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THS4012 Dual High Speed Operational Amplifier Evaluation Module User’s Guide May 1999 Mixed-Signal Products SLOU041...
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IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current.
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Related Documentation From Texas Instruments THS4012 DUAL LOW-NOISE HIGH-SPEED OPERATIONAL AMPLIFIER (literature number SLOS216) This is the data sheet for the THS4012 operational amplifier integrated circuit that is used in the THS4012 evaluation module. FCC Warning This equipment is intended for use in a laboratory test environment only. It...
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Chapter 1 General This chapter details the Texas Instruments (TI ) THS4012 dual high-speed operational amplifier evaluation module (EVM), SLOP230. It includes a list of EVM features, a brief description of the module illustrated with a pictorial and a schematic diagram, EVM specifications, details on connecting and using the EVM, and discussions on high-speed amplifier design and thermal considerations.
Feature Highlights 1.1 Feature Highlights THS4012 Dual High-Speed Operational Amplifier EVM features include: High Bandwidth — 75 MHz, –3 dB at 15 V and Gain = 2 5-V to 15-V Operation Noninverting Single-Ended Inputs — Inverting-Capable Through Component Change Module Gain Set to 2 (Noninverting) — Adjustable Through Compo-...
The TI THS4012 dual high-speed operational amplifier evaluation module (EVM) is a complete dual high-speed amplifier circuit. It consists of the TI THS4012 dual low-noise high-speed operational amplifier IC, along with a small number of passive parts, mounted on a small circuit board measuring approximately 1.9 inch by 2.2 inch (Figure 1–1).
THS4012 EVM Noninverting Operation 1.3 THS4012 EVM Noninverting Operation The THS4012 EVM is shipped preconfigured for dual-channel noninverting operation, as shown in Figure 1–2. Note that compensation capacitors C3 and C6 are not installed. Figure 1–2. THS4012 EVM Schematic — Noninverting Operation –VCC...
THS4012 EVM Noninverting Operation Any of the resistors on the EVM board can be replaced with a resistor of a different value; however, care must be taken because the surface-mount solder pads on the board are somewhat fragile and will not survive many desoldering/soldering operations.
7) Verify the output signal on the oscilloscope. ½ The signal shown on an oscilloscope with a 50- input impedance will be the actual THS4012 amplifier IC output voltage. This is due to the voltage division between the output resistor (R7, R15) and the oscilloscope input impedance.
THS4012 EVM Inverting Operation 1.5 THS4012 EVM Inverting Operation Although the THS4012 EVM is shipped preconfigured for dual-channel noninverting operation, it can be reconfigured for inverting operation by making the following component changes: 1) Move resistor R3 to the R2 location and R5 to the R4 location on the board.
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THS4012 EVM Inverting Operation The gain of the EVM can easily be changed to support a particular application by changing the ratio of resistors R6 and R4 (channel 1) and R14 and R12 (channel 2) as described in the following equation: –R...
6) Connect the signal input to the module SMA input connector (J1/J2) . Each EVM input connector is terminated with an equivalent 50- impedance to ground. With a 50- source impedance, the voltage seen by the THS4012 ½ amplifier IC on the module will be the source signal voltage applied to the EVM.
This configuration (noninverting) is shown in Figure 1–4. For a noninverting differential input, R8 should be 100 to match 50- source impedances. Note that compensation capacitors C3 and C6 are not installed. Figure 1–4. THS4012 EVM Schematic — Differential Input (Noninverting Operation) –VCC –VCC +VCC +VCC 6.8 F...
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1.7.2 Differential Input, Inverting Operation Configure the THS4012 EVM for differential inverting operation by removing two resistors and adding a resistor on the board: 1) Move resistor R3 to the R2 location and R5 to the R4 location on the board.
THS4012 EVM Differential Input Figure 1–5. THS4012 EVM Schematic — Differential Input (Inverting Operation) –VCC –VCC +VCC +VCC 6.8 F 6.8 F +VCC 0.1 F U1:A Vin1 – THS4012 49.9 Vout1 0.1 F –VCC U1:B Vin2 – THS4012 49.9 Vout2...
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THS4012 EVM Differential Input Any resistor on the EVM board can be replaced with a resistor of a different value; however, care must be taken because the surface-mount solder pads on the board are somewhat fragile and will not survive many desoldering/soldering operations.
7) Verify the differential output signal on the oscilloscope. ¼ The signal shown on an oscilloscope with a 50- input impedance will be the actual THS4012 amplifier IC output voltage. This is due to the voltage division between the output resistors (R7, R15) and the oscilloscope input impedance.
500M f – Frequency – Hz Figure 1–7 shows the typical phase response of the THS4012 EVM using the noninverting configuration (G = 2). This shows a 75 phase margin for both 15-V and 5-V power supplies on both channels.
General High-Speed Amplifier Design Considerations 1.11 General High-Speed Amplifier Design Considerations The THS4012 EVM layout has been designed and optimized for use with high-speed signals and can be used as an example when designing THS4012 applications. Careful attention has been given to component selection, grounding, power supply bypassing, and signal path layout.
PCB. Although there are many ways to properly heatsink this device, the following steps illustrate the recommended approach as used on the THS4012 EVM. 1) Prepare the PCB with a top side etch pattern as shown in Figure 1–8.
–20 T A – Free-Air Temperature – C Even though the THS4012 EVM PCB is smaller than the one in the example above, the results should give an idea of how much power can be dissipated by the PowerPAD IC package. The THS4012 EVM is a good example of proper thermal management when using PowerPAD-mounted devices.
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Correct PCB layout and manufacturing techniques are critical for achieving adequate transfer of heat away from the PowerPAD IC package. More details on proper board layout can be found in the THS4012 Low-noise Dual Differential Receiver data sheet (SLOS216). For more general information on...
THS4012 EVM Complete Schematic 2.1 THS4012 EVM Complete Schematic Figure 2–1 shows the complete THS4012 EVM schematic. The EVM is shipped preconfigured for dual-channel, single-ended inverting operation. Components showing a value of X are not supplied on the board, but can be installed by the user to reconfigure the EVM for noninverting and/or differential operation.
THS4012 EVM Board Layouts 2.3 THS4012 EVM Board Layouts Board layout examples of the THS4012 EVM PCB are shown in the following illustrations. They are not to scale and appear here only as a reference. Figure 2–2. THS4012 EVM Component Placement Silkscreen and Solder Pads –VCC...
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