Omron F150-3 Datasheet page 4

Compact frame shutter camera
● Compact with high resolution.
● An all-pixel reading method and square lattice CCD make
it possible to obtain a clear and detailed image suitable for
image processing.
● Equipped with an electronic shutter to handle high-speed
lines.
● The shutter speed can be adjusted for each scene from the
menu. Select the optimum shutter speed for the line speed
and work.
Image pre-processing
● Pre-processing such as smoothing, edge enhancement,
edge extraction, and background cut-off allow you to obtain
the optimum image for the inspection.
● Pre-processing can be performed in real time (simulta-
neously with image read-in).
Original image
High-precision gray search
● Position measurement at sub-pixel precision is possible us-
ing 256 graduation gray search processing. This feature is
ideal for high-precision positioning applications.
C-14
Features
Edge extraction
Measurement of fiducial
mark positions on a printed
circuit board
Damage/dirt inspection
● Omron's proprietary algorithm enables fast and detailed in-
spection for visual defects such as chips, nicks, burrs, and
dirt.
● Linear, circular and rectangular areas can be set, enabling
inspection for a variety of defect shapes.
Gray edge measurement
● High-precision (sub-pixel) measurement of work edge posi-
tion is possible. Ideal for width and dimension inspection.
● Includes edge number and pitch measurement functions for
support of IC and connector lead inspection.
Output computation functions
● Measurement data computations such as the four arithmet-
ical operations, minimum, maximum, distance between two
points, and angle can be set from the menu.
● Up to 24 computations can be set, and decision and data
output can be performed based on the computation results.
Rubber packing flare
inspection
Connector pin-pitch
inspection
Hole-to-hole distance
computation
Vision Systems