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Item Description
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Unscrew the screws on mounting angles 1, and then remove mounting angles 1.
2.
Remove the films 2.
3.
Unscrew the screws on cover 3, and then remove cover 3.
4.
Unscrew the screws on fans 4 and unconnected the wires, then remove fans 4.
5.
Unscrew the screws on POWER (part 5) and unconnected the wires, then remove part 5.
6.
Unscrew the screws on part 6, then remove part 6.
7.
Unscrew the screws on PCB (part 7) and remove part 7.
8.
Unscrew the screws on PCB (part 8) and remove part 8.
9.
Unscrew the screws on PCB (part 9) and remove part 9.
10.
Unscrew the screws and support ports on PCB (part 10) and remove part 10.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
MF877-00
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Notes
Tool Size (if
applicable)
2#
MF877-01
Quantity
of items
included
in product
0
0
Page 2
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