Specifications - Biostar H170GT3 Manual

1�3 Specifications

Specifications

CPU Support
Chipset
Memory
Storage
LAN
Audio Codec
USB
Expansion Slots
Rear I/Os
Internal I/Os
Form Factor
OS Support
4 | Chapter 1: Introduction
Socket 1151 for Intel® Core i7 / i5 / i3 / Pentium / Celeron processor
Maximum CPU TDP (Thermal Design Power): 95Watt
* Please refer to www.biostar.com.tw for CPU support list.
INTEL® H170
Supports Dual Channel DDR4 2133/1866
4x DDR4 DIMM Memory Slot, Max. Supports up to 64 GB Memory
Each DIMM supports non-ECC 4/8/16GB DDR4 module
* Please refer to www.biostar.com.tw for Memory support list.
2x SATA III (6Gb/s)
1x SATA Express Connector (16Gb/s) / 2x SATA III (6Gb/s)
1x PCIe 3.0 x4 M.2 (Key M) Slot (32Gb/s)
supports RAID 0,1,10, 5 & AHCI
* PCI-E Storage supports RAID 0 & 1
Intel i219V
1x 10/ 100/ 1000 Mb/s auto negotiation, Half / Full duplex capability
ALC887
7.1 Channels, High Definition Audio, Hi-Fi(Front)
INTEL® H170:
8x USB 3.0 port (4 on rear I/Os and 4 via internal headers)
6x USB 2.0 port (2 on rear I/Os and 4 via internal headers)
2x PCIe 3.0 x1 Slot
1x PCIe 3.0 x16 Slot (x4)
1x PCIe 3.0 x16 Slot (x16)
1x PS/2 Mouse
1x PS/2 Keyboard
1x DVI-D Port
2x HDMI Port
4x USB 3.0 Port
2x USB 2.0 Port
1x LAN port
3x Audio Jack
2x SATA III
1x SATA Express Connector / 2x SATA III
2x USB 2.0 Header (each header supports 2 USB 2.0 ports)
2x USB 3.0 Header (each header supports 2 USB 3.0 ports)
1x 8-Pin Power Connector
1x 24-Pin Power Connector
1x CPU Fan Connector
2x System Fan Connector
1x Front Panel Header
1x Front Audio Header
1x Clear CMOS Header
1x COM Port Header
uATX Form Factor, 230 mm x 244 mm
Windows 7/ 8.1(64bit)/ 10(64bit)
Biostar reserves the right to add or remove support for any OS with or without notice.