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CONTENTS(目次)
DISASSEMBLY PROCEDURE
(MOTIF XS6/MOTIF XS7)(分解手順) .................... 16
DISASSEMBLY PROCEDURE (MOTIF XS8)
(分解手順) ................................................................ 32
(拡張部品(別売)の取り付け) .......................... 55/59
LSI PIN DESCRIPTION(LSI 端子機能表) .............. 63
IC BLOCK DIAGRAM(IC ブロック図) ................... 74
CIRCUIT BOARDS(シート基板図) ........................ 77
(ファイルのセーブ&ロード) .......................... 165/167
SY
011856
MOTIF XS6: 200703-262500
MOTIF XS7: 200703-299250
SERVICE MANUAL
SERVICE MANUAL
(ファームウェアバージョンアップ手順) ........ 171/173
(MOTIF XS ブートシーケンス) ...................... 175/176
(メッセージリスト) ........................................ 177/179
MIDI IMPLEMENTAION CHART ............................ 181
PARTS LIST
WIRING(基板結線図)
OVERALL CIRCUIT DIAGRAM(総回路図)
Copyright (c) Yamaha Corporation. All rights reserved. PDF
MOTIF XS6
MOTIF XS7
MOTIF XS8
HAMAMATSU, JAPAN
'07.04
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