HP Integrity BL860c i4 Instructions Manual page 3

2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Torx Driver
Phillips screw driver
Flat-head screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Power off the server, and remove it from the enclosure before continuing
2. Remove BladeLink assembly from the front of the Blade, if attached.
3. Remove panels from the Blade by either Torx or screwdriver.
4. Server Battery – locate battery and remove by hand or small flat blade screw driver. See visual below.
5. Supercap Pack (if applicable) – locate capacitor and pry from the printed circuit board with a large flat head screw
driver. See visual below.
6. Printed Circuit Boards – follow removal instructions found in the system specific documentation if needed. Some details
below.
7.
8.
9.
10.
11.
12.
13.
14.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Tool Size (if
applicable)
T10
T15
T20
T25
T27
T30
#0
#1
#2
#3
1/8"
5/32"
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