Locations Of Key Components And Connectors - IBM System x3550 M4 Product Manual

Energy efficiency
The x3550 M4 offers the following energy-efficiency features to save energy, reduce operational costs,
increase energy availability, and contribute to a green environment:
Energy-efficient planar components help lower operational costs.
High-efficiency 550 W and 750 W power supplies with 80 PLUS Platinum certification.
The Intel Xeon processor E5-2600 product family offers significantly better performance over the
previous generation, while fitting into the same thermal design power (TDP) limits.
Intel Intelligent Power Capability powers individual processor elements on and off as needed, to
reduce power draw.
Low-voltage Intel Xeon processors draw less energy to satisfy the demands of power and thermally
constrained data centers and telecommunication environments.
Low-voltage 1.35 V DDR3 memory RDIMMs consume 15% less energy compared to 1.5 V DDR3
RDIMMs.
Solid-state drives (SSDs) consume as much as 80% less power than traditional spinning 2.5-inch
HDDs.
The server uses hexagonal ventilation holes, a part of IBM Calibrated Vectored Cooling™ technology.
Hexagonal holes can be grouped more densely than round holes, providing more efficient airflow
through the system.
IBM Systems Director Active Energy Manager™ provides advanced data center power notification and
management to help achieve lower heat output and reduced cooling needs.

Locations of key components and connectors

Figure 2 shows the front of the server.
Figure 2. Front view of the IBM System x3550 M4
IBM System x3550 M4 4