TYAN Thunder K8W S2885 User Manual page 17

The back-plate assembly prevents excessive motherboard flexing in the area
near the processor and provides a retention bracket for the heatsink.
Because there are many different types of heatsinks available from many
different manufacturers, many have their own method of installation. For the
safest method of installation and information on choosing the appropriate
heatsink, consult the recommended list at
The following diagram will illustrate how to install back-plate and retention
frame:
Thermal Interface Material
Aways check with the manufacturer of the heatsink & processor to
NOTE
ensure the Thermal Interface material is compatible with the
processor & meets the manufacturer's warranty requirements
www.amd.com
(1) Mounting screws
(2) Retention frame
(3) CPU socket
(4) Motherboard PCB
(5) Adhesive insulator material
(6) Back-plate assembly
NOTE: Please see next section for specific instructions on
how to install mounting bracket.
There are two types of thermal interface materials
designed for use with the AMD Opteron processor.
The most common material comes as a small pad
attached to the heatsink at the time of purchase.
There should be a protective cover over the material.
Take care not to touch this material.
Simply remove the protective cover and place the
heatsink on the processor.
The sec ond type of interface material is usually
packaged separately. It is commonly referred to as
'thermal compound' or 'thermal grease'. Apply a thin,
even layer on to the CPU lid (applying too much will
reduce the effectiveness).
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