HP Compaq Mini 110 Maintenance And Service Manual page 81

2. Remove the heat sink assembly (2).
NOTE: Due to the adhesive quality of the thermal material located between the heat sink
assembly and system board components, it may be necessary to move the heat sink assembly
from side to side to detach the assembly.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink
assembly and the system board each time the heat sink assembly is removed. Thermal paste is
used on the processor (1), and thermal tape is used on the Northbridge chip (2). Replacement
thermal material is included with all heat sink assembly and system board spare part kits.
Reverse this procedure to install the heat sink assembly.
Component replacement procedures 71