Module Is Easy To Damage; Ber(Bit Error Rate) Is High; Soldering Guidance; Reflow Soldering Temperature - Ebyte E01-ML01IPX User Manual

Chengdu Ebyte Electronic Technology Co. , Ltd.

6.2 Module is easy to damage

Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
Please check the stability of power source, the voltage cannot fluctuate too much.
Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
6.3

BER(Bit Error Rate) is high

There are co- channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
The extension line and feeder quality are poor or too long, so the bit error rate is high;

7.Soldering guidance

7. 1 Reflow soldering temperature

Profile Feature
Solder Paste
Preheat Temperature min
Preheat temperature max ( Tsmax)
Preheat Time ( Tsmin to Tsmax)( ts)
Average ramp- up rate( Tsmax to Tp)
Liquidous Temperature ( TL)
Time (tL) Maintained Above (TL)
Peak temperature (Tp)
Aveage ramp-down rate ( Tp to Tsmax)
Time 25 ℃ to peak temperature
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Curve characteristics
Solder paste
Min preheating temp.
(Tsmin )
Mx preheating temp.
Preheating time
Average ramp- up rate
Liquid phase temp.
Time below liquid phase line
Peak temp.
Average ramp- down rate
Time to peak temperature for 25 ℃
E01-ML01IPX
Sn- Pb Assembly Pb- Free Assembly
Sn96.5/Ag3/Cu0.5
Sn63/Pb37
100℃
150℃
60- 120 sec
3℃/second max 3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max 6℃/second max
6 minutes max 8 minutes max
User Manual
150℃
200℃
60- 120 sec
217℃
30-90 sec
230-250℃
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