manual
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LG F1200 Service Manual

LG F1200 Service Manual

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Service Manual
F1200
P/N : MMBD0045801
Date : Feb, 2005 / Issue 1.0

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Summary of Contents for LG F1200

  • Page 1 Service Manual F1200 P/N : MMBD0045801 Date : Feb, 2005 / Issue 1.0...

  • Page 2: Table Of Contents

    Table Of Contents ........1. INTRODUCTION 6. DOWNLOAD AND CALIBRATION 1.1 Purpose ..........3 6.1 Download ..........91 1.2 Regulatory Information ......3 6.2 Download Procedure ......92 1.3 Abbreviations ........5 ......7. BLOCK DIAGRAM ........2. PERFORMANCE ......
  • Page 3 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the F1200. - 2 -...

  • Page 4: Introduction

    1. INTRODUCTION 1. INTRODUCTION 1.1 Purpose This manual provides the information necessary to repair, calibration, description and download the features of F1200. 1.2 Regulatory Information (1) Security Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person...
  • Page 5 1. INTRODUCTION (6) Pictures The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different. (7) Interference and Attenuation Phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems. (8) Electrostatic Sensitive Devices ATTENTION Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the...

  • Page 6: Abbreviations

    1. INTRODUCTION 1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Rate CC-CV Constant Current – Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing Electrostatic Discharge FPCB Flexible Printed Circuit Board...
  • Page 7 1. INTRODUCTION Subscriber Identity Module Sending Loudness Rating SRAM Static Random Access Memory PSRAM Pseudo SRAM STMR Side Tone Masking Rating Travel Adapter Time Division Duplex TDMA Time Division Multiple Access UART Universal Asynchronous Receiver/Transmitter Voltage Controlled Oscillator VCTCXO Voltage Control Temperature Compensated Crystal Oscillator Wireless Application Protocol - 6 -...

  • Page 8: Performance

    2. PERFORMANCE 2. PERFORMANCE 2.1 H/W Features Item Feature Comment Standard Battery Li-Ion, 950mAh AVG TCVR Current 240mA Standby Current < 5.2mA Talk time Over 5 hour (@ GSM Tx Level 7) Standby time Over 250 hour (@ Paging Period 9, RSSI : -85dBm) Charging time 3 hours RX Sensitivity...

  • Page 9: Technical Specification

    2. PERFORMANCE 2.2 Technical Specification Item Description Specification GSM900 TX: 890 + n x 0.2 MHz (n=1 ~ 124) 890 + (n-1024) x 0.2 MHz (n=975 ~ 1023) RX: TX + 45 MHz DCS1800 Frequency Band TX: 1710 + (n-511) x 0.2 MHz (n = 512 x 885) RX: TX + 95 MHz PCS1900 TX: 1850 + (n-511) x 0.2 MHz...
  • Page 10 2. PERFORMANCE Item Description Specification GSM900 Offset from Carrier (kHz) Max. dBc +0.5 –30 –33 –60 600 ~ 1,200 –60 1,200 ~ 1,800 –60 1,800 ~ 3,000 –63 3,000 ~ 6,000 –65 Output RF Spectrum 6,000 –71 (due to modulation) DCS1800/PCS1900 Offset from Carrier (kHz) Max.
  • Page 11 2. PERFORMANCE Item Description Specification GSM900 BER (Class II) < 2.439% @–102 dBm Bit Error Rate DCS1800/PCS1900 BER (Class II) < 2.439% @–100 dBm RX Level Report Accuracy 3 dB 8 3 dB Frequency (Hz) Max. (dB) Min. (dB) –12 –...
  • Page 12 2. PERFORMANCE Item Description Specification <Change> 32.768KHz ≤ 30 ppm tolerance Standby Power consumption - Normal, ≤5.2mA (Mix. power) GSM900/Lvl 7 (Battery Capacity 950mA): 321 min Talk Time GSM900/Lvl 12 (Battery Capacity 950mA): 499 min Under conditions, at least 250 hours: 1.

  • Page 13: Technical Brief

    3. TECHNICAL BRIEF 3. TECHNICAL BRIEF 3.1 RF Transceiver General Description The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a DCXO part. The SI4206[U102] is a triple band transceiver IC suitable for GSM 900, DCS 1800 and PCS 1900 GPRS class 12 applications.
  • Page 14 3. TECHNICAL BRIEF Figure 1. RECEIVER PART Block Diagram (1) RF Front End RF front end consists of Antenna Switch Module with SAW filter for triple band (FL100), triple band LNAs integrated in transceiver (U102). The Received RF signals (EGSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz, PCS 1850 ~ 1990MHz) are fed into the antenna or mobile switch.

  • Page 15: Synthesizer Part

    3. TECHNICAL BRIEF (2) Low IF A quadrate image-rejection mixer downconverts the RF signal to a 100kHz intermediate frequency (IF) with the RFLO. The RFLO frequency is between 1849.8 and 1918.8 MHz, and is divided by two for EGSM modes. The RFLO frequency is between 1804.9 and 1879.9 MHz, and is divided by one for DCS modes.
  • Page 16 3. TECHNICAL BRIEF Figure 2. SYNTHESIZER PART Block Diagram (1) DCXO The Aero I+ transceiver integrates the DCXO circuitry required to generate a precise system reference clock using only an external crystal resonator. (See Figure 15.) An internal digitally programmable capacitor array (CDAC) provides a coarse method of adjusting the reference frequency in discrete steps.

  • Page 17: Transmitter Part

    3. TECHNICAL BRIEF 3.4 Transmitter Part The Transmitter part contains Si4206[U102] active parts, Power Amp Module[U100] and Antenna Switch Module[FL100]. The transmit section of Si4206[U102] consists of an I/Q baseband pconverter, an offset phaselocked loop (OPLL) and two 50 ohm output buffers that can drive external power amplifiers.
  • Page 18 3. TECHNICAL BRIEF (3) Power Amplifier Module The SKY77325[U100] is a triple-band GSM/DCS/PCS power amplifier module that incorporates an indirect closed loop method of power control. The indirect closed loop is fully self-contained and it does not require loop optimization. It can be driven directly from the DAC output in the baseband circuit.

  • Page 19: Digital Baseband

    3. TECHNICAL BRIEF 3.5 Digital Baseband Figure 7. Top level block diagram of the Calypso-Plus (1) General Description Calypso-Plus device is an evolution of Calypso (C035) device integrating hardware enhancements targeting the implementation of a new range of user’s applications. It supports the digital baseband processing of GSM radio signals in switching circuit mode and packet data mode up to class 12 in compliance with the ETSI specification of the GPRS protocol.
  • Page 20 Config #1 Config #2 Config #3 Config #4 Table 3. Configuration of addressable ranges F1200 applies configuration #1 as its external memory interface, the external devices are connected to as follow. External Device External Device nCS0 32Mbit SRAM nCS3...
  • Page 21 The interface implements a 8-bit parallel data bus in addition to the control signals for selecting chip, writing/Reading, command and address latching, ready/busy status. So, F1200 uses this interface as for NAND Flash memory and uses stacked memory (SRAM + NOR-Flash + NAND-Flash) as shown in (Figure 8.)
  • Page 22 3. TECHNICAL BRIEF (3) RF Interface (TPU, TSP block) Calypso-Plus uses this interface to control ABB Processor and RF Processor with GSM Time Base. TSP (Time Serial Port) Resource Interconnection Description TSPDO ABB & RF main Chip Control Data TSPEN0 ABB Control Data Enable Signal TSPEN1 RF main Chip...
  • Page 23 3. TECHNICAL BRIEF (5) Serial Interface Calypso-Plus has UART-IRDA and two UART Modem Drivers. (UART Modem2 is not used at F1200). UART MODEM (UART1) Resource Interconnection Description TX_MODEM1 Transmit Data RX_MODEM1 Receive Data CTS_MODEM1 Clear To Send RTS_MODEM1 Request To Send...
  • Page 24 3. TECHNICAL BRIEF Figure 10. USB interface diagram (7) Audio Circuits 1.5V_CORE 2.8V_DSP 2.8V_DSP HSOL C568 HSOR C548 C545 C544 0.1u 0.1u 0.1u R528 C534 C569 C539 INSTPAR R500 HSBIAS UCLAMP0501H D503 C547 C500 C501 C576 1000p R527 U505 CN500 MAX4684EBC VA504 RESET_B...
  • Page 25 8-bit parallel host interface, a 3/4 serial peripheral interface (SPI), control ports for LED, Vibrator, and 4-general purpose I/Os. In F1200, uPD9993 is driven with 13MHz master clock from DBB (Calypso plus). Stereo Audio signals are transferred to next stage from stereo lineout ports of uPD9993.
  • Page 26 TPA2005 is a mono power amplifier for loud speaker. Two amplifiers are used for stereo operation. It drives a speaker up to 1W power in full differential mode. In F1200, input signals are single-ended mode and output signals are differential mode. Speaker Amplifier is controlled with SPK_EN signal from DBB (Calypso plus) which can enable or disable the amplifiers.
  • Page 27 The uPD9993 needs three power supply 1.5V for digital core, 2.8V for analog core, 2.8V for external interfaces. In F1200, the power supplies for analog core and external interfaces are combined with one supply. So dual LDO is used power supply for uPD9993. “1.5V_CORE” is for digital core of uPD9993 and “2.8V_DSP”...
  • Page 28 3. TECHNICAL BRIEF (8) Keypad Switching & Scanning KBC0 KBC1 KBC2 KBC3 KBC4 KBC5 KBR0 [OK] KBR1 SHUT CLEAR KBR2 [F1] [Vol Up] KBR3 [F2] [Vol Down] KBR4 [SEND] Table 7. Keypad Map DBB supports 6x6 keymap and Switch-ON Key is connected directly to ABB as (Figure 16.). CN301 Close to Side-key PAD R318...
  • Page 29 3. TECHNICAL BRIEF (9) Keypad back-light Illumination There are 12 Deep Blue LEDs in Main Board for Keypad Backlight. Keypad Back-light is driven by ‘KEY_BACKLIGHT’ (GPIO0) line from DBB. VBAT Q301 IMX9T110 R360 KEY_BACKLIGHT 1.5K R359 R361 R358 100K Figure 18. Keypad Back-light Scheme (10) LCD Back-light Illumination VBAT U400...
  • Page 30 3. TECHNICAL BRIEF EN_SET is the serial interface control pin connected to the GPIO of DBB. EN_SET sets the current sink magnitudes and allows independent group control: ISINK1~4. Four constant current sink inputs (ISINK1to ISINK4) can drive four individual LEDs with a maximum current of 20mA each.
  • Page 31 3. TECHNICAL BRIEF (12) GPIO Map In total 16 allowable resources, F1200 is using 16 full resources. G7200 GPIO (General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table 8. I/O # Application Resource...

  • Page 32: Analog Baseband

    3. TECHNICAL BRIEF 3.6 Analog Baseband (1) General Description Syren is Analog Baseband (ABB) Chip supports GSM900, DCS1800, PCS1900, GPRS Class 10 with Digital Baseband Chip. Syren processes GSM modulation/demodulation and power management operations. Block Description - Audio Signal Processing & Interface - Baseband in-phase (I), quadrature (Q) Signal Processing - Auxiliary RF converters - Five-channel analog-to-digital converters (ADC)
  • Page 33 3. TECHNICAL BRIEF Figure 21. Voice Uplink path Block Diagram Figure 22. Voice Downlink path Block Diagram - 32 -...
  • Page 34 3. TECHNICAL BRIEF (3) Baseband Codec (BBC) Baseband codec is composed of baseband uplink path (BUL) and baseband downlink path (BDL). BUL makes GMSK (Gaussian Minimum Shift Keying) modulated signal which has In- phase (I) component and quadrature (Q) component with burst data from DBB. This modulated signal is transmitted through RF section via air.
  • Page 35 3. TECHNICAL BRIEF (Figure 24.) shows the power supply related blocks of DBB/ABB and their interfaces in F1200. Figure 24. Power Supply Scheme - 34 -...
  • Page 36 Hook Detect Table 10. ADC Channel Spec. (6) Switch ON/OFF F1200 Power State : Defined 4 cases as follow - Power-ON : mobile is powered by main battery or backup battery. - Power-OFF : mobile isn’t any battery. - Switch-ON : mobile is powered and waken up from switch-off state.

  • Page 37: Lcd & Camera Interface

    3. TECHNICAL BRIEF 3.7 LCD & Camera Interface (1) LCD Interface In F1200, main & sub LCD is displayed by memory interface through Camera back-end-chip. The camera-back-end chip is bypass-mode and use LCD Access Port. The module include: LCD : Main = 128*160 dot...
  • Page 38 3. TECHNICAL BRIEF (2) Camera Interface In F1200, Camera Back-End-chip is applied for camera flow control and power control respectively. The full scheme is shown in Figure 26. CAMERA CAM_D(7) CAM_D(6) CAM_D(5) CAM_D(4) CAM_D(3) SI1305 CAM_D(2) Q401 FB400 CAM_D(1) CAM_D(0)

  • Page 39: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING 4.1 Baseband Part Troubleshooting (1) Power-On Trouble • Power-On Sequence - Connecting Battery - Power-On Key Detection - PWON signal goes to ABB and then ABB resets DBB by ONNOFF signal - ONNOFF turns low (0V) to High (2.8V) and it resets DBB (Calypso plus) - All LDOs (internal LDOs of ABB and external LDOs) are turned on •...
  • Page 40 4. TROUBLE SHOOTING • Charging Temperature ADC Range - ~ -20°C : No Charging operation - -20°C ~ 60°C : Charging - 60°C ~ : No Charging operation Blinking 3.93V 3.92V~3.78V 3.78V~3.70V 3.70V~3.62V 3.62V~3.5V (STB) 3.5V~3.35V *STB : Standby mode (* When talk mode, the battery icon starts blinking below 3.62V level) Block Diagram Charging Current Q400...
  • Page 41 4. TROUBLE SHOOTING START Resolder the CN405 I/O Connector (CN405) (Pin 4,5: VCHG, Is well - soldered ? Pin 12,19,25,26 : GND) The TA is out of order. Voltage at pin 4,6 of Q400 Change the TA Q400,D400,R407 are Resolder the Q400,D400,R407 soldring well? Voltage across R407 Replace the Q400, D400...
  • Page 42 4. TROUBLE SHOOTING START Refer to Power On Power is supplied to the board? trouble Connection between FPCB Reconnect FPCB and board is OK? CN400 is soldered well? Resolder the CN400 Resolder the FL400 Paths of LCD control signals are OK? Replace the FPCB FPCB is OK? Resolder the...
  • Page 43 4. TROUBLE SHOOTING (4) Speaker/Receiver Trouble Circuit Diagram 1.5V_CORE 2.8V_DSP 2.8V_DSP HSOL C568 HSOR C548 C545 C544 0.1u 0.1u 0.1u R528 C534 C569 C539 INSTPAR R500 HSBIAS UCLAMP0501H D503 C547 C500 C501 C576 1000p R527 U505 CN500 MAX4684EBC VA504 RESET_B DSP_RESET L502 AVLC14S02050...
  • Page 44 4. TROUBLE SHOOTING • PCB picture (Main side) C543 C544 R520 R534 R524 R541 U501 U502 L503 L504 C524 C523 C526 R525 R526 U505 C510 C522 C515 C514 C527 R519 U508 C519 C520 R542 CN400 R543 C552 C503 R513 R507 C502 R513 CN500 - 43 -...
  • Page 45 4. TROUBLE SHOOTING R500 R550 R549 - 44 -...

  • Page 46: Receiver Trouble

    4. TROUBLE SHOOTING • Receiver Trouble START Set the audio volume to max. level Set Audio mode of test equipment as continuous wave mode Check the Resistance Resolder or Replace R541, R549 between R541 and R549 (and R524, R550) (R524 and R550) ~0 Ohm? ABB is out of order.

  • Page 47: Speaker Trouble

    4. TROUBLE SHOOTING • Speaker Trouble START Resolder the Soldering status of CN400 and CN400 Speakers is OK? or Sfpeakers Check the Resistance between +/— port of Replace the speaker speaker (Left, Right). Is it about 8Ohm? Check the Resistance between The Connection between C510 and C524 (C522 and C523) FPCB and Main Board is OK?
  • Page 48 4. TROUBLE SHOOTING (5) Microphone Trouble R542 MICBIAS C551 C550 R543 2.4K C515 R525 MIC500 MICP 0.1u C553 C514 R526 47 OB4-15L42-C33L MICN 0.1u R544 C552 C554 1.2K • Microphone Signal Flow - MIC is enabled by MICBIAS - MICBIAS is supplied from ABB (SYREN) - MICP, MICN signal to ABB (SYREN) •...
  • Page 49 4. TROUBLE SHOOTING (6) Earphone Trouble START lnsert Earphone to the phone Does the audio profile of the phone change to Go to the earphone mode? Earphone Detection Problem Set audio part of the test equipment to echo mode Set audio part of the test equipment to CW mode Can you hear your voice from...
  • Page 50 4. TROUBLE SHOOTING Start Earphone Receiving Problem CW signal appear Change the Main-PCB at L502, L501? CW signal appear Soldering status of Resolder C526, at pin 4, 5 of C526, C527, R510, R511 C527, R510, R511 CN500? is OK? Change the Earphone Logic Level is Low at R519? Change the Main-PCB Change the U505...

  • Page 51: Block Diagram

    4. TROUBLE SHOOTING Start Earphone Sending Problem Soldering status of The Voltage Level is Resolder R500, R513 R500, R513 is OK? about 2V at C502? Change the Main-PCB Audio signal appears at C503? Soldering status of Resolder C503 C503 is OK? Change the Main-PCB Soldering status of Resolder CN500...
  • Page 52 4. TROUBLE SHOOTING • Vibrator Operation - Vibrator is controlled by MIDI Chip (U506) - When vibrator signal is high, vibrator on LCD module is enabled • Check Points - VCC lines of MIDI Chip - Vibrator signal path - The connection between the main board and LCD module - The soldering of components - The vibrator •...
  • Page 53 4. TROUBLE SHOOTING • Vibrator Trouble START Enter into Engineering Mode and select Vibrator Connection between Reconnect FPCB. FPCB and board is OK? CN400, FPCB, Vibrator are Resolder the CN400, soldered well? FPCB, Vibrator. Resolder the R304, Signal path is OK? R303, Q300, R305, L301 Replace the U505.
  • Page 54 4. TROUBLE SHOOTING (8) Keypad Backlight Trouble • Backlight Operation - The Keypad LED Backlight is controlled with KEY_BACKLIGHT signal from ABB (Syren) - The LEDs are forward biased and turned on • Check Points - KEY_BACKLIGHT signal - LEDs •...
  • Page 55 4. TROUBLE SHOOTING • Keypad Backlight Trouble (Case of all LEDs are not working) START Enter into Engineering Mode and select Keypad On ABB is out of order. The Voltage of KEY_BACKLIGHT signal is about 0V? Power of and Measure the Resistor Value of all LEDs.
  • Page 56 4. TROUBLE SHOOTING (9) Folder On/Off and Trouble Block Diagram (Folder On/Off) R209 R208 R201 R205 R202 FOLDER 100K R204 ON_OFF SI1304DL Q201 C201 V_IO TDO_ABB Hall Effect Switch TDO_ARM R300 FOLDER C300 0.1u A3212EEH U300 C301 0.1u OUTPUT GND2 PGND GND1 ADIN1...
  • Page 57 4. TROUBLE SHOOTING • Folder Trouble (On/Off) START The all paths connected Resolder the C300, to U300 are OK? C301, R300 Refer to Power On The V_IO is 2.8V? Trouble. Folder1 signal is low on Replace the U300. U300 is broken. magnetizing into U300? The DBB (Calypso) is broken.
  • Page 58 4. TROUBLE SHOOTING (10) SIM Detect Trouble SIM interface scheme is shown below. SIM_IO, SIM_CLK, SIM_RST ports are used to communicate DBB with ABB and the Charge Pump in ABB enables 1.8V/3V SIM operation. J400 GND1 SIM_RST SIM_CLK SIM_IO GND2 GND5 GND3 GND4...
  • Page 59 4. TROUBLE SHOOTING • Trouble Shooting - Insert the SIM into socket - Connect PIF_UNION Jig to the phone, and Power on • Trouble Shooting Procedure - Check the power supply - Check the soldering of SIM socket - Check the SIM START Insert the SIM Card Resolder the J400.
  • Page 60 4. TROUBLE SHOOTING (11) Camera Trouble In F1200, Camera Back-End-chip is applied for camera flow control and power control respectively. The full scheme is shown in Figure 26. CAMERA CAM_D(7) CAM_D(6) CAM_D(5) CAM_D(4) CAM_D(3) SI1305 CAM_D(2) Q401 FB400 CAM_D(1) CAM_D(0)

  • Page 61: Camera Trouble

    4. TROUBLE SHOOTING • Camera Trouble START Does the LCD itself has Go to the LCD no trouble? Set the camera button ON Change U500 Check Power Source 2.80V Check 2.8V_DSP Check Q401 Change Q401 Check the Soldering Resoldering CN400 The CN400 Check the CAM_MCLK DSP is out of order Change U507...
  • Page 62 4. TROUBLE SHOOTING U500 FL404 -CAM_MCK -CAM_PCLK -CAM_HS CN400 -CMA_VS U507 Q401 - 61 -...
  • Page 63 4. TROUBLE SHOOTING (12) Infrared Data Association Trouble Block Diagram VBAT IrDA TX IRDA UART RX IRDA IrDA (CALYPSO SD IRDA plus) V_IO • Infrared Signal Flow - Infrared is enable by SD - TX_IRDA,RX_IRDA,SD_IRDA signals from DBB • Check Points - Check the power supply.
  • Page 64 4. TROUBLE SHOOTING • IrDA Trouble START Set configuration like Fig 1. Execute PCSy nc program (ContentsBank.exe) Resolder the C421 The power is supplied to U401? Resolder the U401. the soldering of U401 is OK? The signal TX_lrDA, RX_lrDA Change the U401. are measured? The DBB is broken.

  • Page 65: Trouble Shooting Of Receiver Part

    4. TROUBLE SHOOTING 4.2 Trouble Shooting of Receiver Part Checking Flow Checking Points Setup Test Equipment GSM900 62CH, Rx Level-60dBm DCS1800 700CH, Rx Level-60dBm PCS1900 660CH, Rx Level-60dBm 1. Check RF LDO Circuit 2. Check DCXO Circuit 3. Check RF Chipset Control Signal 4.
  • Page 66 4. TROUBLE SHOOTING (1) Checking LDO Circuit Checking Points Checking Flow Pin6 Redownload Pin1 : 2.85V OK? High? phone S/W Replace U104 LDO Circuit is OK. U104 Go to the next stage Pin 6 : RF_EN Pin 1 : RF2.85V LDO Circuit Diagram Waveform VBAT...
  • Page 67 4. TROUBLE SHOOTING (2) Checking DCXO circuits Checking Points U102 Pin 28 X100 Pin 3 Checking Flow Check 26MHz X100. Pin1 Refer to Waveform Similar ? Replace X100 Check 26MHz U102. Pin28 Similar ? Replace U102 Refer to Waveform DCXO Circuit is OK Check if there is any Go to the next stage Major Difference...
  • Page 68 4. TROUBLE SHOOTING DCXO Circuit Diagram RF2.85V C128 VDD3 VDD2 U102 SI4206 XTAL1 XTAL2 XAFC Waveform X100.Pin3. U102.Pin28 - 67 -...
  • Page 69 4. TROUBLE SHOOTING (3) Checking RF Chipset Control Signal Checking Points U102 SCLK SENB Checking Flow Redownload Check SENB, SCLK, SDI Similar ? Refer to Waveform phone S/W Control Signals is OK Check if there is any Major Difference See next page to check Control Signal Circuit Diagram Waveform RFID...
  • Page 70 4. TROUBLE SHOOTING (4) Checking Mobile S/W and FEM Circuit Checking Points Pin1 SW100 Pin2 ANT_SW1 ANT_SW2 FL100 ANT_SW3 Pin1 Pin3 Pin5 Mobile S/W & FEM Circuit Diagram C120 L102 R100 R101 L101 22nH TP100 FL100 SW100 KMS-507 SHS-L090SF 10nH C100 C121 C101...
  • Page 71 4. TROUBLE SHOOTING Checking Flow Test for Mechanical Connection (No call setup is needed) Check SW1 Pin 1,2 with Open Replace SW1 RF Cable connected Short Replace SW1 Check SW100 Pin 1,2 with No RF Cable connected ANT_SW1 : Low Redownload Check C111, C112, C127 ANT_SW2 : Low...
  • Page 72 4. TROUBLE SHOOTING (5) Checking Rx IQ Circuit Checking Points C137 C138 U102 Checking Flow Check C137,C138 Similar ? Replace U102 Refer to Waveform Check if there is any Tx IQ is OK Major Difference Rx IQ Circuit Diagram CAM_CLK RXQP C563 C118...
  • Page 73 4. TROUBLE SHOOTING Waveform Tx Burst Tx IQ data - 72 -...

  • Page 74: Trouble Shooting Transmitter Part

    4. TROUBLE SHOOTING 4.3 Trouble Shooting Transmitter Part Checking Flow Checking Points Setup Test Equipment GSM900 62CH, 5-Level DCS1800 700CH, 0-Level PCS1900 660CH, 0-Level 1. Check RF LDO Circuit 2. Check DCXO Circuit 3. Check Control Signals 4. Check Tx I&Q Signals 5.
  • Page 75 4. TROUBLE SHOOTING (1) Checking LDO Circuit Checking Points Checking Flow Pin6 Redownload Pin1 : 2.85V OK? High? phone S/W Replace U104 LDO Circuit is OK. U104 Go to the next stage Pin 6 : RF_EN Pin 1 : RF2.85V LDO Circuit Diagram Waveform VBAT...
  • Page 76 4. TROUBLE SHOOTING (2) Checking DCXO circuits Checking Points U102 Pin 28 X100 Pin 3 Checking Flow Check 26MHz X100.Pin1 Refer to Waveform Similar ? Replace X100 Check 26MHz U102.Pin28 Similar ? Replace U102 Refer to Waveform DCXO Circuit is OK Check if there is any Go to the next stage Major Difference...
  • Page 77 4. TROUBLE SHOOTING DCXO Circuit Diagram RF2.85V C128 VDD3 VDD2 U102 SI4206 XTAL1 XTAL2 XAFC Waveform X100.Pin3. U102.Pin28 - 76 -...
  • Page 78 4. TROUBLE SHOOTING (3) Checking RF Chipset Control Signal Checking Points U102 SCLK SENB Checking Flow Redownload Check SENB, SCLK, SDI Similar ? Refer to Waveform phone S/W Control Signals is OK Check if there is any Major Difference See next page to check Control Signal Circuit Diagram Waveform RFID...
  • Page 79 4. TROUBLE SHOOTING (4) Checking Tx IQ signals Checking Points C137 C138 U102 Checking Flow Check C137, C138 Similar ? Replace U102 Refer to Waveform Check if there is any Tx IQ is OK Major Difference Rx IQ Circuit Diagram CAM_CLK RXQP C563...
  • Page 80 4. TROUBLE SHOOTING Waveform Tx Burst Tx IQ data (5) Check Tx PAM circuits Checking Points DCS/PCS GSM OUT U102 PA_ON PA_BAND - 79 -...
  • Page 81 4. TROUBLE SHOOTING Checking Flow Redownload Check Control Signals Similar ? of U102 Refer to Waveform phone S/W Check if there is any Tx IQ signals are OK. Major Difference Go to the next stage Tx PAM Circuit Diagram C108 R106 PA_BAND RSVD...
  • Page 82 4. TROUBLE SHOOTING (6) Checking FEM & Mobile S/W circuits Checking Points Pin1 SW100 Pin2 ANT_SW1 ANT_SW2 Pin13 Pin10 Pin8 FL100 ANT_SW3 Pin1 Pin3 Pin5 Mobile S/W & FEM Circuit Diagram C120 L102 R100 R101 L101 22nH TP100 FL100 SW100 KMS-507 SHS-L090SF 10nH...
  • Page 83 4. TROUBLE SHOOTING Checking Flow Test for Mechanical Connection (No call setup is needed) Check SW1 Pin 1, 2 with Open Repace SW1 RF Cable connected Check SW1 Pin 1, 2 with Short Repace SW1 No RF Cable connected Check ANT_SW1, ANT_SW2, Check ANT_SW3 ANT_SW1...

  • Page 84: Rf Rx Tx Signal Flow On Test Mode

    4. TROUBLE SHOOTING 4.4 RF Rx Tx signal flow on Test mode FL100 -67dBm U102 ANT SW -60dBm ANT_SW1,2,3 30dBm (DCS/PCS) 33dBm (GSM) | XWW U100 APC,PA_ON,PA_BAND Switch Mode Tri Band Frequency [MHz] Table EGSM Tx BAND DCS/PCS Tx High EGSM 925 ~ 960 880 ~ 915...

  • Page 85: Disassembly Instruction

    5. DISASSEMBLY INSTRUCTION 5. DISASSEMBLY INSTRUCTION Figure 5-1. Figure 5-2. - 84 -...
  • Page 86 5. DISASSEMBLY INSTRUCTION Figure 5-3. Figure 5-4. - 85 -...
  • Page 87 5. DISASSEMBLY INSTRUCTION Figure 5-5. Figure 5-6. - 86 -...
  • Page 88 5. DISASSEMBLY INSTRUCTION Figure 5-7. Figure 5-8. - 87 -...
  • Page 89 5. DISASSEMBLY INSTRUCTION Figure 5-9. Figure 5-10. - 88 -...
  • Page 90 5. DISASSEMBLY INSTRUCTION Figure 5-11. Figure 5-12. - 89 -...
  • Page 91 5. DISASSEMBLY INSTRUCTION Figure 5-13. - 90 -...

  • Page 92: Download And Calibration

    In case of using the PIF UART Figure 6-1. Download Setup Preparation · Target Handset (F1200) · PIF · RS-232 Cable and PIF-to-Phone interface Cable · TA/Power Supply or Battery · IBM compatible PC supporting RS-232 with Windows 98 or 2000 If you use battery, you should have a battery with the voltage above 3.7V.

  • Page 93: Download Procedure

    6. DOWNLOAD AND CALIBRATION 6.2 Download Procedure 1. Execute Fluid_GUI.exe and select “Erase/Program flash” menu. - 92 -...
  • Page 94 6. DOWNLOAD AND CALIBRATION 2. Click the “Add” button. Then, choose m0 file which is going to download. - 93 -...
  • Page 95 6. DOWNLOAD AND CALIBRATION 3. You must choose three programming options in programming options box. - 94 -...
  • Page 96 6. DOWNLOAD AND CALIBRATION 4. Press “Global Settings” menu. Choose a correct serial port and set the configuration as below. - 95 -...
  • Page 97 6. DOWNLOAD AND CALIBRATION 5. After checking programming options, Click “Erase/Program” button. If you click “Erase/Program” button, you will be able to see that “(reset target)” is displayed in the “Output” window. And then if you push shortly the “Power key” of the mobile, downloading will be started.
  • Page 98 6. DOWNLOAD AND CALIBRATION 6. Wait for downloading to be finished. - 97 -...
  • Page 99 6. DOWNLOAD AND CALIBRATION 7. If downloading is finished, we can switch on the mobile. When you switch on the mobile first time after downloading, you must not remove the battery until switch-on procedure is completed. If you remove the battery before switch-on procedure is completed, we will not be able to save user data in the flash memory of the mobile.

  • Page 100: Block Diagram

    7. BLOCK DIAGRAM 7. BLOCK DIAGRAM 192M(Flash) 96M(SRAM) Memory Parallel Key Pad Interface CAMERA Camera (VGA) IrDA BackEnd IC Module (Calypso Plus) NAND(Flash) 512Mb NAND I/F 24 Pin (65K) I/O Connector Main 1.86 Serial Port Sub 1.17 Memory Parallel Interface Vibrator SPK AMP Speaker...
  • Page 101 Note - 100 -...

  • Page 102: Circuit Diagram

    RF2.85V MIC5255-2.85BM5 U104 RF_EN C133 C132 C131 C130 0.01u 2.2u 1000p Engineer: S.J.KWON LG Electronics Drawn by: C.B.HONG R&D CHK: TITLE: Size: F1200 I. Y. HWANG DOC CTRL CHK: 12 1 8 A Rev_1.0 MFG ENGR CHK: Changed by: Date Changed:...
  • Page 103 SPK_EN HP_AMP_EN Close to DBB MIDI_EN F_KEY_BL LCD_BACKLIGHT R220 USB_EN KEY_BACKLIGHT Engineer: J.S. BAE LG Electronics Drawn by: S. R. LEE R&D CHK: Y. J. PARK TITLE: Size: F1200 DOC CTRL CHK: 12 1 8 A Rev_1.0 MFG ENGR CHK:...
  • Page 104 A(2) C_HOLD 1000p 220n 470p TP515 TP517 C_INT L_CS D(0:15) Engineer: J.S. BAE LG Electronics Drawn by: S.R. LEE R&D CHK: Y. J. PARK TITLE: Size: F1200 DOC CTRL CHK: 12 1 8 A Rev_1.0 MFG ENGR CHK: Changed by:...
  • Page 105 VBAT VBAT COM1 R440 JTAGEN COM2 AVLC18S02015 AVLC18S02015 VA401 VA402 Engineer: J.Y. YEON LG Electronics Drawn by: S.R. LEE R&D CHK: Y. J. PARK TITLE: Size: F1200 DOC CTRL CHK: 12 1 8 A Rev_1.0 MFG ENGR CHK: Changed by:...
  • Page 106 MICN OB4-15L42-C33L 0.1u C509 BGND R544 C552 C554 0.01u 1.2K Engineer: J.Y. YEON LG Electronics Drawn by: S.R. LEE R&D CHK: Y. J. PARK TITLE: Size: F1200 DOC CTRL CHK: 12 1 8 A Rev_1.0 MFG ENGR CHK: Changed by:...

  • Page 107: Pcb Layout

    9. PCB LAYOUT 9. PCB LAYOUT - 106 -...
  • Page 108 9. PCB LAYOUT - 107 -...
  • Page 109 Note - 108 -...

  • Page 110: Engineering Mode

    [2-8-6] DAI Test [2-5-3] Effect Sound [2-9] Irda Test [2-5-4] iMelody Sound [2-5-5] EMS Sound [2-10]Format NAND [2-5-6] Speaker Teste [3] F1200 Vers [2-6] Serial Port [4] Eng Mode [2-6-1] Modem [2-6-2] Irda [4-1] Cell Environ. [2-7] Battery Info1 [4-2] Location Info...

  • Page 111: Stand Alone Test

    11. STAND ALONE TEST 11. STAND ALONE TEST 11.1 What’s the Standalone Test? Set the Phone to Perform only Tx or Rx mode for monitoring performance of Tx part or Rx part only. 1. Normal Call 2. Standalone • During Rx Standalone •...

  • Page 112: Standalone Test Equipment Setup

    11. STAND ALONE TEST 11.2 Standalone Test Equipment Setup GSM Test Equipment Power Supply RS-232 Cable Phone - 111 -...

  • Page 113: Hw Test : Software For Standalone Test Setup

    11. STAND ALONE TEST 11.3 HW Test : Software for Standalone Test Setup Standalone Test Setting Block - 112 -...
  • Page 114 11. STAND ALONE TEST Standalone Test Setting Block - 113 -...

  • Page 115: Tx Stand Alone Test Setting

    11. STAND ALONE TEST 11.4 Tx Stand alone Test Setting 1. Setting the Test Equipment as ‘Test Mode-BCH’ Example) For HP8960 On the Control Window Operating Mode : Test Test Function : BCH For HP8922 Operating mode : Test Mode 2.
  • Page 116 11. STAND ALONE TEST Tx Stand alone Test Setting 3. Select Tx 4. Select Tx Power GSM:5 For DCS:0 5. Press Test Button - 115 -...

  • Page 117: Rx Stand Alone Test Setting

    11. STAND ALONE TEST 11.5 Rx Stand alone Test Setting 1. Setting the Test Equipment as ‘CW Mode’ Example) For HP8960 On the Control Window Operating Mode : Test Test Function : CW For HP8922 Operating mode : CW Generator 2.
  • Page 118 11. STAND ALONE TEST Rx Stand alone Test Setting 4. RF Band Select For GSM,DCS :DUALEXT RX Select For PCS : DUALUS 5. Setting 6. Setting Channel Channel 7. Set PM Start - 117 -...

  • Page 119: Service And Calibration

    12. SERVICE AND CALIBRATION 12. SERVICE AND CALIBRATION 12.1 Service S/W 12.1.1 Overview This service S/W is used for Calibration and Standalone test. 12.1.2 Hardware and Software Environment • More than 486 computer • 16Mbyte RAM • Remained more than 10Mbyte in Hard Disk Memory •...
  • Page 120 12. SERVICE AND CALIBRATION A. Target System Frame This is for initializing the target phone. When you use this program to test F1200 phone, you have to initialize target at first. To initialize target phone, select target (F1200 is default) and COM port used at your computer and then click the Initialize button.

  • Page 121: Calibration

    12. SERVICE AND CALIBRATION Power Level Setting First, you have to choose operating mode (GSM or DCS,PCS) according to TCH and BCH frequency that you selected before. Then select the Level and adjust the DAC value. Level means GSM/DCS,PCS output power level. Usable range is 5 to 19 for GSM, 0 to 15 for DCS,PCS.

  • Page 122: Equipment List

    12. SERVICE AND CALIBRATION 12.2.2 Equipment List Calibration Equipment List Equipment for Calibration Type/Model Brand Wireless Communication Test Set HP-8960, HP8922, CMU200, any other call equipment RS-232 Cable and Test JIG RF Cable Power Supply Service S/W Laputa PC (for Software Installation) Pentium ¥±...

  • Page 123: Calibration Steps

    12. SERVICE AND CALIBRATION 12.2.3 Calibration steps In order for the RSSI measurements to be within the GSM specifications, some calibration is necessary. Also, due to AGC implementation, some AGC specific constants need calibration. In total, three calibrations are required per receive band, AGC calibration, channel compensation and temperature compensation.
  • Page 124 12. SERVICE AND CALIBRATION Power Level Table 6-2 TX Target Powers Procedure a) Initialize phone by clicking Initialize button. b) Set the BCH and TCH of the phone 62 for E-GSM900, 699 for DCS1800 and 689 for PCS1900. Of cause you have to match test equipment’s BCH and TCH ARFCN with this value.

  • Page 125: Test Jig Operation

    12. SERVICE AND CALIBRATION 12.2.4 Test JIG Operation JIG Power Equipment Power Supply Usually 4.0V DC Adaptor 9.5V, 500mA JIG DIP Switch Switch Number Name Description Switch 1 ADI_REMOTE In On state phone is awaked. Not used OFF state Switch 2 TI_REMOTE InOn state phone is awaked.

  • Page 126: Exploded View & Replacement Part List

    13. EXPLODED VIEW & REPLACEMENT PART LIST 13. EXPLODED VIEW & REPLACEMENT PART LIST 13.1 Exploded View - 125 -...
  • Page 127 Note - 126 -...

  • Page 128: Replacement Parts

    (left) Black MFBC01 FILTER,SPEAKER MFBC0011001 f1200 speaker filter (right) Black MGAD00 GASKET,SHIELD FORM MGAD0065001 f1200 gasket shield form (lcd con) Gold MGAD01 GASKET,SHIELD FORM MGAD0065201 f1200 gasket shield form (upper) Gold MTAA00 TAPE,DECO MTAA0057701 f1200 upper deco tape...
  • Page 129 C1300 CGRSV Cone Type 1.8PI, 2.5PI, 5.0 Length Silver White MSHY00 SUPPORT MSHY0006701 f1200 support Silver MWAG00 WINDOW,IRDA MWAG0007401 f1200 irda window Dark Blue MCCH00 CAP,SCREW MCCH0034401 f1200 rear screw cap Grey MLAA00 LABEL,APPROVAL MLAA0030001 F1200_MOC_RUSghost White MLAK00 LABEL,MODEL MLAK0006901 MLAZ00 LABEL MLAZ0040301 F1200_CE_LABEL White...

  • Page 130: Main Component

    SBOM standard on GCSC Level Location No. Description Part Number Specification Color Remark ADCA00 DOME ASSY,METAL ADCA0024401 f1200 folder function dome assy (4pi) White SACY00 PCB ASSY,FLEXIBLE SACY0027301 SACA00 PCB ASSY, FLEXIBLE,AUTO SACA0001201 POLI, 0.4mm, MULTI-4 SACC00 PCB ASSY,FLEXIBLE,SMT BOTTOM...
  • Page 131 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part Number Specification Color Remark C101 INDUCTOR,CHIP ELCH0001001 10 nH,J,1005,R/TP C102 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C103 CAP,TANTAL,CHIP,MAKER ECTZ0003101 33 uF,10V ,M ,STD ,ETC ,R/TP C104 CAP,CERAMIC,CHIP ECCH0000155 10 nF,16V,K,X7R,HD,1005,R/TP C106 CAP,CERAMIC,CHIP ECCH0000111...
  • Page 132 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part Number Specification Color Remark C303 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C307 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C402 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C405 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP C406 CAP,CERAMIC,CHIP ECCH0003401...
  • Page 133 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part Number Specification Color Remark C549 CAP,CERAMIC,CHIP ECCH0000117 27 pF,50V,J,NP0,TC,1005,R/TP C550 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP C551 CAP,CERAMIC,CHIP ECCH0007901 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP C552 CAP,CERAMIC,CHIP ECCH0000122...
  • Page 134 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part Number Specification Color Remark R107 RES,CHIP ERHY0000223 150 ohm,1/16W,J,1005,R/TP R108 RES,CHIP ERHY0000223 150 ohm,1/16W,J,1005,R/TP R109 RES,CHIP ERHY0006603 36 ohm,1/16W ,J ,1005 ,R/TP R110 RES,CHIP ERHY0006603 36 ohm,1/16W ,J ,1005 ,R/TP R111 RES,CHIP ERHY0000184...
  • Page 135 13. EXPLODED VIEW & REPLACEMENT PART LIST Level Location No. Description Part Number Specification Color Remark R411 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R412 RES,CHIP ERHY0000244 1.5K ohm,1/16W,J,1005,R/TP R413 RES,CHIP ERHY0000209 27 ohm,1/16W,J,1005,R/TP R414 RES,CHIP ERHY0000209 27 ohm,1/16W,J,1005,R/TP R415 RES,CHIP ERHY0000211 33 ohm,1/16W,J,1005,R/TP R418 RES,CHIP ERHY0000220...
  • Page 136 X100 X-TAL EXXY0019501 26 MHz,10 PPM,8 pF,50 ohm,SMD ,3.2*2.5*0.6 , X200 X-TAL EXXY0015601 .032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3 , SAFD00 PCB ASSY,MAIN,SMT TOP SAFD0037001 F1200 TOP PCB C300 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C301 CAP,CERAMIC,CHIP ECCH0000167 0.1 uF,6.3V,K,X5R,HD,1005,R/TP C400 CAP,CERAMIC,CHIP ECCH0004904 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP...
  • Page 137 18 V, ,SMD , SPFY00 PCB,MAIN SPFY0078101 FR-4 ,1.0 mm,STAGGERED-8 , SAFB00 PCB ASSY,MAIN,INSERT SAFB0031901 F1200 INSERT ADCA00 DOME ASSY,METAL ADCA0024501 f1200 main dome assy (5pi) Silver CN300 PCB ASSY,SIDEKEY SAKY0004501 Volume Key CN301 PCB ASSY,FUNCTION SADY0009201 Camera Button MIC500 MICROPHONE SUMY0003802 FPCB ,-42 dB,4*1.5 ,...
  • Page 138 SGDY0004403 T5100 ,24P,D-CABLE SGEY00 EAR PHONE/EAR MIKE SET SGEY0005501 ,12pin Connector (Tyco) SRCY00 CDROM SRCY0001340 S/W ,NONE ,F1200 ,650 MB, SSAD00 ADAPTOR,AC-DC SSAD0007828 100-240V ,60 Hz,5.2 V,800 mA,CE,CB,GOST ,EU PLUG(24P),STD WSYY00 SOFTWARE WSYY0193001 F1200P64-7-V80I-xxx-xx Jan 04 2005 - 137 -...
  • Page 139 Note. - 138 -...
  • Page 140 Note. - 139 -...
  • Page 141 Note. - 140 -...

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