Philips 55PP9401 Service Manual page 19

General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain
tip temperature within the range 500°F to 600°F.
2. Use an appropriate gauge of resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well-tinned.
4. Thoroughly clean the surfaces to be soldered. Use a small wire-bristle (0.5 inch or 1.25 cm) brush
with a metal handle. Do not use Freon-propelled spray-on cleaners.
5. Use the following desoldering technique.
a. Allow the soldering iron tip to reach normal temperature (500°F to 600°F).
b. Heat the component lead until the solder melts. Quickly draw away the melted solder with an anti-
static, suction-type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach normal temperature (500°F to 600°F).
b. First, hold the soldering iron tip and solder strand against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil,
and hold it there only until the solder flows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit board printed foil or components.
d. Closely inspect the soldered area and remove any excess or splashed solder with a small wire-
bristle brush.
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