BenQ AF51 Service Manual
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BenQ AF51 Service Manual

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Release 1.0
Service Manual
AF51
Level 1-3
Release
Date
Department
Notes to change
R 1.0
29.12.2005
BenQ Mobile S CC CES
New document
10/2005
Technical Documentation
TD_Repair_L2.5L_AF51_R1.0.pdf
Page 1 of 56
Company Confidential
2005©BenQ

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Summary of Contents for BenQ AF51

  • Page 1 Release 1.0 Service Manual AF51 Level 1-3 Release Date Department Notes to change R 1.0 29.12.2005 BenQ Mobile S CC CES New document 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 1 of 56 Company Confidential 2005©BenQ...

  • Page 2: Table Of Contents

    10 JPICS (Java based Product Information Controlling System) ..........35 11 International Mobile Equipment Identity, IMEI..............41 12 General Testing Information....................42 13 Introduction of Service Repair Documentation for Level 3 Basic Repairs – AF51 ...48 14 List of available Level 3 Basic Parts..................49 15 Hardware Requirements ......................49 16 AF51 Board Layout .........................50...

  • Page 3: Key Feature

    Silent alert (Vibra) Games, Speaker-dependent voice dialing File manager: Flash File System and Explorer Calculator, Currency converter Birthday reminder Start-up assistant for clock set Car Kit Portable as accessory 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 3 of 56 Company Confidential 2005©BenQ...

  • Page 4: Af51 Interface To Accessories

    Release 1.0 2 AF51 Interface to Accessories Nano I/O connector is for G85 generation. The compatible interface is suitable to use the travel charger. 3 Unit Description of AF51 Demonstrate modern styling with the timelessly elegant “pocket size” clamshell design with integrated antenna and a valuable look.

  • Page 5: Exploded View Of Af51

    Release 1.0 4 Exploded View of AF51 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 5 of 56 Company Confidential 2005©BenQ...

  • Page 6: Disassembly Of Af51

    Release 1.0 Disassembly of AF51 All repairs as well as disassembling and assembling have to be carried out in an ESD protected environment and with ESD protected equipment/tools. For all activities the international ESD regulations have to be considered. For more details please check information in c – market https://market.benqmobile.com/SO/welcome.lookup.asp...
  • Page 7 Remove Screw cover with the alternative opening tool Step 3 Remove screws with the Torque – Screwdriver T5+ Step 4 Remove rear cover with the Alternative Opening Tool carefully. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 7 of 56 Company Confidential 2005©BenQ...
  • Page 8 Release 1.0 Step 5 Step 6 Remove PCB cover plate by using the alternative opening tool. Step 7 Remove antenna by using the alternative opening tool. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 8 of 56 Company Confidential 2005©BenQ...
  • Page 9 Release 1.0 Step 8 Remove microphone by using tweezers carefully. Step 9 Disconnect the Flex Cable from PCB by using Tweezers. Step 10 Assemble PCB by using the tweezers carefully. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 9 of 56 Company Confidential 2005©BenQ...
  • Page 10 Release 1.0 Step 11 Step 12 Remove Keypad by using Tweezers. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 10 of 56 Company Confidential 2005©BenQ...
  • Page 11 Remove screw cover by using the alternative opening tool carefully. Step 14 Remove screws with the Torque – Screwdriver T5+ Step 15 Remove Front Cover with the Alternative Opening Tool. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 11 of 56 Company Confidential 2005©BenQ...
  • Page 12 Release 1.0 Step 16 Step 17 To avoid scratches it is mandatory to place a protection foil onto the Display!!! Step 18 Remove Display spacer. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 12 of 56 Company Confidential 2005©BenQ...
  • Page 13 Remove Vibramotor by using tweezers. Step 20 Remove Vibra contact Flex foil by using tweezers carefully Step 21 Remove PCB by using the alternative opening tool. Separate Earphone from front cover carefully. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 13 of 56 Company Confidential 2005©BenQ...
  • Page 14 Upper Base Frame from the Lift Frame. Take care of the Flex Cable!!! Step 23 Remove PCB from Lower base frame. Take care of the Flex Cable!!! Step 24 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 14 of 56 Company Confidential 2005©BenQ...
  • Page 15 Release 1.0 Step 25 To avoid scratches it is mandatory to place a protection foil onto the Display!!! Step 26 Disconnect the loudspeaker from PCB with Tweezers. Step 27 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 15 of 56 Company Confidential 2005©BenQ...
  • Page 16 Release 1.0 Step 28 Remove Hinge - Spring by pushing it through the Hinge. Step 29 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 16 of 56 Company Confidential 2005©BenQ...

  • Page 17: Assembly Of Af51

    Hinge Screw Cover Battery PCB cover Spacer Vibramotor plate Lower Base Frame Display Assembly of AF51 Step 1 Push the Hinge inside the Frame. Step 2 Assemble mircrophone by using tweezers. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 17 of 56 Company Confidential...
  • Page 18 Attention! Before assembling the Display Module it is mandatory to remove the Display Foil! Step 4 Assemble Display Spacer. Step 5 Fix the assembled Display Module into the Lift Cover. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 18 of 56 Company Confidential 2005©BenQ...
  • Page 19 Release 1.0 Step 6 Step 7 Step 8 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 19 of 56 Company Confidential 2005©BenQ...
  • Page 20 Flex Cable through the slot of the Lift Cover. Step 10 Use the Hinge – Tool to push the Hinge spring inside to assemble the Upper Case with Upper Base Case. Step 11 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 20 of 56 Company Confidential 2005©BenQ...
  • Page 21 Release 1.0 Step 12 Assemble Vibramotor by using tweezers. Step 13 Attention! Before assembling the Display Module it is mandatory to remove the Display Foil! Step 14 Assemble front cover. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 21 of 56 Company Confidential 2005©BenQ...
  • Page 22 Release 1.0 Step 15 Fix screws with the Torque – Screwdriver Step 16 Assemble screw cover. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 22 of 56 Company Confidential 2005©BenQ...
  • Page 23 Release 1.0 Step 17 Assemble the Keypad by using Tweezers. Step 18 Assemble PCB. Step 19 Connect the Flex Cable with the assembled PCB. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 23 of 56 Company Confidential 2005©BenQ...
  • Page 24 Release 1.0 Step 20 Assemble microphone by using tweezers. Step 21 Assemble antenna module by using tweezers. Step 22 Assemble PCB cover plate. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 24 of 56 Company Confidential 2005©BenQ...
  • Page 25 Release 1.0 Step 23 Assemble rear cover. Step 24 Place screws with the Torque – Screwdriver. Step 25 Assemble Screw cover. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 25 of 56 Company Confidential 2005©BenQ...
  • Page 26 Release 1.0 Step 26 Assemble Battery. Step 27 Assemble Battery Cover. Step 28 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 26 of 56 Company Confidential 2005©BenQ...

  • Page 27: Benq Service Equipment User Manual

    Release 1.0 BenQ Service Equipment User Manual Introduction Every LSO repairing BenQ handset must ensure that the quality standards are observed. BenQ has developed an automatic testing system that will perform all necessary measurements. This testing system is known as: BenQ Mobile Service Equipment •...

  • Page 28: Grt Software: Functionality Configuration

    Enter the value for “JPICS Server Timeout”. Be careful, this value defines how long GRT tries to reach the server until you get an error message. Do not select a very long time 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 28 of 56 Company Confidential 2005©BenQ...
  • Page 29 GRT Software has now finished all required settings and configuration tasks. All files have been down- and uploaded. In dependency of the selected number of mobile phones and variants the volume 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 29 of 56 Company Confidential 2005©BenQ...

  • Page 30: Grt Software: Regular Usage

    Siemens is the so called Master-Table . Like in “Personal Repair” customer data can be erased on request. (xfs and mapping have to be activated) Of course JPICS hardware and authorisation have to be available. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 30 of 56 Company Confidential 2005©BenQ...
  • Page 31 Is the correct COM-Port selected o If a variant is missing, move back to Settings select the missing variant and conncet the GRM Server. Then continue with SW-Update. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 31 of 56 Company Confidential 2005©BenQ...
  • Page 32 If the user wants to download an other variant then the automatically identified one, he has simply to select an other variant from the list. Afterwards he has to start the SW-Update 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 32 of 56 Company Confidential 2005©BenQ...
  • Page 33 If the user wants to download an other variant then the automatically identified one, he has simply to select an other variant from the list. Afterwards he has to start the SW-Update 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 33 of 56 Company Confidential 2005©BenQ...
  • Page 34 If the user wants to download an other variant then the automatically identified one, he has simply to select an other variant from the list. Afterwards he has to start the SW-Update 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 34 of 56 Company Confidential 2005©BenQ...

  • Page 35: Jpics (Java Based Product Information Controlling System)

    The following functions are available for the LSO: • General mobile information • Generate PINCODE • Generate SIMLOCK – UNLOCK – Code • Print IMEI labels • Lock, Unlock and Test the BF - Bus 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 35 of 56 Company Confidential 2005©BenQ...
  • Page 36 – server can only be provided by the JPICS – TRUST – Center of the responsible department in Kamp – Lintfort. In case of any questions or requests concerning smart cards or administration of the databases please ask your responsible BenQ Customer Care Manager. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf...
  • Page 37 3. A supported Smart Card Reader (Omnikey Cardman) in order to access your Smart Card. Remark: We recommend using Cardman 2020 USB or Cardman 3121 USB. Serial card readers are not supported!!! 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 37 of 56 Company Confidential 2005©BenQ...
  • Page 38 • Simlock – Unlock – Codes Masterphone codes The Masterphone code is used to unlock blocked mobiles. Masterphone codes can only be supplied for mobiles which have been delivered in a regular manner. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 38 of 56 Company Confidential 2005©BenQ...
  • Page 39 • The user must be given the authorization to obtain Simlock – Unlock – Codes for the variant of the operator to which the mobile was delivered last time. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 39 of 56 Company Confidential 2005©BenQ...
  • Page 40 This printer has to be connected to local LPT1 printer port (also see Installation of IMPRINT) and MUST feature a printing resolution of 300dpi. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 40 of 56 Company Confidential 2005©BenQ...

  • Page 41: International Mobile Equipment Identity, Imei

    2 digits. 6 digits have been allocated for the equipment serial number for manufacturer and the last digit is spare. The part number for the AF51 is S30880-S2950-#xxx where the last for letters specify the housing and software variant.

  • Page 42: General Testing Information

    Ensure that every data, which is required for the IRIS-Reporting is available in your database. Ensure that there is a description available for the employees how to enter the data. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 42 of 56 Company Confidential 2005©BenQ...
  • Page 43 If components and especially soldered components have to be replaced all rules mentioned in dedicated manuals or additional information e.g. service information have to be considered 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 43 of 56 Company Confidential 2005©BenQ...
  • Page 44 • highest PCL0 • Phase Error RMS • BS Power = -75 dBm • Phase Error Peak • middle BCCH • Average Power • Power Time Template Call release from BS 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 44 of 56 Company Confidential 2005©BenQ...
  • Page 45 Basis is the international standard of DIN ISO 2859. Use Normal Sample Plan Level II and the Quality Border 0, 4 for LSO. Remark: All sample checks must be documented. 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 45 of 56 Company Confidential 2005©BenQ...
  • Page 46 PUK 1 12345678 Pin 2 number: 0000 PUK 2 23456789 2) Test SIM Card from the company “T-D1” Pin 1 number: 1234 76543210 Pin 2 number: 5678 PUK 2 98765432 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 46 of 56 Company Confidential 2005©BenQ...
  • Page 47 Revision Letter (A, B,…) Sony Date code example P N A SO Year (O:2002, P:2003...) Supplier Code Month (1:Jan, 2:Feb,…9:Sep, O:Oct, N:Nov, D:Dec) (Maker’s marking) Revision Letter (A, B,…) 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 47 of 56 Company Confidential 2005©BenQ...

  • Page 48: Introduction Of Service Repair Documentation For Level 3 Basic Repairs - Af51

    Level 3 Basic Repairs – AF51 Purpose This part of Service Repair Documentation is intended to carry out repairs on BenQ Mobile repair level 3basic (only for workshops without level 3 equipment (special agreement required). The described failures shall be repaired in BenQ authorized local workshops only.

  • Page 49: List Of Available Level 3 Basic Parts

    Release 1.0 14 List of available Level 3 Basic Parts (According to Component Matrix V1.09 - check C-market for updates) Product Order Number Description CM AF51 V2801 L36840-L2082-D670 LED BLUE TOP AF51 V2802 L36840-L2082-D670 LED BLUE TOP AF51 V2803 L36840-L2082-D670...

  • Page 50: Af51 Board Layout

    Release 1.0 AF51 Board Layout Upper board side Led´s Lower board side Connector SIM-Card Connector Battery Connector Board to Board IO Jack EMI Filter 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 50 of 56 Company Confidential 2005©BenQ...

  • Page 51: Sim Card Problems

    Resolder new component afterwards. E-commerce order number: L50620-U6029-D670 E-commerce order name: FILTER EMI (Fi-Type7) PB Free Soldering temperature: ~ 360°C TIP Temp IRIS Diagnose Code: 43300 Interface/SIM Card reader/Mechanical Damage 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 51 of 56 Company Confidential 2005©BenQ...

  • Page 52: Io Connector Problems

    E-commerce order number: L50634-Z93-C364 E-commerce order name: IO-JACK SLIM 12-POL Soldering temperature: ~ 360°C TIP Temp. IRIS Diagnose Code: 46100 Interface/Charging Connector/Mechanical Damage 47300 Interface/Data Interface/Mechanical Damage 4B100 Interface/Headset Connector/Mechanical Damage 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 52 of 56 Company Confidential 2005©BenQ...

  • Page 53: To B Connector (Upper Slider Part) Problems

    BOARD TO BOARD 30-POL Soldering temperature: ~ 360°C TIP Temp. IRIS Diagnose Code: 32100 Keys / Main / No Function 32200 Keys / Main / Reduced Functionality 36000 Keys / Illumination 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 53 of 56 Company Confidential 2005©BenQ...

  • Page 54: Main Keypad Illumination Problems

    Attention: Remove Metal Dome Sheet before!!! E-commerce order number: L36840-L2082-D670 E-commerce order name: LED WHITE TOP Soldering temperature: ~ 360°C TIP Temp. IRIS Diagnose Code: 36000 Keys / Illumination 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 54 of 56 Company Confidential 2005©BenQ...

  • Page 55: Connector Battery

    Use hot air blower to remove defective component. Avoid excessive heat! Watch surrounding components! Resolder new component afterwards. L50634-Z97-C467 E-commerce order number: Soldering temperature: 240 - 255°C IRIS Diagnose Code: 13000 Battery/Mechanical Damage 10/2005 Technical Documentation TD_Repair_L2.5L_AF51_R1.0.pdf Page 55 of 56 Company Confidential 2005©BenQ...

  • Page 56: Filter Emi Problems

    Resolder new component afterwards. E-commerce order number: L50620-U6029-D670 E-commerce order name: FILTER EMI (Fi-Type7) PB Free Soldering temperature: ~ 360°C TIP Temp IRIS Diagnose Code: 47000 Data connectivity 11/2005 Technical Documentation TD_Repair_L1-L3_M580_R1.0.pdf Page 56 of 56 Company Confidential 2005©BenQ...

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