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COMPACT IPM SERIES EVB
STK5x4U3xx Series,
NFAxxx60xxx Series
Evaluation Board User's
Manual
Introduction
This user's guide is intended to provide practical guidelines for the
STK5x4U3xx series and NFAxxx60xxx series. From now on, these
series are called the compact IPM series. It should be used in
conjunction with the datasheet and application note
Product Description
The compact IPM series is Intelligent Power Module (IPM) for
3−phase motor drives which contain the main power circuitry and the
supporting control circuitry.
The Compact IPMs are a fully−integrated inverter power stage
consisting of a high−voltage driver, six IGBTs for three−phase
inverter, six fast recovery diodes, three bootstrap diodes and a
thermistor, suitable for driving permanent magnet synchronous
(PMSM) motors, brushless−DC (BLDC) motors and AC
asynchronous motors. The IGBTs are configured in a 3−phase bridge
with separate emitter connections for the lower legs for maximum
flexibility in the choice of control algorithm.
Features
Three−phase 3 A ~ 15 A/600 V IGBT Module with Integrated
Drivers
Compact IPM 29.6 mm x 18.2 mm, Dual In−line Package
Cross−conduction Protection
Adjustable Over−current Protection Level
Integrated Boot−strap Diodes and Resistors
Enable Pin
Thermistor
Typical Application
Industrial Pumps, Fans and Automation
Home Appliances
Table 1. LINE−UP
Package
Voltage (V
)
CEMAX
Current, I
C
Peak Current, I
CMAX
Isolation Voltage
1. Under development.
2. DIP−S package is full package and has cavity hole.
3. DIP−S3/6 are DBC version, DIP−S3 has cavity hole, DIP−S6 is no cavity hole.
© Semiconductor Components Industries, LLC, 2014
October, 2018 − Rev. 2
STK5C4U332J−E
STK5Q4U352J−E
DIP−S (Note 2)
DIP−S3 (Note 3)
3 A
6 A
EVAL BOARD USER'S MANUAL
DIP−S
STK5C4U362J−E
NFAQ1060L33T (Note 1)
DIP−S3/6 (Note 3)
600 V
8 A
10 A
16 A
20 A
2000 V
1
www.onsemi.com
DIP−S6
DIP−S3
NFAQ1560R43T
(Note 1)
DIP−S6 (Note 3)
15 A
30 A
Publication Order Number:
EVBUM2289/D

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Summary of Contents for ON Semiconductor COMPACT IPM Series

  • Page 1 This user’s guide is intended to provide practical guidelines for the STK5x4U3xx series and NFAxxx60xxx series. From now on, these series are called the compact IPM series. It should be used in conjunction with the datasheet and application note Product Description The compact IPM series is Intelligent Power Module (IPM) for 3−phase motor drives which contain the main power circuitry and the...
  • Page 2: Evaluation Board Description

    COMPACT IPM SERIES EVB EVALUATION BOARD DESCRIPTION Schematic Figure 1 shows a circuity of the evaluation board of short−circuit protection circuit, fault out circuit and one Compact IPM. The evaluation board consists of interface shunt resistor. circuit, bootstrap capacitors, snubber...
  • Page 3 COMPACT IPM SERIES EVB PCB Map Figure 3 shows the PCB layout of compact IPM. Power Connection Figure 3. PCB Layout of the Compact IPM 8. To prevent surge destruction, the wiring between Circuit Layout Design Guidance 1. PCB size is 83.0 mm x 60.0 mm the filter capacitor and the P &...
  • Page 4: Pin Description

    COMPACT IPM SERIES EVB Pin Description Table 2. PIN DESCRIPTION Connection Description Signal Interface (CN1) High−Side Input Signal from MCU (Phase U) High−Side Input Signal from MCU (Phase V) High−Side Input Signal from MCU (Phase W) Low−Side Input Signal from MCU (Phase U) Low−Side Input Signal from MCU (Phase V)
  • Page 5: Bill Of Materials

    COMPACT IPM SERIES EVB BILL of Materials Table 3. BILL OF MATERIALS Part No. Type Name Definition Definition MCR10EZPJ101 100 W, 1/8W, 5% ROHM MCR10EZPJ101 100 W, 1/8W, 5% ROHM MCR10EZPJ101 100 W, 1/8W, 5% ROHM MCR10EZPJ101 100 W, 1/8W, 5%...
  • Page 6: Package Outline

    COMPACT IPM SERIES EVB PACKAGE OUTLINE There are three kind of package type for compact IPM. The package of DIP-S shown in Figure 6, DIP-S3 shown in Figure 7 and DIP-S6 shown in Figure 8. Package Outline and Dimension STK5C4U332J−E (DIP−S)
  • Page 7 COMPACT IPM SERIES EVB STK5Q4U3xx series (DIP−S3) Unit: mm Missing Pin: 15, 16, 21, 23, 24, 25, 27, 29, 30, 31, 33, 35, 36, 37 Note1: No. 1 pin identification mark Note2: Model number Note3: Lot code *The form of a character in this drawing differs from that of IPM.
  • Page 8 COMPACT IPM SERIES EVB NFAQxx60xxx series (DIP−S6) Figure 8. DIP−S6 Package Outline Recommended Land Pattern Figure 9. Recommended Land Pattern www.onsemi.com...
  • Page 9 COMPACT IPM SERIES EVB HEAT SINK MOUNTING Heat Sink Mounting and Torque If a heat sink is used, insufficiently secure or inappropriate 2. Highly thermal conductive silicone grease needs to mounting can lead to a failure of the heat sink to dissipate be applied to the whole back (substrate side) heat adequately.
  • Page 10 COMPACT IPM SERIES EVB Mounting and PCB considerations In designs in which the printed circuit board and the heat sink are mounted to the chassis independently, use a mechanical design which avoids a gap between IPM and the heat sink, or which avoids stress to the lead frame of IPM by an assembly that slipping IPM is forcibly fixed to the heat sink with a screw.
  • Page 11 LIMITATIONS OF LIABILITY: ON Semiconductor shall not be liable for any special, consequential, incidental, indirect or punitive damages, including, but not limited to the costs of requalification, delay, loss of profits or goodwill, arising out of or in connection with the board, even if ON Semiconductor is advised of the possibility of such damages. In no event shall ON Semiconductor’s aggregate liability from any obligation arising out of or in connection with the board, under any theory of liability, exceed the purchase price paid for the board, if any.
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