Sony HCD-RV990D Service Manual page 2

HCD-RV660D/RV990D
Ver 1.3
Disc player section
System Compact disc and digital
audio and video system
Laser Semiconductor laser
(DVD: λ=650 nm,
CD: λ=780 nm)
Emission duration:
continuous
Frequency response DVD (PCM 48 kHz):
2 Hz – 22 kHz (±1 dB)
CD: 2 Hz – 20 kHz (±1 dB)
Video color system format
NTSC, PAL
OPTICAL DIGITAL OUT
(Square optical connector jack, rear panel)
Wavelength 660 nm
Tape deck section
Recording system 4-track 2-channel stereo
Frequency response 40 – 13,000 Hz (±3 dB),
using Sony TYPE I
cassette
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range 87.5 – 108.0 MHz
Antenna FM lead antenna
Antenna terminals 75 ohm unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range
Latin American models: 530 – 1,710 kHz (with the
interval set at 10 kHz)
531 – 1,710 kHz (with the
interval set at 9 kHz)
Saudi Arabian model: 531 – 1,602 kHz (with the
interval set at 9 kHz)
Other models: 531 – 1,602 kHz (with the
interval set at 9 kHz)
530 – 1,710 kHz (with the
interval set at 10 kHz)
Antenna AM loop antenna
Antenna terminals External antenna terminal
Intermediate frequency 450 kHz
General
Power requirements
Australian model: 230 – 240 V AC, 50/60 Hz
Saudi Arabian model: 120 – 127 V, 220 V or
230 – 240 V AC,
50/60 Hz
Adjustable with voltage
selector
Mexican model: 127 V AC, 60 Hz
Thai model: 220 V AC, 50/60 Hz
Other models: 120 V, 220 V or 230 –
240 V AC, 50/60 Hz
Adjustable with voltage
selector
Power consumption
MHC-RV990D 300 watts
MHC-RV660D 230 watts
Dimensions (w/h/d) Approx. 280 × 325 × 368 mm
Mass
HCD-RV990D Approx. 12.1 kg
HCD-RV660D Approx. 10.6 kg
Design and specifications are subject to change without
notice.
2
Notes on Chip Component Replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
NOTE OF REPLACING THE DMB03 BOARD
When replacing the DMB03 board, since the adjustment value is
not set up correctly, "Drive Auto Adjustment" can't be performed.
In this case, initialize Memory in the following procedures.
Procedure:
1. Set the test mode. (See supplement-1 page 4)
2. Press the [2] key of the remote commander, and set the "DRIVE
MANUAL OPERATION". (See supplement-1 page 9)
3. Press the [6] key of the remote commander, and set the "2-6,
Memory Check". (See supplement-1 page 11)
4. Press the [CLEAR] key of the remote commander, and initialize
Memory.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.