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Related Manuals for Ampro COM 830
Summary of Contents for Ampro COM 830
- Page 1 COM 830 (Computer-On-Module) Reference Manual P/N 5001829A Revision A...
- Page 2 Notice Page NOTICE No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual, or otherwise, without the prior written permission of Ampro Computers, Incorporated.
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Page 3: Table Of Contents
Contents Chapter 1 About This Manual ....................1 Symbols ............................1 Warning ..........................1 Caution ..........................1 Note ............................1 Terminology .............................1 Warranty ............................1 COM Express™ Concept.........................2 Certification ............................3 Technical Support ..........................3 Lead-Free Designs (RoHS) ......................3 Electrostatic Sensitive Device ......................3 COM 830 Options Information ......................3 Chapter 2 Specifications......................5 Feature List ............................5... - Page 4 Contents Secondary Connector Rows C and D ..................15 PCI Express Graphics (PEG) ....................15 SDVO ............................15 PCI Bus ............................ 15 IDE ............................15 Additional Features ........................15 Watchdog ..........................15 Onboard Microcontroller......................16 Embedded BIOS ........................16 Simplified Overview of BIOS Setup Data Backup ..............17 Security Features ..........................
- Page 5 Contents Chapter 4 BIOS Setup Description..................53 Entering the BIOS Setup Program....................53 Boot Selection Popup .......................53 Manufacturer Default Settings ....................53 Setup Menu and Navigation......................53 Main Setup Screen ........................54 Advanced Setup..........................55 ACPI Configuration Submenu....................56 Win XP Watchdog ACPI Event restart configuration ..............57 PCI Configuration Submenu .....................57 PCI IRQ Resource Exclusion Submenu ................58 PCI Interrupt Routing Submenu ..................58...
- Page 6 Contents List of Tables Table 1-1. Definitions of Terms ....................1 Table 1-2. COM Express Pinout Types ..................2 Table 1-3. COM 830 Configuration Matrix ................3 Table 2-1. Feature Summary....................5 Table 2-2. Dual Connector Pinout Limitations ................7 Table 2-3.
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Page 7: Chapter 1 About This Manual
Chapter 1 About This Manual This manual provides information about the components, features, connectors and BIOS Setup menus available on the COM 830. Symbols The following symbols are used in this manual: Warning Warnings indicate conditions that, if not observed, can cause personal injury. Caution Cautions warn the user about how to prevent damage to hardware or loss of data. -
Page 8: Com Express™ Concept
Chapter 1 About This Manual Beginning on the date of shipment to its direct customer and continuing for the published warranty period, Ampro represents that the products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or due to non conformance to the agreed upon specifications, will be repaired or exchanged, at Ampro's option and expense. -
Page 9: Certification
Chapter 1 About This Manual Carrier board designers can utilize as little or as many of the I/O interfaces as necessary. The carrier board can therefore provide all the interface connectors required to attach the system to the application specific peripherals. - Page 10 Chapter 1 About This Manual Reference Manual COM 830...
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Page 11: Chapter 2 Specifications
Chapter 2 Specifications Feature List Table 2-1. Feature Summary Based on COM Express™ standard pinout Type 2 (Basic size 95 x 125mm) Form Factor Intel® Core™ Duo U2500 ULV 1.2GHz, with 2-MByte L2 cache ULV (Ultra Processor Low Voltage) Intel® Celeron M 423 ULV 1.07GHz, with 1-MByte L2 cache (Ultra Low Voltage) 2 sockets: SO-DIMM DDR2 667 up to 4-GByte physical memory. -
Page 12: Usable Memory
Chapter 2 Specifications Table 2-1. Feature Summary (Continued) ® Based on AMIBIOS8 -1MByte Flash BIOS with Embedded BIOS features. BIOS ACPI 2.0 compliant with battery support. Also supports Suspend to RAM (S3). Power Management NOTE Some of the features mentioned in the above Feature Summary are optional. Check the article number of your module and compare it to the option information listed in Tables 2-3... -
Page 13: Electrostatic Sensitive Device
Chapter 2 Specifications Electrostatic Sensitive Device All COM 830 variants are electrostatic sensitive devices. Do not handle the COM 830, or processor, except at an electrostatic-free workstation. Failure to do so may cause damage to the module and/or processor and void the manufacturer’s warranty. -
Page 14: Processor Information
Chapter 2 Specifications Windows XP Professional Standby Mode (requires setup node “Suspend Mode” in the BIOS to be configured to S1 POS [Power On Suspend]) Suspend to RAM (requires setup node “Suspend Mode” in BIOS to be configured to S3 STR [suspend to RAM]) NOTE The PassMark, Burn-In Test-Suite was used to stress the CPU to 100% workload. -
Page 15: Environmental Specifications
Chapter 2 Specifications ® Table 2-4. COM 830 Intel Celeron M 423 1.07GHz 1MB L2 cache COM 830-R-10 Intel ® Celeron M 423 1.06GHz 1MB L2 cache ULV 65nm 512MB Memory Size Windows XP Professional SP2 Operating System Power State Desktop Idle 100% Standby (S1) -
Page 16: Block Diagram
Chapter 2 Specifications Block Diagram Composite Video Component Video TV-Out PCI Express Graphics x16 S-Video GMCH 2x SDVO Intel 82945GM LCD I/F (LVDS) DDR2-SODIMM Socket (top) Memory Bus (533 or 667MHz) SM Bus DDR2-SODIMM Socket (bottom) AC’97 Digital Audio / HDA Interface PCI Bus 8x USB 2.0 1x IDE... -
Page 17: Heatspreader
Chapter 2 Specifications Heatspreader An important factor for each system integration is the thermal design. The heatspreader acts as a thermal coupling device to the module. It is a 3mm thick aluminum plate. The heatspreader is thermally coupled to the CPU via a thermal gap filler and on some modules it may also be thermally coupled to other heat generating components with the use of additional thermal gap fillers. -
Page 18: Heatspreader Dimensions
Chapter 2 Specifications Heatspreader Dimensions Heatspreader is available for all variants of COM 830. NOTE All measurements are in millimeters. Torque specification for heatspreader screws is 0.5 Reference Manual COM 830... -
Page 19: Connector Subsystems Rows A, B, C, D
Chapter 2 Specifications Connector Subsystems Rows A, B, C, D The COM 830 is connected to the carrier board via two 220-pin connectors (COM Express Type 2 pinout) for a total of 440 pins connectivity. These connectors are broken down into four rows. The primary connector consists of rows A and B while the secondary connector consists of rows C and D. -
Page 20: Pci Express
Chapter 2 Specifications PCI Express™ The COM 830 offers 6x x1 PCI Express lanes via the Intel 82801GHM (ICH7M-DH), which can be configured to support PCI Express edge cards or ExpressCards. One of the six x1 PCI Express lane is utilized by the onboard Ethernet controller therefore there are only 5x x1 PCI Express lanes available on the A,B connector row. -
Page 21: Power Supply Implementation Guidelines
Chapter 2 Specifications Power Supply Implementation Guidelines 12 volt input power is the sole operational power source for the COM 830. The remaining necessary voltages are internally generated on the module using onboard voltage regulators. A baseboard designer should be aware of the following important information when designing a power supply for a COM 830 application: It has also been noticed that on some occasions problems occur when using a 12V power supply that produces non monotonic voltage when powered up. -
Page 22: Onboard Microcontroller
Chapter 2 Specifications Onboard Microcontroller The COM 830 is equipped with an ATMEL Atmega168 microcontroller. This onboard microcontroller plays an important role for most of the BIOS features. It fully isolates some of the embedded features such as system monitoring or the I²C bus from the x86 core architecture, which results in higher embedded feature performance and more reliability, even when the x86 processor is in a low power mode. -
Page 23: Simplified Overview Of Bios Setup Data Backup
Chapter 2 Specifications Simplified Overview of BIOS Setup Data Backup Ampro Ampro The above diagram provides an overview of how the BIOS Setup Data is backed up on modules. OEM default values mentioned above refer to customer specific CMOS settings created using the System Utility tool. -
Page 24: Security Features
Chapter 2 Specifications Security Features The COM 830 can be equipped optionally with a “Trusted Platform Module” (TPM 1.2). This TPM 1.2 includes co-processors to calculate efficient hash and RSA algorithms with key lengths up to 2,048 bits as well as a real random number generator. Security sensitive applications like gaming and e-commerce will benefit also with improved authentication, integrity and confidence levels. -
Page 25: Native Vs. Compatible Ide Mode
Chapter 2 Specifications Native vs. Compatible IDE mode Compatible Mode When operating in compatible mode, the SATA and PATA (Parallel ATA) controller together need two legacy IRQs (14 and 15) and are unable to share these IRQs with other devices. This is a result of the fact that the SATA and PATA controller emulate legacy IDE controllers. -
Page 26: Processor Performance Control
Chapter 2 Specifications any damage to the processor as a result of overheating. The THERMTRIP# signal activation is completely independent from processor activity and therefore does not produce any bus cycles. NOTE In order for THERMTRIP# to be able to automatically switch off the system it is necessary to use an ATX style power supply. -
Page 27: Intel® Virtualization Technology
Chapter 2 Specifications 64-bit Mode: 64-bit operating system and 64-bit applications. This usage requires 64-bit device drivers. It also requires applications to be modified for 64-bit operation and then recompiled and validated. Intel 64 provides support for: 64-bit flat virtual address space 64-bit pointers 64-bit wide general purpose registers 64-bit integer support... -
Page 28: Active Cooling
Chapter 2 Specifications Active Cooling During this cooling policy the operating system is turning the fan on/off. Although active cooling devices consume power and produce noise, they also have the ability to cool the thermal zone without having to reduce the overall system performance. Use the “active cooling trip point” setup node in the BIOS setup program to determine the temperature threshold that the operating system will use to start the active cooling device. - Page 29 Chapter 2 Specifications GPI2# Set GPE2 Function node to Sleep Button in the ACPI setup menu or set Resume On Ring to Enabled in the Power setup menu. Onboard LAN Event Device driver must be configured for Wake On LAN support. SMBALERT# Wakes unconditionally from S1-S5.
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Page 30: Usb 2.0 Ehci Host Controller Support
Chapter 2 Specifications USB 2.0 EHCI Host Controller Support The 8 USB ports are shared between an EHCI host controller and the 4 UHCI host controllers. Within the EHC functionality there is a port-routing logic that executes the mixing between the two different types of host controllers (EHCI and UHCI). -
Page 31: Chapter 3 Signals And Pinout Tables
Chapter 3 Signals and Pinout Tables The following section describes the signals found on COM Express™ Type II connectors used for Ampro modules. The table below describes the terminology used in this section for the Signal Description tables. The PU/PD column indicates if a COM Express internal pull-up or pull-down resistor has been used. -
Page 32: A-B Connector Signal Descriptions
Chapter 3 Signals and Pinout Tables A-B Connector Signal Descriptions ® Table 3-2. AC'97/Intel High Definition Audio Link Signals Descriptions PU/PD Comment Signal Description AC_RST# AC ’97/Intel High Definition Audio Reset: This O 3.3V signal is the master hardware reset to external codec(s). AC_SYN AC ’97/Intel High Definition Audio Sync: This signal O 3.3V... -
Page 33: Table 3-3. Gigabit Ethernet Signal Descriptions
Chapter 3 Signals and Pinout Tables AC_SYNC and AC_SDOUT can be used to switch PCI Express channels 1-4 between x1 and x4 mode. If both signals are each pulled-up (using 1k resistors) to 3.3V at the rising edge of PWROK then x4 mode is enabled. -
Page 34: Table 3-5. Pci Express Signal Descriptions [General Purpose]
Chapter 3 Signals and Pinout Tables Table 3-4. Serial ATA Signal Descriptions (Continued) SATA2_RX+ Serial ATA channel 2, Receive Input I SATA Not supported SATA2_RX- differential pair. SATA2_TX+ Serial ATA channel 2, Transmit O SATA Not supported SATA2_TX- Output differential pair. SATA3_RX+ Serial ATA channel 3, Receive Input I SATA... -
Page 35: Table 3-6. Expresscard Support Pins Descriptions
Chapter 3 Signals and Pinout Tables Table 3-5. PCI Express Signal Descriptions [general purpose] (Continued) PCIE3_TX+ PCI Express channel 4, Transmit Output Supports PCI PCIE3_TX- differential pair PCIE Express Base Specification, Revision 1.0a PCIE4_RX+ PCI Express channel 5, Receive Input Supports PCI PCIE4_RX- differential pair... -
Page 36: Table 3-8. Usb Signal Descriptions
Chapter 3 Signals and Pinout Tables Table 3-8. USB Signal Descriptions Signal Description PU/PD Comment USB0+ USB Port 0, data + or D+ USB 2.0 compliant and backwards compatible to USB 1.1 USB0- USB Port 0, data - or D- USB 2.0 compliant and backwards compatible to USB 1.1... -
Page 37: Table 3-9. Crt Signal Descriptions
Chapter 3 Signals and Pinout Tables Table 3-8. USB Signal Descriptions (Continued) USB7- USB Port 7, data - or D- USB 2.0 compliant and backwards compatible to USB 1.1 USB_0_1_OC# USB over-current sense, PU 10k USB ports 0 and 1. A pull- 3.3VSB 3.3VSB up for this line shall be... -
Page 38: Table 3-10. Lvds Signal Descriptions
Chapter 3 Signals and Pinout Tables Table 3-9. CRT Signal Descriptions (Continued) VGA_BLU Blue for monitor. Analog DAC output, PD 150R Analog output designed to drive a 37.5-Ohm equivalent load. Analog VGA_HSYN Horizontal sync output to VGA monitor O 3.3V VGA_VSYN Vertical sync output to VGA monitor O 3.3V... -
Page 39: Table 3-12. Miscellaneous Signal Descriptions
Chapter 3 Signals and Pinout Tables Table 3-11. TV-Out Signal Descriptions (Continued) TV_DAC_B TVDAC Channel B Output supports the PD 150R Analog following: Composite video: not used output Analog Component video: Luminance (Y) analog signal. S-Video: Luminance analog signal. TV_DAC_C TVDAC Channel C Output supports the PD 150R Analog... -
Page 40: Table 3-13. General Purpose I/O Signal Descriptions
Chapter 3 Signals and Pinout Tables Table 3-13. General Purpose I/O Signal Descriptions Signal Description PU/PD Commen GPO[0] General purpose output pins. Upon a O 3.3VSB PU 10k hardware reset, these outputs should 3.3VSB be low. GPO[1] General purpose output pins. Upon a O 3.3VSB PU 10k hardware reset, these outputs should... -
Page 41: Table 3-15. Power And Gnd Signal Descriptions
Chapter 3 Signals and Pinout Tables Table 3-14. Power and System Management Signal Descriptions (Continued) SUS_S3# Indicates system is in Suspend to RAM state. O 3.3VSB PU 10k Active low output. Also known as "PS_ON" 3.3VSB and can be used to control an ATX power supply. -
Page 42: A-B Connector Pinout
Chapter 3 Signals and Pinout Tables Table 3-15. Power and GND Signal Descriptions VCC_RTC Real-time clock circuit-power input. Nominally +3.0V. Ground - DC power and signal and AC signal return path. All available GND connector pins shall be used and tied to Carrier Board GND plane. A-B Connector Pinout Table 3-16. - Page 43 Chapter 3 Signals and Pinout Tables Table 3-16. Connector A-B Pinout (Continued) SATA0_RX- SATA1_RX- LVDS_A2+ LVDS_B2+ GND (FIXED) GND (FIXED) LVDS_A2- LVDS_B2- SATA2_TX+ (*) SATA3_TX+ (*) LVDS_VDD_ LVDS_B3+ SATA2_TX- (*) SATA3_TX- (*) LVDS_A3+ LVDS_B3- SUS_S5# PWR_OK LVDS_A3- LVDS_BKL T_EN SATA2_RX+(*) SATA3_RX+ (*) GND (FIXED) (FIXED)
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Page 44: C-D Connector Signal Descriptions
Chapter 3 Signals and Pinout Tables Table 3-16. Connector A-B Pinout (Continued) USB2+ USB3+ VCC_12V TV_DAC_ USB_2_3_OC# USB_0_1_OC# VCC_12V TV_DAC_ USB0- USB1- GND (FIXED) (FIXED) USB0+ USB1+ VCC_12V VCC_12V VCC_RTC EXCD1_PERST# VCC_12V VCC_12V EXCD0_PERST# EXCD1_CPPE# VCC_12V VCC_12V EXCD0_CPPE# SYS_RESET# VCC_12V VCC_12V LPC_SERIRQ CB_RESET#... -
Page 45: Table 3-18. Ide Signal Descriptions
Chapter 3 Signals and Pinout Tables Table 3-17. PCI Signal Descriptions (Continued) PCI_TRDY# PCI bus Target Ready control line, active low PU 8k2 3.3V 3.3V PCI_STOP# PCI bus STOP control line, active low, driven PU 8k2 by cycle initiator 3.3V 3.3V PCI_PAR PCI bus parity... -
Page 46: Table 3-19. Pci Express Signal Descriptions (X16 Graphics)
Chapter 3 Signals and Pinout Tables Table 3-18. IDE Signal Descriptions (Continued) IDE_IOR# I/O read line to IDE device. O 3.3V IDE_REQ IDE Device DMA Request. It is asserted by the I 3.3V IDE device to request a data transfer. IDE_ACK# IDE Device DMA Acknowledge. -
Page 47: Table 3-20. Sdvo Signal Descriptions
Chapter 3 Signals and Pinout Tables Table 3-20. SDVO Signal Descriptions Signal Description PU/PD Comment SDVOB_RED+ Serial Digital Video B red output O PCIE SDVOB_RED- differential pair Multiplexed with PEG_TX[0]+ and PEG_TX[0]- pair SDVOB_GRN+ Serial Digital Video B green output O PCIE SDVOB_GRN- differential pair Multiplexed with... -
Page 48: Table 3-21. Module Type Definition Signal Description
Chapter 3 Signals and Pinout Tables NOTE Some signals have special functionality during the reset process. They may bootstrap some basic important functions of the module. Table 3-21. Module Type Definition Signal Description Signal Description Comment TYPE[ The TYPE pins indicate to the Carrier Board the Pin-out Type that is PDS TYPE[0:2]# 0:2]# implemented on the module. -
Page 49: C-D Connector Pinout
Chapter 3 Signals and Pinout Tables C-D Connector Pinout Table 3-23. Connector C-D Pinout Row C Row D Row C Row D GND (FIXED) GND (FIXED) PEG_RX1- PEG_TX1- IDE_D7 IDE_D5 TYPE1# TYPE2# IDE_D6 IDE_D10 PEG_RX2+ PEG_TX2+ IDE_D3 IDE_D11 PEG_RX2- PEG_TX2- IDE_D15 IDE_D12 GND (FIXED) - Page 50 Chapter 3 Signals and Pinout Tables Table 3-23. Connector C-D Pinout (Continued) PCI_DEVSEL# PCI_FRAME# PEG_RX12+ PEG_TX12+ PCI_IRDY# PCI_AD16 PEG_RX12- PEG_TX12- PCI_C/BE2# PCI_AD18 PCI_AD17 PCI_AD20 PEG_RX13+ PEG_TX13+ PCI_AD19 PCI_AD22 PEG_RX13- PEG_TX13- GND (FIXED) GND (FIXED) PCI_AD21 PCI_AD24 RSVD PEG_ENABL PCI_AD23 PCI_AD26 PEG_RX14+ PEG_TX14+ PCI_C/BE3#...
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Page 51: Boot Strap Signals
Chapter 3 Signals and Pinout Tables Boot Strap Signals Table 3-24. Boot Strap Signal Descriptions Signal Description of Boot Strap Signal PU/PD Comment AC_SYNC O 3.3V AC_SYNC is ® AC ’97/Intel High Definition a boot strap Audio Sync: This signal is a 48 kHz signal (see fixed rate sample sync to the caution... -
Page 52: System Resources
Chapter 3 Signals and Pinout Tables CAUTION The signals listed in the table above are used as chipset configuration straps during system reset. In this condition (during reset), they are inputs that are pulled to the correct state by either COM Express internally implemented resistors or chipset internally implemented resistors that are located on the module. -
Page 53: Lpc Bus
Chapter 3 Signals and Pinout Tables Table 3-26. I/O Address Assignment I/O Address (hex) Size Available Description 0000 - 00FF 256 bytes Motherboard resources 0100 - 010F 16 bytes Ampro System Control 0170 - 0177 8 bytes Secondary IDE channel 01F0 - 01F7 8 bytes Primary IDE channels... -
Page 54: Interrupt Request (Irq) Lines
Chapter 3 Signals and Pinout Tables Interrupt Request (IRQ) Lines Table 3-27. IRQ Lines in PIC mode IRQ# Available Typical Interrupt Source Connected to Pin Counter 0 Not applicable Keyboard Not applicable Cascade Interrupt from Slave PIC Not applicable IRQ3 via SERIRQ or PCI BUS INTx IRQ4 via SERIRQ or PCI BUS INTx IRQ5 via SERIRQ or PCI BUS INTx IRQ6 via SERIRQ or PCI BUS INTx... -
Page 55: Pci Configuration Space Map
Chapter 3 Signals and Pinout Tables Table 3-28. IRQ Lines in APIC mode (Continued) Note 2 Generic IRQ9 via SERIRQ, option for SCI IRQ10 via SERIRQ IRQ11 via SERIRQ IRQ12 via SERIRQ Math processor Not applicable Note 1 IDE Controller 0 (IDE0) / IRQ14 Generic Note 1... - Page 56 Chapter 3 Signals and Pinout Tables Table 3-29. PCI Configuration Space Map (Continued) N.A. VGA Graphics Internal Intel High Definition Audio Controller (Azalia) 00h (see Internal PCI Express Root Port Note) 00h (see Internal PCI Express Root Port Note) 00h (see Internal PCI Express Root Port Note)
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Page 57: Pci Interrupt Routing Map
Chapter 3 Signals and Pinout Tables Table 3-29. PCI Configuration Space Map (Continued) 04h (see Internal PCI Express Port 3 Note) 05h (see Internal PCI Express Port 4 Note) 06h (see Internal Onboard Gigabit LAN Note) Controller 07h (see INTA-INTD PCI Bus Slot 1 Note) 07h (see... -
Page 58: Pci Bus Masters
Chapter 3 Signals and Pinout Tables Table 3-31. PCI Interrupt Routing Map (continued) Table 3-32. PIRQ SATA PCI- PCI- PCI- PCI- PCI- PCI- Native Root Root Root Root Root Root Port Port Port Port Port Port Port Port x ² x ²... -
Page 59: Chapter 4 Bios Setup Description
Chapter 4 BIOS Setup Description The following section describes the BIOS setup program. The BIOS setup program can be used to view and change the BIOS settings for the module. Only experienced users should change the default BIOS settings. Entering the BIOS Setup Program. The BIOS setup program can be accessed by pressing the <DEL>... -
Page 60: Main Setup Screen
Chapter 4 BIOS Setup Description Select setup fields (e.g. in date and time). Display General Help screen. F2/F3 Change Colors of setup screen. Discard Changes. Load optimal default settings. Save changes and exit setup. Discard changes and exit setup. ENTER Display options of a particular setup item or enter submenu. -
Page 61: Advanced Setup
Chapter 4 BIOS Setup Description Advanced Setup Select the Advanced tab from the setup menu to enter the Advanced BIOS Setup screen. The menu is used for setting advanced features: Main Advanced Boot Security Power Exit ACPI Configuration PCI Configuration Graphics Configuration CPU Configuration Chipset Configuration... -
Page 62: Acpi Configuration Submenu
Chapter 4 BIOS Setup Description ACPI Configuration Submenu Feature Options Description ACPI Aware O/S Set this value to allow the system to utilize the Intel ACPI (Advanced Configuration and Power Interface). Set to NO for non ACPI aware operating system like DOS and Windows NT. -
Page 63: Win Xp Watchdog Acpi Event Restart Configuration
Chapter 4 BIOS Setup Description NOTE In ACPI mode it is not possible for a “Watchdog ACPI Event” handler to directly restart or shutdown the OS. For this reason the BIOS will do one of the following: For Shutdown: An over temperature notification is executed. This causes the OS to shut down in an orderly fashion. -
Page 64: Pci Irq Resource Exclusion Submenu
Chapter 4 BIOS Setup Description PCI IRQ Resource Exclusion Submenu Feature Options Description IRQ xx Available Allow or restrict the BIOS from giving IRQ resource Reserved to PCI/PNP devices. PCI Interrupt Routing Submenu Feature Options Description PIRQ xx (devices) Auto, Select fixed IRQ for PCI interrupt line or set to AUTO 3, 4, .., 14, 15 to let the BIOS and operating system route an IRQ. - Page 65 Chapter 4 BIOS Setup Description DVMT/FIXED Memory 64MB Amount of DRAM the DVMT graphics driver can or will allocate 128MB (depends on DVMT mode selected). Maximum DVMT Boot Display Device Auto Select the display device(s) used for boot up. CRT only LFP = Local Flat Panel (LVDS) SDVO only CRT + SDVO...
- Page 66 Chapter 4 BIOS Setup Description SDVO Port B Device None Select the SDVO device connected to this port. LVDS SDVO Port C Device None Select the SDVO device connected to this port. LVDS TV Standard VBIOS-Default Select TV standard that should be supported.
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Page 67: Cpu Configuration Submenu
Chapter 4 BIOS Setup Description CPU Configuration Submenu Feature Options Description Processor Info Block No option Displays the processor manufacturer, brand, frequency, and cache sizes. MPS Revision Select the revision of the multi processor support interface that should be offered by the BIOS. Set back to 1.1 in case problems occur with older non ACPI operating systems. - Page 68 Chapter 4 BIOS Setup Description C1 Enable Standard Enable standard or enhanced C1 support. Enhanced C2 Enable Disabled Disable or enable C2 support in standard or enhanced mode. Standard Enhanced C3 Enable Disabled Disable or enable C3 support in standard or enhanced mode. Standard Enhanced C4 Enable...
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Page 69: Chipset Configuration Submenu
Chapter 4 BIOS Setup Description Chipset Configuration Submenu Feature Options Description Memory Hole Disabled Enable or disable the memory hole between 15MB and 16MB. If enabled, accesses to this range are 15MB-16MB forwarded to the LPC / PCI bus. Chipset Thermal Disabled This enables or disables chipset thermal throttling. -
Page 70: I/O Interface Configuration Submenu
Chapter 4 BIOS Setup Description PCIE Port 1IOxAPIC Disabled Enable support for IOAPIC behind PCI Express port. Enable Enabled PCIE Port 2 IOxAPIC Disabled Enable support for IOAPIC behind PCI Express port. Enable Enabled PCIE Port 3 IOxAPIC Disabled Enable support for IOAPIC behind PCI Express port. Enable Enabled PCIE Port 4 IOxAPIC... -
Page 71: Sio Winbond W83627 Configuration
Chapter 4 BIOS Setup Description SIO Winbond W83627 Configuration Feature Options Description Floppy Controller Disabled Enable / Disable the W83627 floppy controller. Enabled Floppy A Disabled Select the floppy drive A type. 360 KB 5¼” 1.2 MB 5¼” 720 KB 3 ½” 1.44 MB 3 ½”... -
Page 72: Clock Configuration
Chapter 4 BIOS Setup Description Clock Configuration Feature Options Description Spread Spectrum Disabled Enable spread spectrum clock modulation to reduce EMI. Enabled IDE Configuration Submenu Feature Options Description ATA/IDE Configuration Disabled Configure the integrated parallel and serial ATA controllers. Compatible Disabled: Both controllers are disabled. - Page 73 Chapter 4 BIOS Setup Description IDE Detect Time Out 0, 5, 10, ... 30, 35 Set this option to stop the BIOS from searching for IDE devices within the specified number of seconds. Basically, this allows you to fine-tune the settings to allow for faster boot times.
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Page 74: Primary/Secondary Ide Master/Slave Submenu
Chapter 4 BIOS Setup Description Primary/Secondary IDE Master/Slave Submenu Feature Options Description Device Hard Disk Displays the type of drive detected. The 'grayed-out' items ATAPI CDROM below are the IDE disk drive parameters taken from the firmware of the IDE disk. Vendor no option Manufacturer of the device. - Page 75 Chapter 4 BIOS Setup Description DMA Mode Auto Set to AUTO to let the BIOS auto detect the supported DMA SWDMA0, 1, 2 mode. MWDMA0, 1, 2 SWDMA = Single Word DMA UDMA0, 1, 2, 3, 4, 5, MWDMA = Multi Word DMA UDMA = Ultra DMA S.M.A.R.T Auto...
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Page 76: Usb Configuration Submenu
Chapter 4 BIOS Setup Description USB Configuration Submenu Feature Options Description USB Functions Disabled Disable ICH7M-DH USB host controllers. 2 USB Ports Enable UHCI host controller 0. 4 USB Ports Enable UHCI host controller 0 + 1. 6 USB Ports Enable UHCI host controller 0 + 1 + 2. -
Page 77: Usb Mass Storage Device Configuration Submenu
Chapter 4 BIOS Setup Description USB Mass Storage 10 Sec Number of seconds the legacy USB support BIOS routine Reset Delay waits for the USB mass storage device after the start unit 20 Sec command. 30 Sec 40 Sec USB Mass Storage sub menu Opens sub menu. -
Page 78: Remote Access Configuration Submenu
Chapter 4 BIOS Setup Description Remote Access Configuration Submenu Feature Options Description Remote Access Disabled Enable/Disable the BIOS remote access feature. Note: If the systems serial ports are disabled in the 'I/ Enabled O Interface Configuration' submenu, then Serial Redirection is disabled and 'Remote Access Configuration' menu is unavailable to the users. -
Page 79: Hardware Monitoring Submenu
Chapter 4 BIOS Setup Description NOTE This setup node is only applicable if an external Super I/O has been implemented on the carrier board. Hardware Monitoring Submenu Feature Options Description H/W Health Function Disabled Enable hardware health monitoring device and Enabled display the readings. -
Page 80: Watchdog Configuration Submenu
Chapter 4 BIOS Setup Description Watchdog Configuration Submenu Feature Options Description POST Watchdog Disabled Select the timeout value for the POST watchdog. 30sec 1min The watchdog is only active during the power-on- self-test of the system and provides a facility to 2min prevent errors during boot up by performing a reset. -
Page 81: Boot Setup
Chapter 4 BIOS Setup Description Timeout 1 0.5sec Selects the timeout value for the first stage watchdog event. 1sec 2sec 5sec 10sec 30sec 1min 2min Timeout 2 see above Selects the timeout value for the second stage watchdog event. Timeout 3 see above Selects the timeout value for the third stage watchdog event. -
Page 82: Boot Device Priority
Chapter 4 BIOS Setup Description Boot Device Priority Feature Options Description Boot Priority Selection Device Based Select between device and type based boot priority lists. The “Device Based” boot priority list allows Type Based you to select from a list of currently detected devices only. -
Page 83: Boot Settings Configuration
Chapter 4 BIOS Setup Description Boot Settings Configuration Feature Options Description Quick Boot Disabled If Enabled, some POST tasks will be skipped to speed-up the BIOS boot process. Enabled Quiet Boot Disabled Disabled displays normal POST diagnostic messages. Enabled Enabled displays OEM logo instead of POST messages. Note: The default OEM logo is a dark screen. -
Page 84: Security Setup
Chapter 4 BIOS Setup Description NOTE The term 'AC power loss' stands for the state when the module loses the standby voltage on the 5V_SB pins. On modules, the standby voltage is continuously monitored after the system is turned off. If within 30 seconds the standby voltage is no longer detected, then this is considered an AC power loss condition. -
Page 85: Security Settings
Chapter 4 BIOS Setup Description Security Settings Feature Options Description Supervisor Password Installed Reports if there is a supervisor password set. Not Installed User Password Installed Reports if there is a user password set. Not Installed Change Supervisor enter password Specifies the supervisor password. -
Page 86: Hard Disk Security User Password
Chapter 4 BIOS Setup Description Hard Disk Security User Password Feature Options Description Primary/Secondary enter password Set or clear the user password for the hard disk. Master/Slave HDD Note: This option will be shaded if the hard drive User Password does support the Security Mode Feature set but user failed to unlock the drive during BIOS POST. -
Page 87: Exit Menu
Chapter 4 BIOS Setup Description RTC Alarm Date Everyday, 01..31 Select the day of the month when the event should be (Days) generated. System Time Hour:Minute:Second Select the system time when the event should be generated. Power Button Mode On/Off Specifies if the system enters suspend or soft off mode when the power button is pressed. -
Page 88: Serial Port And Console Redirection
Chapter 4 BIOS Setup Description NOTE The above mentioned feature is only applicable if an external Super I/O has been implemented on the carrier board. Serial Port and Console Redirection Serial Redirection allows video and keyboard redirection via a standard RS-232 serial port. NOTE The above mentioned feature is only applicable if an external Super I/O has been implemented on the carrier board. -
Page 89: Industry Specifications
Chapter 4 BIOS Setup Description Industry Specifications The list below provides links to industry specifications that apply to Ampro modules. Specification Link Audio Codec ‘97 Component Specification, Version 2.3 http://www.intel.com/design/chipsets/ (AC ’97) audio/ Low Pin Count Interface Specification, Revision 1.0 http://developer.intel.com/design/ (LPC) chipsets/industry/lpc.htm... - Page 90 Chapter 4 BIOS Setup Description Reference Manual COM 830...
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Page 91: Appendix A Technical Support
Appendix A Technical Support Ampro Computers, Inc. provides a number of methods for contacting Technical Support listed in the Table A-1 below. Requests for support through the Ask an Expert are given the highest priority, and usually will be addressed within one working day. •... - Page 92 Appendix A Technical Support Reference Manual COM 830...
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