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Intel® Desktop Board
DG31GL
Technical Product Specification
®
The Intel
Desktop Board DG31GL may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG31GL Specification Update.
March 2008
Order Number: E35969-001US
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Table of Contents
Related Manuals for Intel BLKDG31GL
Summary of Contents for Intel BLKDG31GL
- Page 1 Order Number: E35969-001US ® The Intel Desktop Board DG31GL may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DG31GL Specification Update.
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Page 2: Revision History
Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. -
Page 3: Intended Audience
Preface This Technical Product Specification (TPS) specifies the board layout, components, ® connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board DG31GL. It describes the standard product and available manufacturing options. Intended Audience The TPS is intended to provide detailed, technical information about the Desktop Board DG31GL and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. - Page 4 Intel Desktop Board DG31GL Technical Product Specification Other Common Notation Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second Gbit Gigabit (1,073,741,824 bits) Kilobyte (1024 bytes) Kbit Kilobit (1024 bits)
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Page 5: Table Of Contents
1.5.1 Memory Configurations ............17 ® 1.6 Intel G31 Express Chipset ............... 19 1.6.1 Intel G31 Graphics Subsystem ..........19 1.6.2 USB ................... 20 1.6.3 IDE Support ................ 20 1.7 Real-Time Clock Subsystem .............. 22 1.8 Legacy I/O Controller ............... 22 1.8.1... - Page 6 Intel Desktop Board DG31GL Technical Product Specification 2.5 Electrical Considerations ..............52 2.5.1 Power Supply Considerations ..........52 2.5.2 Fan Header Current Capability..........52 2.5.3 Add-in Board Considerations ..........53 2.6 Thermal Considerations ..............53 2.7 Reliability ..................55 2.8 Environmental ................55 3 Overview of BIOS Features ..........
- Page 7 Contents Figures Figure 1. Major Board Components............... 12 Figure 2. Block Diagram................14 Figure 3. Memory Channel and DIMM Configuration ........18 Figure 4. Back Panel Audio Connector Options..........24 Figure 5. LAN Connector LED Locations ............26 Figure 6. Thermal Sensors and Fan Headers ..........28 Figure 7.
- Page 8 Intel Desktop Board DG31GL Technical Product Specification Table 29. Acceptable Drives/Media Types for BIOS Recovery ......62 Table 30. Boot Device Menu Options............. 63 Table 31. Supervisor and User Password Functions ......... 65 Table 32. Beep Codes................. 67 Table 33. BIOS Error Messages ..............67 Table 34.
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Page 9: Product Description
1.2 Legacy Considerations..............15 1.3 Online Support................15 1.4 Processor ..................15 1.5 System Memory ................16 ® 1.6 Intel G31 Express Chipset ............... 19 1.7 Real-Time Clock Subsystem .............. 22 1.8 Legacy I/O Controller ............... 22 1.9 Audio Subsystem................23 1.10 LAN Subsystem ................ -
Page 10: Overview
Intel Desktop Board DG31GL Technical Product Specification Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the Desktop Board DG31GL. Table 1. Feature Summary Form Factor MicroATX (9.60 inches by 8.60 inches [243.84 millimeters by 218.44 millimeters]) Processor Support for the following: ®... - Page 11 Product Description Table 1. Feature Summary (continued) Instantly Available • Support for PCI* Local Bus Specification Revision 2.3 PC Technology • Suspend to RAM support • Wake on PCI, RS-232, front panel, PS/2 devices, USB ports, and LAN • Two PCI Conventional bus connectors Expansion Capabilities Hardware Monitor...
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Page 12: Board Layout
Intel Desktop Board DG31GL Technical Product Specification 1.1.2 Board Layout Figure 1 shows the location of the major components. Figure 1. Major Board Components Table 2 lists the components identified in Figure 1. -
Page 13: Table 2. Board Components Shown In Figure 1
Serial port header Diskette drive connector Main power connector (2 X 12) Parallel ATA connector Intel 82G31 GMCH Intel 82801GB I/O Controller Hub (ICH7) Serial ATA connectors [2] Front panel header Auxiliary front panel power LED header BIOS Setup configuration jumper block... -
Page 14: Block Diagram
Intel Desktop Board DG31GL Technical Product Specification 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas. Figure 2. Block Diagram... -
Page 15: Legacy Considerations
Processor The board is designed to support the following processors: • Intel Core 2 Quad processor in an LGA775 socket with a 1333 MHz or 1066 MHz system bus • Intel Core 2 Duo processor in an LGA775 socket with a 1333 MHz, 1066 MHz, or 800 MHz system bus •... -
Page 16: System Memory
Intel Desktop Board DG31GL Technical Product Specification System Memory The board has two DIMM sockets and support the following memory features: • 1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts • Unbuffered, single-sided or double-sided DIMMs with the following restriction: Double-sided DIMMS with x16 organization are not supported. -
Page 17: Memory Configurations
Product Description 1.5.1 Memory Configurations The Intel 82G31 GMCH supports the following types of memory organization: • Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. -
Page 18: Figure 3. Memory Channel And Dimm Configuration
Intel Desktop Board DG31GL Technical Product Specification Figure 3 illustrates the memory channel and DIMM configuration. Figure 3. Memory Channel and DIMM Configuration... -
Page 19: Intel G31 Express Chipset
Intel G31 Express Chipset The Intel G31 Express chipset consists of the following devices: • Intel 82G31 Graphics and Memory Controller Hub (GMCH) with Direct Media Interface (DMI) interconnect • Intel 82801GB I/O Controller Hub (ICH7) with DMI interconnect The GMCH component provides interfaces to the CPU, memory, and the DMI interconnect. -
Page 20: Usb
Intel Desktop Board DG31GL Technical Product Specification 1.6.1.2 Dynamic Video Memory Technology (DVMT) DVMT enables enhanced graphics and memory performance through highly efficient memory utilization. DVMT ensures the most efficient use of available system memory for maximum 2-D/3-D graphics performance. Up to 256 MB of system memory can be allocated to DVMT on systems that have 512 MB or more of total system memory installed. -
Page 21: Serial Ata Interfaces
Product Description • ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible. • ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH7’s ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec. -
Page 22: Real-Time Clock Subsystem
Intel Desktop Board DG31GL Technical Product Specification Real-Time Clock Subsystem A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. -
Page 23: Audio Subsystem
Product Description Audio Subsystem The board supports the Intel High Definition audio subsystem based on the Realtek ALC268-GR audio codec. The audio subsystem supports the following features: • Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. -
Page 24: 4-Channel Audio Subsystem
Intel Desktop Board DG31GL Technical Product Specification 1.9.3 4-Channel Audio Subsystem The 4-channel audio subsystem includes the following: • Intel 82801GB I/O Controller Hub (ICH7) • Realtek ALC268-GR audio codec • Microphone input that supports a single dynamic, condenser, or electret microphone •... -
Page 25: 1.10 Lan Subsystem
Programmable transit threshold • Configuration EEPROM that contains the MAC address 1.10.2 LAN Subsystem Software LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and drivers Section 1.2, page 15... -
Page 26: Rj-45 Lan Connector With Integrated Leds
Intel Desktop Board DG31GL Technical Product Specification 1.10.3 RJ-45 LAN Connector with Integrated LEDs Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5 below). Item Description Link LED (Green) Data Rate LED (Green/Yellow) Figure 5. LAN Connector LED Locations Table 5 describes the LED states when the board is powered up and the LAN subsystem is operating. -
Page 27: 1.11 Hardware Management Subsystem
Thermally monitored closed-loop fan control, for both fans, that can adjust the fan speed or switch the fans on or off as needed 1.11.2 Fan Monitoring ® Fan monitoring can be implemented using Intel Desktop Utilities or third-party software. For information about Refer to The functions of the fan headers Section 1.12.2.2, page 33... -
Page 28: Thermal Monitoring
Intel Desktop Board DG31GL Technical Product Specification 1.11.3 Thermal Monitoring Figure 6 shows the locations of the thermal sensors and fan headers. Item Description Rear chassis fan Thermal diode, located on processor die Processor fan Remote thermal sensor Figure 6. Thermal Sensors and Fan Headers NOTE The minimum thermal reporting threshold for the GMCH is 66 °C. -
Page 29: 1.12 Power Management
Product Description 1.12 Power Management Power management is implemented at several levels, including: • Software support through Advanced Configuration and Power Interface (ACPI) • Hardware support: ⎯ Power connector ⎯ Fan headers ⎯ LAN wake capabilities ⎯ Instantly Available PC technology ⎯... -
Page 30: Table 7. Power States And Targeted System Power
Intel Desktop Board DG31GL Technical Product Specification 1.12.1.1 System States and Power States Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. -
Page 31: Table 8. Wake-Up Devices And Events
Product Description 1.12.1.2 Wake-up Devices and Events Table 8 lists the devices or specific events that can wake the computer from specific states. Table 8. Wake-up Devices and Events These devices/events can wake up the computer… …from this state (Note) S1, S3, S4, S5 (Note) PME# signal... -
Page 32: Hardware Support
Intel Desktop Board DG31GL Technical Product Specification 1.12.2 Hardware Support CAUTION Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. -
Page 33: Fan Headers
Product Description 1.12.2.2 Fan Headers The function/operation of the fan headers is as follows: • The fans are on when the board is in the S0 state. • The fans are off when the board is off or in the S3, S4, or S5 state. •... -
Page 34: Instantly Available Pc Technology
Intel Desktop Board DG31GL Technical Product Specification 1.12.2.4 Instantly Available PC Technology CAUTION For Instantly Available PC technology, the +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. -
Page 35: Energy Star
ENERGY STAR* In 2007, the US Department of Energy and the US Environmental Protection Agency revised the ENERGY STAR* requirements. Intel has worked directly with these two governmental agencies to define the new requirements. Currently Intel Desktop Boards meet the new requirements. - Page 36 Intel Desktop Board DG31GL Technical Product Specification...
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Page 37: Technical Reference
Technical Reference What This Chapter Contains 2.1 Memory Map................... 37 2.2 Connectors and Headers..............40 2.3 Jumper Block .................. 50 2.4 Mechanical Considerations ..............51 2.5 Electrical Considerations ..............52 2.6 Thermal Considerations ..............53 2.7 Reliability ..................55 2.8 Environmental ................55 Memory Map 2.1.1 Addressable Memory... -
Page 38: Figure 8. Detailed System Memory Address Map
Intel Desktop Board DG31GL Technical Product Specification The amount of installed memory that can be used will vary based on add-in cards and BIOS settings. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses. -
Page 39: Table 9. System Memory Map
Technical Reference Table 9 lists the system memory map. Table 9. System Memory Map Address Range Address Range (decimal) (hex) Size Description 1024 K - 4194304 K 100000 - FFFFFFFF 4095 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K... -
Page 40: Connectors And Headers
Intel Desktop Board DG31GL Technical Product Specification Connectors and Headers CAUTION Only the following connectors and headers have overcurrent protection: Back panel and front panel USB and PS/2. The other internal connectors/headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. -
Page 41: Back Panel Connectors
Technical Reference 2.2.1 Back Panel Connectors Figure 9 shows the location of the back panel connectors. Item Description PS/2 mouse port PS/2 keyboard port VGA output USB ports [4] Audio line in Mic in Audio line out Figure 9. Back Panel Connectors NOTE The back panel audio line out connector is designed to power headphones or amplified speakers only. -
Page 42: Component-Side Connectors And Headers
Intel Desktop Board DG31GL Technical Product Specification 2.2.2 Component-side Connectors and Headers Figure 10 shows the locations of the component-side connectors and headers. Figure 10. Component-side Connectors and Headers... -
Page 43: Table 10. Component-Side Connectors And Headers Shown In Figure 10
Technical Reference Table 10 lists the component-side connectors and headers identified in Figure 10. Table 10. Component-side Connectors and Headers Shown in Figure 10 Item/callout from Figure 10 Description PCI Conventional bus add-in card connector PCI Conventional bus add-in card connector S/PDIF connector Processor core power connector (2 X 2) Rear chassis fan header... -
Page 44: Table 11. Front Panel Audio Header
Intel Desktop Board DG31GL Technical Product Specification 2.2.2.1 Signal Tables for the Connectors and Headers Table 11. Front Panel Audio Header Signal Name Signal Name Port1L (MIC) Ground Port1R (MIC) PRESENCE# (Dongle present) Port2R (Line) MIC jack detect SENSE_SEND (Jack detection) -
Page 45: Table 15. Rear Chassis (3-Pin) Fan Header
Technical Reference Table 15. Rear Chassis (3-Pin) Fan Header Signal Name Control +12 V Tach Table 16. Processor (4-Pin) Fan Header Signal Name Ground +12 V FAN_TACH FAN_CONTROL 2.2.2.2 Add-in Card Connectors The board has two PCI Conventional bus add-in card connectors. PCI Conventional bus add-in cards with SMBus support can access sensor data and other information residing on the board. -
Page 46: Table 17. Processor Core Power Connector
Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When... -
Page 47: Figure 11. Connection Diagram For Front Panel Header
Technical Reference 2.2.2.4 Front Panel Header This section describes the functions of the front panel header. Table 19 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header. Table 19. Front Panel Header Signal Description Signal... -
Page 48: Table 20. States For A One-Color Power Led
Intel Desktop Board DG31GL Technical Product Specification 2.2.2.4.1 Hard Drive Activity LED Header Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires one of the following: •... -
Page 49: Figure 12. Connection Diagram For Front Panel Usb Headers
Technical Reference 2.2.2.5 Front Panel USB Headers Figure 12 is a connection diagram for the front panel USB headers. INTEGRATOR’S NOTES • The +5 V DC power on the USB headers is fused. • Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices. -
Page 50: Jumper Block
Intel Desktop Board DG31GL Technical Product Specification Jumper Block CAUTION Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. -
Page 51: Mechanical Considerations
Technical Reference Mechanical Considerations 2.4.1 Form Factor The board is designed to fit into an ATX-form-factor chassis. Figure 14 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 8.60 inches by 9.60 inches [218.44 millimeters by 243.84 millimeters]. -
Page 52: Electrical Considerations
Intel Desktop Board DG31GL Technical Product Specification Electrical Considerations 2.5.1 Power Supply Considerations CAUTION The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. -
Page 53: Add-In Board Considerations
Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://developer.intel.com/design/motherbd/cooling.htm... -
Page 54: Figure 15. Localized High Temperature Zones
Intel Desktop Board DG31GL Technical Product Specification Figure 15 shows the locations of the localized high temperature zones. Item Description Processor voltage regulator area Processor Intel 82G31 GMCH Intel 82801GB ICH7 Figure 15. Localized High Temperature Zones Table 25 provides maximum case temperatures for the board components that are sensitive to thermal changes. -
Page 55: Reliability
Technical Reference Reliability The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. - Page 56 Intel Desktop Board DG31GL Technical Product Specification...
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Page 57: Overview Of Bios Features
3.10 BIOS Security Features ..............65 Introduction The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support. -
Page 58: Bios Flash Memory Organization
Intel Desktop Board DG31GL Technical Product Specification Table 27 lists the BIOS Setup program menu features. Table 27. BIOS Setup Program Menu Bar Maintenance Main Advanced Security Power Boot Exit Clears Displays Configures Sets Configures Selects boot Saves or passwords and... -
Page 59: Pci Ide Support
Overview of BIOS Features 3.3.2 PCI IDE Support If you select Auto in the BIOS Setup program, the BIOS automatically sets up the PCI IDE connector with independent I/O channel support. The IDE interface supports hard drives up to ATA-66/100 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape drives, and Ultra DMA drives. -
Page 60: Legacy Usb Support
Legacy USB support from the BIOS is no longer used. ® 7. Additional USB legacy feature options can be access by using Intel Integrator Toolkit. To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s... -
Page 61: Bios Updates
The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen. NOTE ® If you add a custom splash screen, it will share space with the Intel branded logo. Refer to For information about Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/... -
Page 62: Bios Recovery
Intel Desktop Board DG31GL Technical Product Specification BIOS Recovery It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 29 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable. -
Page 63: Boot Options
Overview of BIOS Features Boot Options In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the ATAPI CD-ROM third. -
Page 64: Adjusting Boot Speed
It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen. -
Page 65: 3.10 Bios Security Features
Overview of BIOS Features 3.10 BIOS Security Features The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: •... - Page 66 Intel Desktop Board DG31GL Technical Product Specification...
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Page 67: Error Messages And Beep Codes
Error Messages and Beep Codes What This Chapter Contains 4.1 Speaker ..................67 4.2 BIOS Beep Codes ................67 4.3 BIOS Error Messages ............... 67 4.4 Port 80h POST Codes ............... 68 Speaker The board-mounted speaker provides audible error code (beep code) information during POST. -
Page 68: Port 80H Post Codes
Intel Desktop Board DG31GL Technical Product Specification Port 80h POST Codes During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. -
Page 69: Table 35. Port 80H Post Codes
Error Messages and Beep Codes Table 35. Port 80h POST Codes POST Code Description of POST Operation Host Processor Power-on initialization of the host processor (Boot Strap Processor) Host processor cache initialization (including APs) Starting Application processor initialization SMM initialization Chipset Initializing a chipset component Memory... - Page 70 Intel Desktop Board DG31GL Technical Product Specification Table 35. Port 80h POST Codes (continued) POST Code Description of POST Operation Keyboard (PS/2 or USB) Resetting keyboard Disabling keyboard Detecting presence of keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS/2 only)
- Page 71 Error Messages and Beep Codes Table 35. Port 80h POST Codes (continued) POST Code Description of POST Operation DXE Drivers Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI operating system boot Entering Sleep state Exiting Sleep state EFI boot service ExitBootServices ( ) has been called EFI runtime service SetVirtualAddressMap ( ) has been called...
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Page 72: Table 36. Typical Port 80H Post Sequence
Intel Desktop Board DG31GL Technical Product Specification Table 36. Typical Port 80h POST Sequence POST Code Description Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase... -
Page 73: Regulatory Compliance And Battery Disposal Information
Regulatory Compliance and Battery Disposal Information What This Chapter Contains 5.1 Regulatory Compliance..............73 5.2 Battery Disposal Information............. 81 Regulatory Compliance This section contains the following regulatory compliance information for Desktop Board DG31GL: • Safety standards • European Union Declaration of Conformity statement •... -
Page 74: European Union Declaration Of Conformity Statement
European Union Declaration of Conformity Statement ® We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board DG31GL is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive). -
Page 75: Product Ecology Statements
恰当的重复使用处理。 请参考http://www.intel.com/intel/other/ehs/product_ecology 了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。 Deutsch Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recycling zurückzugeben. Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der... - Page 76 Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à...
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Page 77: Lead Free Desktop Board
Regulatory Compliance and Battery Disposal Information Russian В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Program) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной... -
Page 78: Table 38. Lead-Free Board Markings
Intel Desktop Board DG31GL Technical Product Specification Table 38. Lead-Free Board Markings Description Mark Lead-Free 2 Level Interconnect: This symbol is used to identify electrical and electronic assemblies and components in which the lead (Pb) concentration level in the desktop board... -
Page 79: Emc Regulations
Regulatory Compliance and Battery Disposal Information 5.1.4 EMC Regulations Desktop Board DG31GL complies with the EMC regulations stated in Table 39 when correctly installed in a compatible host system. Table 39. EMC Regulations Regulation Title FCC 47 CFR Part 15, Title 47 of the Code of Federal Regulations, Part15, Subpart B, Radio Subpart B Frequency Devices. -
Page 80: Product Certification Markings (Board Level)
China RoHS/Environmentally Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associated collateral. The color of the mark may vary depending upon the application. The Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined... -
Page 81: Battery Disposal Information
Regulatory Compliance and Battery Disposal Information Battery Disposal Information CAUTION Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations. PRECAUTION Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. - Page 82 Intel Desktop Board DG31GL Technical Product Specification PRECAUCIÓN Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
- Page 83 Regulatory Compliance and Battery Disposal Information AWAS Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan. OSTRZEŻENIE Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii.
- Page 84 Intel Desktop Board DG31GL Technical Product Specification...