Reliability; Thermal Considerations - Intel D845GLLY Specification

Product Supplement Document for the Intel Desktop Board D845GLLY

2.7 Reliability

The mean time between failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The Desktop Board D845GLLY
MTBF is 169,538.0766 hours.

2.8 Thermal Considerations

CAUTION
Ensure that the ambient temperature does not exceed the Desktop Board's maximum operating
temperature. Failure to do so could cause components to exceed their maximum case temperature
and malfunction. For information about the maximum operating temperature, see the
Environmental specifications section in the Technical Product Specification for Intel Desktop
Boards using the Intel 845GL Chipset.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in damage to the voltage regulator circuit. The processor voltage regulator area
(item A in Figure 10) can reach a temperature of up to 85
30
o
C in an open chassis.