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Item Description
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Description #1 Torx screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
<For 9004-LTE>
1. Remove four rubber feet from bottom side.
2. Remove four M3 screws by using T10 Torx screwdriver, then remove the bottom housing.
3. Remove one M3 screw by using T10 Torx screwdriver.
4. Discount five cables from connectors on PCBA by hands, then remove the PCBA.
5. Remove Battery from PCBA top side.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
MF877-00
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Notes
Tool Size (if
applicable)
T10
MF877-01
Quantity
of items
included
in product
0
Page 2
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