Audio Subsystem Software; Audio Connectors And Headers; Back Panel Audio Connector Options - Intel BOXDG33TLM Technical Product Specification

Intel Desktop Board DG33TL Technical Product Specification
1.10.1

Audio Subsystem Software

Audio software and drivers are available from Intel's World Wide Web site.
For information about
Obtaining audio software and drivers
1.10.2

Audio Connectors and Headers

The board contains audio connectors on the back panel and audio headers on the
component side of the board. The front panel audio header provides mic in and line
out signals for the front panel. Microphone bias is supported for both the front and
back panel microphone connectors.
The front/back panel audio connectors are configurable through the audio device
drivers. The available configurable audio ports are shown in Figure 4.
Item
A
B
C
D
E
F
For information about
The location of the front panel audio header
The signal names of the front panel audio header
The location of the HD Audio Link header
The signal names of the HD Audio Link header
The back panel audio connectors
26
Description
Surround left/right channel audio out/Retasking Jack
Center channel and LFE (subwoofer) audio out
Line in
Line out
Mic in
S/PDIF Digital Audio Out (Optical)
Figure 4. Back Panel Audio Connector Options
Refer to
Section 1.2, page 15
Refer to
Figure 10, page 44
Table 13, page 46
Figure 10, page 44
Table 12, page 46
Section 2.2.1, page 43