Bga Equipment Reflow Profiles - Sony Ericsson K700i Working Instruction, Electrical

2 BGA Equipment reflow profiles

These values are strongly depending on the BGA replacement equipment.
Nozzle type will be chosen after the outer size of the actual component. Make sure the nozzle
does not affect any near placed components.
NOTE:
These values are recommendations and may have to be changed depending on the type of
equipment.
General reflow profile sn/pb
Preheat zone
250
200
150
100
50
0
0 40
Ramp rate
Ramp rate cooling zone
Time above liquidus
Minimum temperature
Maximum temperature
Total time
3/00021-2/FEA 209 544/83 A
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Company Internal Sony Ericsson Mobile Communications AB
80 120
Time [Seconds]
The higher temperature in case the board has extremely high ∆T.
*
Reflow zone
Cooling zone
160 200
< 3°C/sec
< 6°C/sec
60-150 sec
215°C
225°C or 235°C for 10-20 sec
Appr. 4-7 min
Working Instruction, Electrical
240 280
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