Download Print this page

HP E-MSM466-R Product End-Of-Life Disassembly Instructions page 2

Hide thumbs Also See for E-MSM466-R:

Advertisement

Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
screw driver
screw driver
screw driver
screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Screw off 14 86.0RNAA.021 screws on the enclosre.
2.
Remove RF cable and screw off the N-type connector
3.
Remove cable onnector between main board and surge board
4.
Screw off 14 86.RAWC1.003 screws and remove bracket adapter
5.
Remove heater from surge board
6.
Screw off 4 86.0RNAA.019 screws to remove surge board from barcket adapter
7.
Remove RF module
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
0
Tool Size (if
applicable)
#2
T20
Hex
Sleeve 8mm
#1
Page 2

Advertisement

loading

This manual is also suitable for:

J9715aJ9716aJ9717aJ9718a