Intel D875PBZ Specification Update page 14

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Intel Desktop Board D875PBZ Specification Update
Figure 26a. Omnidirectional Airflow Heatsink
Failure to ensure appropriate airflow may result in reduced performance of both
the processor and/or voltage regulator or, in some instances, damage to the
desktop board. For a list of chassis that have been tested with Intel
boards please refer to the following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a
system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the Desktop Board
D875PBZ's maximum operating temperature. Failure to do so could cause
components to exceed their maximum case temperature and malfunction. For
information about the maximum operating temperature, see the environmental
specifications in Section 2.14.
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