Sony Ericsson Z770i Working Instruction, Electrical
  1. Manuals
  2. Brands
  3. Sony Ericsson Manuals
  4. Cell Phone
  5. Z770i
  6. Working instruction, electrical

Sony Ericsson Z770i Working Instruction, Electrical

Hide thumbs Also See for Z770i:
Table of Contents

Advertisement

Quick Links

Download this manual
Working Instruction, Electrical
Applicable for Z770i
CONTENTS
1
2
3
1208-5032 REV 4
©
Company Internal
Sony Ericsson Mobile Communications
Moisture Sensitivity and Component Baking ...................................... 3
Lead-free Rework ................................................................................... 4
2.1
Lead-free Symbol .................................................................................. 4
2.2
Bottom Heat .......................................................................................... 4
2.3
Reflow Profile for BGA Rework Station ................................................. 5
2.4
Inspection .............................................................................................. 6
Replacement of components ................................................................ 7
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
............................................................................................ 16
3.18
3.19
3.20
3.21
3.22
3.23
3.24
3.25
3.26
3.27
3.28
3.29
3.30
3.31
L2200: Ind WW 4.7 uH K3012.............................................................24
3.32
3.33
V2431: Diode Protection 0.7 V SOD-882.............................................25
Working Instruction, Electrical
........................................................................... 8
........................................................................ 8
...................................................................... 9
..................................................................... 10
.................................................... 10
....................................................................... 11
........................................ 11
......................................................................... 12
................................................................ 12
............................................................ 13
................................................................ 13
......................................................... 14
............................................ 14
......................................................... 15
................................................ 16
.............................................. 18
........................................... 19
..................................................................... 20
........................................................................ 20
.................................................................... 21
.................................................................. 22
................................................. 22
.............................................. 23
....................................... 9
................... 15
...................................... 17
........................... 18
...................................... 21

Advertisement

Table of Contents
loading

Related Manuals for Sony Ericsson Z770i

Summary of Contents for Sony Ericsson Z770i

  • Page 1: Table Of Contents

    Working Instruction, Electrical Working Instruction, Electrical Applicable for Z770i CONTENTS Moisture Sensitivity and Component Baking ........3 Lead-free Rework ................... 4 Lead-free Symbol .................. 4 Bottom Heat ..................4 Reflow Profile for BGA Rework Station ..........5 Inspection ....................6 Replacement of components ..............
  • Page 2 Z4200,Z4201,Z4202: LC Filter Array 0805 22pF ........25 3.35 N2205: DC/DC Converter..............26 IC Amp 9-Pin Flip-Chip ............26 3.36 N3100: 3.37 V4205,V4206: Trans Array..............27 3.38 Z2400: Filter 100, MHz K1210 ............27 Revision history ................... 28 2(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 3: Moisture Sensitivity And Component Baking

    </=30° C; 60% rh; shipped in dry pack; must be re-baked after being opened if floor life is exceeded. Parts shipped from the Sony Ericsson Parts Warehouse are most likely NOT shipped in dry pack. This means the time elapsed between placing the order and receiving the parts must be considered as time exposed to the environment.

  • Page 4: Lead-Free Rework

    Because of the higher temperatures required for lead-free solder, bottom heat is strongly recommended for rework of all ASICs. This does not include small transistors or chips, but it does include fine pitch components and BGA type components. 4(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 5: Reflow Profile For Bga Rework Station

    The profile for specific parts and specific equipment will vary, but the maximum temperature must not be exceeded. Table 2.3.2 Reflow zone 260°C 245°C 230°C 150°C 125°C Time [Seconds] 5(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 6: Inspection

    Also, lead-free solder does not flow as well as leaded solder, so some of the solder pad area may remain exposed. Good Leaded Solder Joints Good Lead-free Solder Joints 6(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 7: Replacement Of Components

    • Remove Film and Labels on PCBA, BB shielding can, and Liquid intrusion indicators in advance if necessary before repairing PCBA. MECHANICAL INSTRUCTIONS For all the following part replacements, disassemble and assemble the phone as described in Working Instruction 1208-3142 7(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 8: X1200: Conn Antenna

    X1201: Coax Connector REMOVE FILM AND LIQUID INTRUSION INDICATORS IN ADVANCE! PROTECT THE SYSTEM CONNECTOR AND SIM CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Station to replace the Coax Connector. 8(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 9: X1202:Ant Gnd Connector Leaf Spring 1P

    X2200: Battery Connector REMOVE FILM AND LIQUID INTRUSION INDICATORS IN ADVANCE! PROTECT THE M2 CARD CONNECTOR AND SIM CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Station to replace the Battery Connector. 9(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 10: X2400:System Connector

    Use BGA Station to replace the System connector. X3100: Con X Keyboard connector REMOVE FILM IN ADVANCE! M2 CARD PROTECT CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Station to replace the Con X Keyboard connector. 10(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 11: X4200:Lcm Connector

    X4200: LCM Connector Use BGA Station to replace the LCM Connector. N1400: Module Bluetooth + FM STLC2592 Cut the pickup area firstly. Use BGA Station to replace the BT/FM Module. 11(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 12: B4200: Smd Vibrator

    3.10 X2403: SIM Card Connector REMOVE FILM IN ADVANCE! PROTECT THE M CARD CONNECTOR AND BATTERY CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Station to replace the SIM Card Connector. 12(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 13: X2405: Ms-Micro Pico Holder

    3.12 N3101: ASIC Tjatte3 CSP20 PCBA REMOVE LABELS AND FILM IN ADVANCE PROTECT THE CONNECTOR AND SYSTEM CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Station to replace the ASIC Tjatte3 CSP20. 13(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 14: D2105:Ic Single Bus Buffer Gate

    Use BGA Station to replace the IC Single bus buffer gate. 3.14 D2400: IC IF ISP1508 ES3 (3.5*3.5*0.8) Use BGA Station to replace the IC IF ISP1508 ES3 (3.5*3.5*0.8) 14(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 15: L2401-L2404:Filter 0.0 Hz 0402

    Use Hot Air Station to replace the Filter 0.0 Hz 0402. 3.16 N2203: 2ch-LDO, Vout1=2.8V, Vout2=1.8V, WL-CSP6 PROTECT THE LCM CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Repair Station to replace the 2ch-LDO, Vout1=2.8V, Vout2=1.8V, WL-CSP6. 15(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 16: N2400: Ic

    3.18 N2402:IC ESD Prot UDFN 6 2x2 mm PCBA REMOVE LABELS IN ADVANCE PROTECT THE SYSTEM CONNECTOR AND RF CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Station to replace the IC ESD Prot UDFN 6 2x2 16(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 17: Ear Speaker:ear Speaker 1107.0 Rectangular

    Working Instruction, Electrical 3.19 Ear speaker: Ear Speaker 1107.0 Rectangular Use Hot Iron to replace the Ear Speaker 1107.0 Rectangular. 17(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 18: Loudspeaker:loudspeaker 1318.0 Oval

    PROTECT THESYSTEM CONNECTOR WITH HEAT RESISTANT TAPE PAY MORE ATTENTION ABOUT THE PART DIRECTION Use Hot Air Station to replace the Diode Zener 15, V SOD523 V2420—Left, V2421--Right V2422: 18(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 19: E1000:Shield Can Closed Small Shielding

    REMOVE FILM AND LABELS IN ADVANCE PROTECT THE SIM CONNECTOR AND RF CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Repair Station to remove the Shield Can Closed small shielding. 19(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 20: E1001:Shield Can Fence

    Use BGA Station to replace the Shield Can Fence. 3.24 N2202: IC Vreg SON-6 REMOVE FILM IN ADVANCE PROTECT SIM CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Station to replace the IC Vreg SON-6. 20(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 21: B4410:Ic Lin,Mr Sensor

    3.26 N2204: LDO1.2 V, 200mA, low noice, CS 5 ROTECT THE LCM CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Station to replace the LDO1.2 V, 200mA, low noice, CS 5. 21(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 22: B2102:Crystal 32,768 Khz

    Use BGA Station to replace the Crystal 32,768 kHz. 3.28 N1200: RF-Module Thor Pre-bumped PCBA REMOVE LABELS IN ADVANCE PROTECT SYSTEM CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Station to replace the pre-bumped Mod Radio Thor GSM/EDGE. 22(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 23: N1210: Rf-Module Squid Pre -Bumped

    3.30 C3137, C3141: Capacitor Ceramic 220,0 nF +/-10% 6,3 V REMOVE BB SHEILDING CAN IN ADVANCE Cut the pickup area firstly. Use Hot Air Station to replace the Capacitor Ceramic 220,0 nF +/-10% 6,3 V 23(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 24: L2200: Ind Ww 4.7 Uh K3012

    Use Hot Air Station to replace the Ind WW 4.7 uH K3012. 3.32 V2202: TRANS V;DUAL_PMOSFET;BYX101603_A;REQ318 REMOVE SHEILDING FILM IN ADVANCE PROTECT SIM CARD CONNECTOR WITH HEAT RESISTANT TAPE Use BGA Station to replace the TRANS V;DUAL_PMOSFET;BYX101603_A;REQ318. 24(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 25: V2431: Diode Protection 0.7 V Sod-882

    LCM CONNECTOR PROTECT WITH HEAT RESISTANT TAPE Use BGA Station to replace the LC Filter Array 0805 22pF. Note: From left to right, their positions are Z4200, Z4201, and Z4202. 25(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 26: N2205: Dc/Dc Converter

    Use BGA Station to re-solder the small shielding. 3.36 N3100: IC Amp 9-Pin Flip-Chip REMOVE BB SHEILDING CAN LID IN ADVANCE Use BGA Station to replace the IC Amp 9-Pin Flip-Chip . 26(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 27: V4205,V4206: Trans Array

    Left: V4206 Right: V4205 3.38 Z2400: Filter 100, MHz K1210 LCM CONNECTOR AND RF CONNECTOR PROTECT WITH HEAT RESISTANT TAPE Use BGA Station to replace the Filter 100, MHz K1210. 27(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

  • Page 28: Revision History

    Working Instruction, Electrical 4 Revision history Rev. Date Changes / Comments 2008-03-17 First release 2008-04-01 Delete N3100 2008-04-03 Add C3137, C3141, L2200, V2202, V2431, Z4200,Z4201,Z4202, N2205 2008-04-07 Add N3100,V4205,V4206,Z2400 28(28) 1208-5032 REV 4 © Company Internal Sony Ericsson Mobile Communications...

Table of Contents