Thermal Logic Technologies; Processor Socket Technology - HP BL680c - ProLiant - G5 Configuration

Thermal Logic technologies

For ProLiant c-Class server blades, HP designed smaller heat sinks than rack-mount servers use. The
server blade heat sinks have vapor chamber bases, thinner fins, and tighter fin pitch than previous
designs to achieve the largest possible heat transfer surface in the smallest possible package
(Figure 8). The smaller heat sink allows more space on the server blades for DIMM slots and hard
drives.
Precise ducting on ProLiant c-Class server blades manages airflow and temperature based on the
unique thermal requirements of all the critical components. The airflow is tightly ducted to ensure that
no air bypasses the server blade and to obtain the most thermal work from the least amount of air
moved. Ducting produces high pressure that reduces the amount of required airflow, which in turn
reduces the power draw of fans. The lower airflow requirement has the added benefit of optimizing
the available data center cooling capacity.
Figure 8. Processor heat sink using fully ducted design (left) and traditional heat sink used in a 1U rack-mount
server (right)
Top view
Side view
More information about HP Thermal Logic technologies is available on the HP website:
.
www.hp.com/go/thermallogic

Processor socket technology

The latest AMD and Intel processors use a processor socket technology called Land Grid Array (LGA).
The processor package designs no longer have pins. Instead, the processor package has pads of
gold-plated copper that touch processor socket pins on the motherboard.
Technicians must be careful when installing processors to avoid damaging the delicate processor
socket pins. Because pin damage could require replacing the motherboard, HP engineers developed
a special installation tool to simplify processor installation and reduce the possibility of damaging the
socket pins (Figure 9).
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