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Tool Description
Screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on mounting angle 1, and then remove mounting angle 1.
2. Unscrew the screws on mounting angle 2, and then remove mounting angle 2.
3. Unscrew the screws on filler panel 3, and then remove filler panel 3.
4. Unscrew the screws on fan-assembly 4, and then remove fan-assembly 4.
5. Remove the filler panel 5.
6. Remove the power 6.
7. Unscrew the screws on top cover 10, and remove top cover 10.
8. Unscrew the screws on front panel 7, and then remove front panel 7.
9. Unscrew the screws on bracket 9, and then remove bracket 9.
10. Unscrew the screws on bracket 11, and then remove bracket 11.
11. Unscrew the screws on heat sink 12, and then remove heat sink 12.
12. Unscrew the screws on PCB 13, and remove PCB 13.
13. Remove all of the labels.
14. Remove film 4-8.
15. Unscrew the screws on 4-7, and then remove 4-7.
16. Unscrew the screws on 4-6, and then remove 4-6.
17. Unscrew the screws on 4-5, and then remove 4-5.
18. Unscrew the screws on 4-4, and then remove 4-4.
19. Unscrew the screws on pcb 4-9, and then remove 4-9.
20. Unscrew the screws on pulled handle 4-1, and then remove pulled handle 4-1.
21. Remove lamp 4-2.
22. Remove bushing 4-3.
23. Unscrew the screws on 5-1, and then remove 5-1.
24. Remove shielding finger 5-3.
25. Remove film 7-1.
26. Remove film 7-2.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Tool Size (if
applicable)
2#
Page 2
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