For More Information; Call To Action - Compaq BL10e - HP ProLiant - 512 MB RAM Introduction Manual

Optimizing facility operation in high density data center environments

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Table of Contents

For more information

For additional information, refer to the resources detailed below.

HP Rack/Site Installation Preparation Utility

Power calculators

C7000 Blade enclosure

Cable management for rack-mounted

systems

HP Modular Cooling System

Critical factors in intra-rack power

distribution planning for high-density

systems

Server virtualization technologies for x86-

based HP BladeSystem and HP ProLiant

servers

Data Center Cooling Strategies

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contained herein is subject to change without notice. The only warranties for

HP products and services are set forth in the express warranty statements

accompanying such products and services. Nothing herein should be construed

as constituting an additional warranty. HP shall not be liable for technical or

editorial errors or omissions contained herein.

Microsoft and Windows are U.S. registered trademarks of Microsoft

Corporation.

Intel and Xeon are trademarks or registered trademarks of Intel Corporation or

its subsidiaries in the United States and other countries.

TC070802TB, August 2007

Resource description

Thermal Considerations in Cooling Large

Scale High Compute Density Data Centers

white paper

Web address

www.hpl.hp.com/research/papers/2002/thermal_may02.p

http://h30099.www3.hp.com/configurator/calc/Site%20Pr

eparation%20Utility.xls

http://h30099.www3.hp.com/configurator/calc/Power%20

Calculator%20Catalog.xls