Soldering; Reflow Temperature - Ebyte E83-2G4M03S User Manual

Chengdu Ebyte Electronic Technology Co., Ltd.

7 Soldering

7.1 Reflow temperature

Reflow Profile Characteristics
lowest temperature
maximum temperature
Preheat/Keep Warm
time（Tsmin~Tsmin）
Heating slope（TL~Tp）
liquidus temperature（TL）
Hold time above TL
Package body peak temperature Tp
Time (Tp) within 5°C of the specified
grading temperature (Tc), see the figure
below
cooling slope（Tp~TL）
Time from room temperature to peak
temperature
※The peak temperature (Tp) tolerance definition of the temperature profile is the upper limit of the user
Copyright © 2002 , Chengdu Ebyte Electronic Technology Co., Ltd.
Leaded process assembly
（Tsmin）
（TSMDx）
The user
temperature
product's "Moisture Sensitivity"
label
100℃
150℃
60-120 seconds
3°C/sec, max
183℃
60~90 seconds
cannot exceed the
indicated on the
20 seconds
6°C/sec, max
6 minutes, maximum
E83-2G4M03S User Manual
Lead-free process assembly
150℃
200℃
60-120 seconds
3°C/sec, max
217℃
60~90 seconds
The user cannot exceed
temperature indicated
product's "Moisture Sensitivity"
label
30 seconds
6°C/sec, max
8 minutes, maximum
the
on the
14