Sony HCD-MDX10 - Compact Disk Deck Receiver Component Service Manual page 47

Cd deck receiver
Hide thumbs Also See for HCD-MDX10 - Compact Disk Deck Receiver Component:
Table of Contents

Advertisement

THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed
in each block.)
For schematic diagrams.
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
and
1
/
W or less unless otherwise
4
specified.
: internal component.
¢
• C : panel designation.
Note:
Note:
Les composants identifiés par
The components identi-
une marque ! sont critiques
fied by mark ! or dotted
line with mark ! are criti-
pour la sécurité.
cal for safety.
Ne les remplacer que par une
Replace only with part
piéce portant le numéro
number specified.
spécifié.
• U : B+ Line.
• V : B– Line.
• H : adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• Voltages are taken with a VOM (Input impedance 10 M ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: FM
g : VIDEO
E
: PB (DECK A)
d
: PB (DECK B)
G
: REC (DECK B)
J
: CD
c : CD (digital out)
a
: PB (MD)
j
: REC (MD)
p : PB (digital out)
l : REC (dihgital in)
• Abbreviation
CND : Canadian model.
G
: German model.
SP
: Singapore model.
MY
: Malaysia model.
HK
: Hong Kong model.
AR
: Argentine model.
KR
: korea model.
AUS : Australian model.
For printed wiring boards.
Note:
• X : parts extracted from the component side.
: parts mounted on the conductor side.
p
®
: Through hole.
• b : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• Indication of transistor
C
Q
These are omitted
B
C
E
B
E
These are omitted
WAVEFORMS
– BD (CD) SECTION –
1
3.1Vp-p
16.9MHz
IC101 ^§ XTAI
2
1.2Vp-p
(PLAY)
IC101 %¡ RF AC
3
2.5V
APPROX 500mVp-p (PLAY)
IC101 $¡ TE
4
2.5V
APPROX 200m Vp-p (PLAY)
IC101 #ª FE
5
2.4Vp-p
7.5 sec
IC101 @§ MDP
– 55 –
– BD (MD) (1/2) SECTION –
1
0.46Vp-p
IC101 1, 2 (I, J) (PLAY mode)
2
0.1Vp-p
IC101 4 (A) (PLAY mode)
3
0.06Vp-p
IC101 8, 9 (E, F) (PLAY mode)
– BD (MD) (2/2) SECTION –
4
3.1Vp-p
22.581MHz
IC121 !§ (OSCI)
5
3.2Vp-p
44.1kHz
IC121 @¶ (LRCK)
6
3.8Vp-p
2.822MHz
IC121 @• (XBCK)
7
3.8Vp-p
11.29MHz
IC121 @ª (FS256)
8
3.2Vp-p
176.4kHz
IC121 (º (FS4)
HCD-MDX10
– MAIN (3/4) SECTION –
1
5.2Vp-p
32.768kHz
IC501 !¡ XC-OUT
2
5.5Vp-p
16MHz
IC501 !£ X-OUT
– PANEL (1/2) SECTION –
1
3.4Vp-p
12.5MHz
IC601 (¡ X OUT
– MD DIGITAL (1/2) SECTION –
1
3.2Vp-p
10MHz
IC316 !£ (XOUT)
– 56 –

Hide quick links:

Advertisement

Table of Contents
loading

Table of Contents