Compaq BL10e - HP ProLiant - 512 MB RAM Introduction Manual
Optimizing facility operation in high density data center environments
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Optimizing facility operation in high density
data center environments
technology brief
Abstract.............................................................................................................................................. 3
Introduction......................................................................................................................................... 3
Assessing facility requirements .............................................................................................................. 3
Using sizing tools to understand server and facility requirements ........................................................... 4
Data center assessment..................................................................................................................... 5
Component power and cooling ............................................................................................................. 5
Processor power and cooling ............................................................................................................ 5
Efficient practices for servers and enclosures ....................................................................................... 6
Efficient practices at the rack level...................................................................................................... 9
Efficient practices for facility-level power and cooling............................................................................. 12
Power management and reporting ................................................................................................... 13
Airflow distribution for high-density data centers ................................................................................ 13
Processor P-state........................................................................................................................... 5
P-state management ...................................................................................................................... 6
Understanding server power utilization and heat generation.............................................................. 6
Greater density with multi-core processors ....................................................................................... 7
Blade enclosures with integrated cooling hardware .......................................................................... 7
Onboard thermal sensors and temperature management................................................................... 7
Pooled power .............................................................................................................................. 7
High-line power efficiency ............................................................................................................. 7
Power management and reporting of individual servers .................................................................... 8
Server virtualization using virtual machine technology....................................................................... 9
Rack configuration tools ................................................................................................................ 9
Methods for calculating power supply requirements........................................................................ 10
Power protection and management .............................................................................................. 10
Rack based power distribution ..................................................................................................... 10
High-efficiency power supplies..................................................................................................... 10
Understanding Internal airflow ..................................................................................................... 10
Liquid cooled racks..................................................................................................................... 11
Comprehensive management applications..................................................................................... 13
Power Capping.......................................................................................................................... 13
Raised floors .............................................................................................................................. 15
Air supply plenum ...................................................................................................................... 15
Ceiling return air plenum............................................................................................................. 17
Dual supply air plenums .............................................................................................................. 17
Perforated tiles ........................................................................................................................... 17
Rack geometry ........................................................................................................................... 18
Cooling footprint ........................................................................................................................ 18
Hot and cold aisle spacing .......................................................................................................... 18
Row configuration ...................................................................................................................... 18
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Summary of Contents for Compaq BL10e - HP ProLiant - 512 MB RAM
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Page 1: Table Of Contents
Optimizing facility operation in high density data center environments technology brief Abstract.............................. 3 Introduction............................3 Assessing facility requirements ......................3 Using sizing tools to understand server and facility requirements ............4 Data center assessment........................5 Component power and cooling ......................5 Processor power and cooling ...................... - Page 2 Closely coupled cooling ......................19 Computer room air conditioners....................... 19 Capacity of CRAC units ......................19 Placement of CRAC units ......................20 Discharge velocity ........................21 Advanced thermal management techniques ..................22 Thermal Assessment Services ......................22 Dynamic Smart Cooling ........................24 Summary ............................
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Page 3: Abstract
Abstract This paper describes issues of high processor and server density within existing data center infrastructures. It identifies methods to optimize the effectiveness of power and cooling resources in facilities that are deploying high-density equipment or that are already fully populated with high- density equipment. -
Page 4: Using Sizing Tools To Understand Server And Facility Requirements
Figure 1. Projection of product heat loads in the data center Source: ASHRAE, Datacom Equipment Power Trends and Cooling Applications, Chapter 3, Fig 3.10 New ASHRAE updated and expanded power trend chart, © 2005 American Society of Heating, Refrigerating and Air-Conditioning Engineers, Inc. Figure is based on a fully loaded 42U rack with maximum configurations, typical power consumptions, and a heat load based on square footage of the equipment footprint. -
Page 5: Data Center Assessment
The HP Systems Insight Manager (SIM) sizing tool assists systems administrators in building highly available, high-performance HP SIM deployments running on Microsoft Windows®, Linux®, or HP-UX operating systems. With input from quality assurance and performance testing, the tool recommends server configurations based on projected management workloads, installed management applications, and number of console users. -
Page 6: P-State Management
Table2. P-states of the Intel Quad-Core 2.66-GHz processor P-state Description Core Frequency Approximate Core voltage Pmax Maximum performance 2.66 GHz 1.2 VDC Pmin Minimum power 2.0 GHz 1.0 VDC P-state management IT administrators can control processor P-states by one of two basic methods: through the operating system (OS) with the use of a driver, or more directly through firmware in the BIOS ROM (Figure 2). -
Page 7: Greater Density With Multi-Core Processors
Greater density with multi-core processors Multi-core processors take advantage of a fundamental relationship between power and frequency. Each core in a multi-core processor can run at a lower frequency, dividing among them the power normally given to a single core. The result is a performance increase over a single-core processor. Blade enclosures with integrated cooling hardware HP BladeSystem c-Class provides efficient cooling with the use of innovative Active Cool fan technology plus the intelligent management of the Onboard Administrator controller. -
Page 8: Power Management And Reporting Of Individual Servers
Figure 3. Power consumption of ProLiant server at different AC supply levels DL380 G4 Watts AC Volts AC Therefore, a 1000-server datacenter would save approximately $25,000 per year in direct and indirect power costs by using 208V instead of 115V power. Power management and reporting of individual servers Power management and reporting of all servers are essential to managing power and cooling in a data center environment. -
Page 9: Server Virtualization Using Virtual Machine Technology
Figure 4. Example of iLO Power Regulator reporting capability Server virtualization using virtual machine technology Several studies of the data center environment have shown that without server virtualization technology, typical x86 processor utilization rates range somewhere between 5 to 15 percent. IT administrators can use virtual machine technology (for example VMware, Microsoft Virtual Server, RHEL/XEN and SLES 10/Xen) to consolidate multiple older, physical server platforms onto a single more powerful and energy-efficient server platform. -
Page 10: Methods For Calculating Power Supply Requirements
It provides the height, weight, power, and thermal requirements for each system to be racked as well as the requirements for the fully configured rack. These specifications are crucial for data center managers who must know whether these specifications fall within acceptable parameters for their existing facility infrastructures, or for those managers who require planning data to support IT equipment upgrades. -
Page 11: Liquid Cooled Racks
In addition, any gaps between the cold and hot isles allow hot exhaust air to re-circulate and mix with cold air, making a “short circuit”. This situation can occur when hot aisle exhaust air flows straight through a rack with open "U" spaces as shown in Figure 5. Gaskets or blanking panels must be installed in any open spaces in the front of the rack to support the front-to-back airflow design and prevent these negative effects. -
Page 12: Efficient Practices For Facility-Level Power And Cooling
requirements of the target servers. Liquid-cooled racks are ideal for high density head loads. The HP Modular Cooling System (MCS), pictured in Figure 6, is one such rack. It is a closed-loop cooling system mounted on an HP 10000 Series G2 Rack. The MCS makes it possible to achieve hardware densities and power consumption levels (up to 35 kW in a single rack) that have been difficult—if not impossible—to support with conventional HVAC systems. -
Page 13: Power Management And Reporting
As IT administrators and data center managers are well aware, facility power requirements involve much more than server power requirements. The percentage of total power consumption used by cooling alone in today’s average data center can be as high as 70 percent. Power management and reporting Management tools that provide graphing and historical analysis of key power and thermal data for servers in the data center can provide a comprehensive overview for facility metrics and... - Page 14 plenum beneath the raised floor. The computer room air conditioning (CRAC) unit draws in warm air from the top, cools the air, and discharges it into the supply plenum beneath the floor. Figure 7. Airflow pattern for raised floor configuration with hot aisles and cold aisles To achieve an optimum downdraft airflow pattern, warm exhaust air must be returned to the computer room air conditioning (CRAC) unit with minimal obstruction or redirection.
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Page 15: Raised Floors
Figure 8. Mixing of supply air and exhaust air Raised floors Raised floors typically measure 18 inches (46 cm) to 36 inches (91 cm) from the building floor to the top of the floor tiles, which are supported by a grounded grid structure. The static pressure in the supply plenum pushes the air up through perforated floor tiles to cool the racks. - Page 16 Figure 9. Unorganized cables (left) and organized cables (right) beneath a raised floor. Electrical and network cables from devices in the racks pass through cutouts in the tile floor to wireways and cable trays beneath the floor. Oversized or unsealed cable cutouts allow supply air to escape from the plenum, thereby reducing the static pressure.
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Page 17: Ceiling Return Air Plenum
Ceiling return air plenum In recent years, raised floor computer rooms with very high heat density loads have begun to use a ceiling return air plenum to direct exhaust air back to the CRAC intake. As shown on the right of Figure 11, the ceiling return air plenum removes heat while abating the mixing of cold air and exhaust air. -
Page 18: Rack Geometry
from 25 percent (the most common) to 56 percent (for high airflow). A 25 percent perforated tile provides approximately 500 cubic feet per minute (cfm) at a 5 percent static pressure drop, while a 56 percent perforated tile provides approximately 2000 cfm. Rack geometry Designing the data center layout to form hot and cold aisles is one step in the cooling optimization process. -
Page 19: Closely Coupled Cooling
At the ends of rows, exhaust from the high-density rack will wrap around the end of the row infiltrating the cold aisle and device inlets. Deep into room corners, heat will be trapped in corner and eventually increase inlet temperatures (see Figure 14). Figure 14. -
Page 20: Placement Of Crac Units
While the "tons" capacity rating is measured at 80˚F, HP recommends that facility managers target an optimal operating range of 68 - 77˚F and 40 - 55% relative humidity (RH). These ranges are in inline with the recommendations of the American Society of Heating, Refrigerating and Air- Conditioning Engineers (ASHRAE) . -
Page 21: Discharge Velocity
perimeter. Large, square rooms may require CRAC units to be placed around the perimeter and through the center of the room. Figure 16. CRAC units should be placed perpendicular to hot aisles so that they discharge cool air beneath the floor in the same direction. -
Page 22: Advanced Thermal Management Techniques
Figure 17. Plenum static pressure greater than pressure above the floor (left). High-velocity discharge reduces static pressure closest to the unit (right). Advanced thermal management techniques Heat loads vary throughout a data center due to the heterogeneous mix of hardware types and models, changing compute workloads, and the addition or removal of racks over time. - Page 23 • An over-provisioned CRAC unit (large negative percentage) operates significantly below the capacity of the unit. This results in wasted energy if operation of the unit cannot be adjusted to match the lower cooling load. For example, Figure 18 shows the row-wise distribution of heat loads (41 kW to 182 kW) for a combination of compute, storage, and networking equipment in a typical raised floor data center with four CRAC units.
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Page 24: Dynamic Smart Cooling
In Figure 19, the 102-kW row and the 182-kW row have been repositioned to better distribute the heat load. This CFD model shows that the CRAC units are now provisioned within 15 percent of their capacity. Figure 19. Statically provisioned CRAC units Dynamic Smart Cooling Dynamic Smart Cooling (DSC) is a datacenter cooling solution which progresses the state-of-the-art beyond that which is feasible with any static solution. -
Page 25: Summary
Summary Data centers are approaching the point of outpacing conventional methods used to power and cool high density computing environments. Escalating energy costs and cooling requirements in existing data center facilities call for better methodology in the areas of planning and configuration, and more capable analytical and management tools to handle power and cooling demands. -
Page 26: For More Information
For more information For additional information, refer to the resources detailed below. Resource description Web address Thermal Considerations in Cooling Large www.hpl.hp.com/research/papers/2002/thermal_may02.p Scale High Compute Density Data Centers white paper HP Rack/Site Installation Preparation Utility http://h30099.www3.hp.com/configurator/calc/Site%20Pr eparation%20Utility.xls Power calculators http://h30099.www3.hp.com/configurator/calc/Power%20 Calculator%20Catalog.xls C7000 Blade enclosure http://h20000.www2.hp.com/bc/docs/support/SupportMa...
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