Maintenance
The INP Dump facility is used only
as
a
factory-level
support
tool.
It dumps the contents of the INP memory for analyzing the
exact state of the INP.
The
INP
Dump
facility
is
described
further in Appendix B.
5-4. SELF TEST
A self-test capability is included in the read-only memory
(ROM)
of
the
INP.
A small set of routines, diagnostics, and check-
points are included.
The intention of the self-test
feature
is
to provide a quick indication of whether the communications board
is functioning properly, without either shutting down the
system
or
changing
the
hardware
components.
This self test can be
actuated either by a software
command
from
the
host
computer
system
or
by the pressing of a hardware pushbutton switch.
Re-
sults of the test are available to the host system
as
a
status
word
or
to
the
pushbutton
operator
visually
through an LED
indicator bank located on the front edge of the
INP-MPU
printed
circuit assembly (PCA) board.
When
the
self
test
is
initiated
(either
manually
or
programmatically),
a
series
of
tests
or
checks
is set into
operation.
These tests that comprise the self-test
program
in-
clude the following:
•
Basic Instruction Set Test
•
ROM Test
•
Timer Interrupt Test
•
RAM Test
•
BISYNC Chip Test
•
SDLC Chip Test
As each test is successfully completed,
the
next
test
in
the
sequence is started until the self-test cycle has been completed.
The red LED indicators (located on the edge of the INP-MPU board,
near the self-test initiating RESTART switch, as shown in
figure
5-1)
wink
on
and
off
during
the test cycle (approximately 2
seconds in duration) and stop in a pattern that
shows
the
test
results.
If LEDs
O
and 7 (the ones at each end of the array) are
the only ones lighted, all tests
have
been
completed
success-
fully.
Any other pattern indicates a failure.
Table 5-1 (under
"Troubleshooting") shows the meanings of
various
LED
patterns.
5-3