Daheng Imaging VENUS USB3 User Manual page 19

3) Heat dissipation of imaging board
The image sensor is sensitive to temperature. In order to ensure good imaging quality, the structure of the
user optical path system should use thermally conductive materials, and the mounting surface of the
structure should be in good contact with the heat conduction region of the imaging board. The following is
the heat conduction region of the imaging board:
Figure 3-10 The heat conduction region of the imaging board (split monocular camera)
Figure 3-11 The heat conduction region of the imaging board (split binocular camera)
4) Heat dissipation of acquisition board
When the temperature around the acquisition board exceeds 45 degrees, it is recommended that the user
dissipate heat on the main chip. Thermally conductive materials is used to transfer the heat of the main
chip to the housing / radiator with good thermal conductivity. The following is the heat conduction region
of the imaging board with the thermally conductive material:
Heat Conduction Region
© China Daheng Group, Inc. Beijing Image Vision Technology Branch
3.Installation Guideline
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