Technical Specifications - Frame - TC Electronic DB4 MKII Operation Manual

TeCHnICal speCIfICaTIOns - frame

Platform
Number of audio channels:
Number of processing engines:
Processing Delay:
Additional delay:
Output Dither:
Frequency Response DIO:
Internal sample rate:
Internal clock precision:
Jitter rejection at external sample rates:
Rejection filter (4th order):
Rejection filter peak (jitter gain):
PCMCIA Interface
Connector:
Standards:
Card Format:
Control Interface
MIDI:
"GPI control input"
Remote:
SMPTE:
Ethernet, SNMP and remote control:
EMC
Complies with:
Safety
Certified to:
Environment
Operating Temperature:
Storage Temperature:
Humidity:
General
Front indicators:
Finish:
Dimensions:
Weight:
Mains voltage:
Power supply function:
Fan:
Power consumption:
Backup Battery Life:
Warranty, Parts and labor:
IO configurations
AES balanced
Number of audio channels:
Connectors:
Formats:
Word clock input:
Intrinsic interface jitter :
Digital output phase:
Input variation before sample slip:
Interface function:
AES3-id unbalanced
Number of audio channels:
Connectors:
Bypass Relay:
Formats:
Word clock input:
Intrinsic interface jitter:
Digital output phase:
Input variation before sample slip:
Interface function:
SDI
Number of audio channels:
Connectors:
Bypass Relay:
Function:
Formats supported:
Input selection:
Outputs:
Audio embed + de-embed delay:
Video delay:
Interface function:
48
Max 16 inputs, 16 outputs
4 in DB8, 2 in DB4
0.15 ms + 0.21 ms per engine @ 48 kHz, 0.07 ms
0-4 sec per audio channel
HPF/TPDF 8-24 bit and Off
DC to 23.9 kHz ± 0.01 dB @ 48 kHz
48.0 kHz, 44.1 kHz
+/- 30 ppm
42.5 to 45.5 kHz, 46.5 to 48.5 kHz
< -3 dB @ 50 Hz, < -65 dB @ 500 Hz, < -100 dB @ 1.4 kHz
< 1 dB @ 2 Hz
PC Card, 68 pin type 1 cards
PCMCIA 2.0, JEIDA 4.0
Supports up to 2 MB SRAM
In/Out/Thru: 5 Pin DIN
Change between 2, 4 or 8 presets
Custom MIDI In & Out
Input for timed program changes
10/100 Mbits/s, Base-T
EN 55103-1 and EN 55103-2, FCC part 15 class B, CISPR 22 class B
IEC 60065, EN 60065, UL 6500 and CSA E65
32° F to 122° F (0° C to 50° C)
-22° F to 167° F (-30° C to 70° C)
Max. 90 % non-condensing
PSU 1 OK, PSU 2 OK, Remote Communication
Natural color anodized aluminum face plate. Painted and plated steel chassis
19 x 3.5 x 12 inches (483 x 89 x 305 mm), 2 RU
19 lbs. (8,6 kg)
100 to 240 VAC, 50-60 Hz auto-select
Dual Power Supply Redundancy
Dual Fan Redundancy
25 to 50 W typ., 60 W max, depending on I/O configuration
>10 years
1 year
8 channel In, 8 channel Out
SUB-D, 25 pole, 110 Ohm, AES/EBU in/out
AES/EBU (24 bit)
BNC, 75 Ohm or Hi-Z, 0.6 to 10 Vpp
< 1 ns peak, BW : 700 Hz to 100 kHz
Less than 3% of sample period
+27 % / -73 % of sample period
Synchronous, bit transparent
8 channel In, 8 channel Out
BNC, 75 Ohm, 0.1 to 10 Vpp, AES3-id in/out
Inputs to outputs while powered off and during boot-up
AES/EBU (24 bit)
BNC, 75 Ohm or Hi-Z, 0.6 to 10 Vpp
< 1 ns peak, BW : 700 Hz to 100 kHz
< 3 % of sample period
+27 % / -73 % of sample period
Synchronous, bit transparent
8 channel In, 8 channel Out
2 BNC In, 2 BNC Out. 75 Ohm
Input B to output while powered off and during boot-up
Audio de-embed/embed, video thru
SD and HD. 143 - 1485 MHz
Input 1 or 2, SDI group 1-4
2 is a replicate of 1. Outputs are individually buffered.
1.77 ms @ SD, 0.83 ms @ HD
22.3 us @ SD, 15.4us @ HD
Synchronous, bit transparent video and audio