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2.3
Reflow Profile for BGA Rework Station
The profile shall be according to SEMC profiling specification below.
Profile parameters are illustrated in table 2.3.
Reflow profile in this document always refers to the reflow profile which is measured
on the board/component with thermocouples and do not refer to the BGA Rework
Stations setting which can vary depending on the machine type and individual
machine. Verification of reflow profile shall be done on each set of equipment.
The following graph, in table 2.3.2, shows an example of a lead-free profile including
bottom heat and top heat. The profile for specific parts and specific equipment will
vary, but the maximum temperature must not be exceeded.
Table 2.3.2
290
250
200
150
100
50
0
1208-5032 REV 4
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Company Internal
Sony Ericsson Mobile Communications
Table 2.3.1
Ramp rate
Ramp rate cooling
Time above liquidus
Minimum temperature
Maximum component temperature
Time above 235°C
Recommended Total time
40
80
120
Reflow zone
160
200
Time [Seconds]
Working Instruction, Electrical
< 3°C/sec
< 6°C/sec
40-70 sec
235°C
260 °C
10-40 sec
Approx. 3-5min
260°C
245°C
230°C
240
280
150°C
125°C
5(28)
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