RF-Star SimpleLink RF-TI1354P1 Manual

Cc1354p1 high performance sub-1g + 2.4 g multi-band module with integrated power amplifier

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TM
RF-TI1354P1 CC1354P1 SimpleLink
High-
Performance Sub-1G + 2.4 G Multi-band Module
With Integrated Power Amplifier
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Oct. 18
th
, 2024
All rights reserved. Those responsible for unauthorized reproduction will be prosecuted.

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Summary of Contents for RF-Star SimpleLink RF-TI1354P1

  • Page 1 RF-TI1354P1 CC1354P1 SimpleLink High- Performance Sub-1G + 2.4 G Multi-band Module With Integrated Power Amplifier Version 1.0 Shenzhen RF-star Technology Co., Ltd. Oct. 18 , 2024 All rights reserved. Those responsible for unauthorized reproduction will be prosecuted.
  • Page 2: Device Overview

    • Excellent receiver sensitivity to any GPIOs - -121 dBm @ Sub-1 GHz (SimpleLink Long-range - 4× 32-bit or 8× 16-bit general-purpose Mode) timers - -110 dBm @ Sub-1 GHz (50 kbps) Shenzhen RF-star Technology Co., Ltd. Page 1 of 22...
  • Page 3: Applications

    – wireless keypads • Gaming – electronic and robotic toys communications – Long-range sensor • Wearables (non-medical) – smart trackers, applications • Other alternative energy – energy harvesting smart clothing Shenzhen RF-star Technology Co., Ltd. Page 2 of 22...
  • Page 4: Functional Block Diagram

    The part numbers are of the form of RF-TI1354P1 where the fields are defined as follows: 1352 RF-STAR Module Version The First Version Company Name Chip Manufacturer Chipset TI CC1354P10 Figure 2. Part Number Conventions of RF-TI1354P1 Shenzhen RF-star Technology Co., Ltd. Page 3 of 22...
  • Page 5: Table Of Contents

    4.6.1 Unsatisfactory Transmission Distance ..................16 4.6.2 Vulnerable Module ..........................17 4.6.3 High Bit Error Rate ..........................17 4.7 Electrostatics Discharge Warnings ......................17 4.8 Soldering and Reflow Condition ......................... 17 Shenzhen RF-star Technology Co., Ltd. Page 4 of 22...
  • Page 6 RF-TI1354P1 www.rfstariot.com V1.0 - Oct., 2024 5 Optional Package Specification ..........................19 6 Revision History ................................21 7 Contact Us ..................................22 Shenzhen RF-star Technology Co., Ltd. Page 5 of 22...
  • Page 7: Module Configuration And Functions

    RF, Amazon Sidewalk, proprietary systems, SimpleLink™ TI 15.4-Stack (Sub-1 GHz) Crystal 48 MHz, 32.768 kHz Package SMT packaging (1.27-mm half-hole pitch stamp stick) Dimension 26.5 mm × 16.9 mm × 2.1 mm Shenzhen RF-star Technology Co., Ltd. Page 6 of 22...
  • Page 8: Module Pin Diagram

    Type of Antenna Half-hole ANT interface, IPEX connector -40 ℃ ~ +85 ℃ Operating Temperature -40 ℃ ~ +125 ℃ Storage Temperature 2.2 Module Pin Diagram Figure 3. Pin Diagram of RF-TI1354P1 Shenzhen RF-star Technology Co., Ltd. Page 7 of 22...
  • Page 9: Pin Functions

    GPIO, JTAG_TDO, high-drive capability DIO17 DIO_17 Digital GPIO, JTAG_TDI, high-drive capability DIO18 DIO_18 Digital GPIO DIO19 DIO_19 Digital GPIO DIO20 DIO_20 Digital GPIO DIO21 DIO_21 Digital GPIO DIO22 DIO_22 Digital GPIO Shenzhen RF-star Technology Co., Ltd. Page 8 of 22...
  • Page 10 Digital or Analog GPIO, analog capability None connect None connect Ground Ground 2G4-OUT RF Out 2.4 GHz antenna pinout Antenna Ground Antenna Ground SUB-OUT RF Out Sub 1GHz antenna pinout Ground Ground Shenzhen RF-star Technology Co., Ltd. Page 9 of 22...
  • Page 11: Specifications

    PA and non-PA RF output to realize the control of the transmission power range. Table 3. RF Control Truth Table Power DIO29 (Output) DIO30 (Output) +5 dBm ~ + 20 dBm (PA) < 5 dBm Shenzhen RF-star Technology Co., Ltd. Page 10 of 22...
  • Page 12: Application, Implementation, And Layout

    RF-TI1354P1 www.rfstariot.com V1.0 - Oct., 2024 4 Application, Implementation, and Layout 4.1 Module Photos Figure 4. Photos of RF-TI1354P1 4.2 Recommended PCB Footprint Figure 5. Recommended PCB Footprint of RF-TI1354P1 Shenzhen RF-star Technology Co., Ltd. Page 11 of 22...
  • Page 13: Schematic Diagram

    The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the antenna are key factors to increase the data rate and transmission range. Therefore, the layout of the module antenna location and routing is recommended as follows: Shenzhen RF-star Technology Co., Ltd. Page 12 of 22...
  • Page 14: Antenna Output Mode Modification

    1. A Π-type matching circuit is reserved for the antenna, and 50 Ω impedance control is performed on the RF traces. The traces are as short as possible, and 135° or arc traces are used as much as possible. No vias are used to Shenzhen RF-star Technology Co., Ltd. Page 13 of 22...
  • Page 15 Example: FR4 is a double-layer board with a thickness of 1.0 mm. Through calculation, the width of the trace is 0.8254 mm, and the spacing between traces and copper is 0.22 mm. Figure 11. SI9000 Impedance Calculation Diagram Shenzhen RF-star Technology Co., Ltd. Page 14 of 22...
  • Page 16: Ipex Connector Specification

    1. It is recommended to offer the module a DC stabilized power supply, a tiny power supply ripple coefficient, and reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power Shenzhen RF-star Technology Co., Ltd. Page 15 of 22...
  • Page 17: Trouble Shooting

    4. The incorrect power register set or the high data rate in the open air may shorten the communication distance. The higher the data rate, the closer the distance. Shenzhen RF-star Technology Co., Ltd. Page 16 of 22...
  • Page 18: Vulnerable Module

    3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high. 4.7 Electrostatics Discharge Warnings The module will be damaged by the discharge of static. RF-star suggests that all modules should follow the 3 precautions below: 1.
  • Page 19 Max. 6 ℃/s Time from 25 ℃ to Peak Temperature (t Max. 6 minutes Max. 8 minutes Time of Soldering Zone (t 20±10 s 20±10 s Figure 14. Recommended Reflow for Lead-Free Solder Shenzhen RF-star Technology Co., Ltd. Page 18 of 22...
  • Page 20 The default package method is . If you need the modules to be shipped by tape & reel, pls contact us in advance. Figure 15. Default Package by Tray Shenzhen RF-star Technology Co., Ltd. Page 19 of 22...
  • Page 21 RF-TI1354P1 www.rfstariot.com V1.0 - Oct., 2024 Figure 16. Package by Tape & Reel Shenzhen RF-star Technology Co., Ltd. Page 20 of 22...
  • Page 22: Revision History

    1. The document will be optimized and updated from time to time. Before using this document, please make sure it is the latest version. 2. To obtain the latest document, please download it from the official website: www.rfstariot.com and www.szrfstar.com. Shenzhen RF-star Technology Co., Ltd. Page 21 of 22...
  • Page 23 RF-TI1354P1 www.rfstariot.com V1.0 - Oct., 2024 7 Contact Us SHENZHEN RF-STAR TECHNOLOGY CO., LTD. Shenzhen HQ: Add.: Room A503, Podium Building No. 12, Shenzhen Bay Science and Technology Ecological Park, Nanshan District, Shenzhen, Guangdong, China, 518063 Tel.: 86-755-8632 9829 Chengdu Branch: Add.: N2-1604, Global Center, North No.

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