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Philips Semiconductors
16. Package outline
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
y
Z
24
pin 1 index
1
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
max.
0.21
mm
2
0.05
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
OUTLINE
VERSION
SOT340-1
Fig 12. Package outline.
9397 750 13022
Preliminary data sheet
D
e
A
A
b
c
2
3
p
1.80
0.38
0.20
0.25
1.65
0.25
0.09
REFERENCES
IEC
JEDEC
MO-150
Integrated FM stereo radio IC for host processor tuning
c
13
A
2
12
w
M
b
p
0
2.5
scale
(1)
(1)
D
E
e
H
E
8.4
5.4
7.9
0.65
8.0
5.2
7.6
JEITA
Rev. 02 — 26 April 2004
E
H
E
Q
(A )
A
1
L
p
L
detail X
5 mm
L
L
Q
v
p
1.03
0.9
1.25
0.2
0.63
0.7
EUROPEAN
PROJECTION
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
TEA5880TS
SOT340-1
A
X
v
A
M
A
3
(1)
w
y
Z
o
0.8
8
0.13
0.1
o
0.4
0
ISSUE DATE
99-12-27
03-02-19
21 of 27
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