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HP Integrity BL860c i4 Instructions Manual
HP Integrity BL860c i4 Instructions Manual

HP Integrity BL860c i4 Instructions Manual

Server blades
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Product End-of-Life Disassembly Instr uctions
Product Category: Servers
Marketing Name / Model
[List multiple models if applicable.]
HP Integrity BL860c i4 Server Blades
HP Integrity BL870c i4 Server Blades
HP Integrity BL890c i4 Server Blades
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
Server unit is configurable and may contain some of
the following assemblies:
AM377-60001 PCA, BL8x0c i4 System Board
AD399-2134A CPU Socket Airflow baffle
AM377-60002 PCA, BL1
AM377-60003 PCA, BL2
AM377-60010 PCA, BL2EM
AM377-60011 PCA, BL2ES
AM377-60006 PCA, BL4M
AM377-60007 PCA, BL4S
AM377-60033 PCA, Upgrade BL2
AM377-60036 PCA, Upgrade BL4M
AD399-60009 PCA, SAS BackPlane
AM377-60013 PCA, ICH w/TPM
AD399-60013 PCA, ICH-WITHOUT TPM
AT085-2022A HP BL8x0c i4 Itanium 9560 8c Proc
AT085-2021A HP BL8x0c i4 Itanium 9540 8c Proc
AT085-2020A HP BL8x0c i4 Itanium 9550 4c Proc
AT085-2019A HP BL8x0c i4 Itanium 9520 4c Proc
AT085-2026A HP BL8x0c i4 Itanium 9560 8c Proc
AT085-2025A HP BL8x0c i4 Itanium 9540 8c Proc
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
Up to 137
(when fully
loaded)
Page 1

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Summary of Contents for HP Integrity BL860c i4

  • Page 1 Product Category: Servers Marketing Name / Model [List multiple models if applicable.] HP Integrity BL860c i4 Server Blades HP Integrity BL870c i4 Server Blades HP Integrity BL890c i4 Server Blades Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 AT085-2024A HP BL8x0c i4 Itanium 9550 4c Proc AT085-2023A HP BL8x0c i4 Itanium 9520 4c Proc 605312-371 DIMM,4GB PC3L-10600R,512Mx4 605313-371 DIMM,8GB PC3L-10600R,512Mx4 628974-381 DIMM,16GB PC3L-10600R,1Gx4 507129-009 HP 146GB 6G SAS 15K 2.5in DP HDD 507129-003 HP 300GB 6G SAS 10K 2.5in DP HDD 507129-019 HP 300GB 6G SAS 15K 2.5in DP HDD 507129-011 HP 450GB 6G SAS 10K 2.5in DP HDD 507129-013 HP 600GB 6G SAS 10K 2.5in DP HDD...
  • Page 3 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Torx Driver Phillips screw driver 1/8"...
  • Page 4 WARNING! Before proceeding with Disassembling a Blade that requires Physical contact with electrical or electronic components, ensure that power is removed or safety precautions are followed to prevent electric shock and equipment damage. Observe all warning and caution labels on equipment. CAUTION: Electrostatic discharge can damage electronic components.
  • Page 5 • Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water. • Replace only with the spare designated for this product. Server battery Supercap Pack (if applicable) DIMM baffle EL-MF877-00 Page 5 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 6 DIMMs 1. Open the DIMM slot latches. 2. Remove the DIMM from the slot. EL-MF877-00 Page 6 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 7: Processor And Heatsink Module

    Processor Baffle Processor and heatsink module Rotate the processor locking handle up and back until it reaches a hard stop (see 2 below). WRNING! The heatsink locking lever can constitute a pinch hazard; keep your hands on top of the lever during installation to avoid personal injury.
  • Page 8: Removing A Disk Drive Blank

    3. Lift the processor and heatsink off of the socket, pulling straight up. Removing a disk drive blank Remove the component as indicated: Removing a disk drive 1. Press the release button. 2. Open the ejector lever. 3. Slide the disk drive out of the drive cage. EL-MF877-00 Page 8 Template Revision B...
  • Page 9: Sas Backplane

    SAS backplane 1. Remove the disk drives or disk drive blanks (“Removing a disk drive” “Removing a disk drive blank”). 2. Lift the SAS back plane straight out of the server by the backplane handle. Mezzanine card EL-MF877-00 Page 9 Template Revision B PSG instructions for this template are available at EL-MF877-01...
  • Page 10 For more details on removing components, see HP Integrity BL860c i4, BL870c i4 & BL890c i4 Server Blade User Service Guide. EL-MF877-00 Page 10 Template Revision B PSG instructions for this template are available at EL-MF877-01...

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Integrity bl870c i4Integrity bl890c i4