Page 1 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. This manual provides the information necessary to install, program, operate and maintain the G5500/7050.
Page 2: Table Of Contents
3.4 Analog Baseband (ABB) Processor …...… 7.1 Service S/W ……........3.5 Camera Circuit ……..……………………… 7.2 Calibration ……………….…...….………. 4. TROUBLE SHOOTING ....… 51 4.1 Main Components Placement(G5500) ... 8. CIRCUIT DIAGRAM .....………... 129 Main Components Placement(G7050) ... 8.1 BB ………..……………......4.2 Main Components .....…..
Page 3 Table of Contents 10. ENGINEERING MODE ....141 11. STANDALONE TEST ..... 142 11.1 Setting Method .........…. 142 12. EXPLODED VIEW & REPLACEMENT PART LIST..143 12.1 Exploded View .........…. 12.2 Accessory ……………………………….. 12.3 Replacement Parts <Mechanic components> ……………….. Replacement Parts <Main components>………………………...
Page 4: Introduction
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the G5500/7050 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
Page 5 E. Notice of Radiated Emissions The G5500/7050 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
Page 6: Abbreviations
1.3 Abbreviations For the purposes of this manual, following abbreviations apply: Automatic Power Control Baseband Bit Error Ratio CC-CV Constant Current – Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milliwatt Digital Signal Processing EEPROM Electrical Erasable Programmable Read-Only Memory Electroluminescence Electrostatic Discharge...
Page 7: General Performance
2. General Performance 2.1 Product Name G5500/7050: Support GPRS (Class 10) 2.2 Supporting Standard Item Feature Comment E-GSM/ DCS Dual Band with seamless handover Supporting Standard Phase 2+ SIM Toolkit : Class 1,2,3,A~E E-GSM TX : 880 – 915 MHz E-GSM RX : 925 –...
Page 8: H/W Features
2.4 H/W Features Item Feature Comment Form Factor Slide Down LCD (65K Color) Capacity Cell Size: Standard Standard: Li-Ion, 860mAh 55(L)×33.7(W)×49.5(H)mm Battery Packing Type: Hard Pack Size Standard: 94×44×21.5mm L×W×H Weight With Battery Main PCB: 8Layers, 1t Keypad PCB: 2Layers, 0.6t AVG TCVR Max : 260 mA (Power Level 5) Estimated...
Page 9 Item Feature Comment Antenna Fixed Type System connector 24 Pin Ear Phone Jack 3 Pole (φ2.5mm) PC synchronization CDROM Memory Flash : 128Mbit / SRAM : 64Mbit Speech coding FR, EFR, HR Data & Fax Built in Data & Fax support Vibrator Built in Vibrator IrDA...
Page 10: S/W Features
2.5 S/W Features Item Feature Comment RSSI 0~5 level Antenna Battery Charging 0~3 level Key Volume 0~5 level Keypad Volume 0~5 level Effect sound volume 0~5 level Ring Volume 1~5 level Time/Date Display Text Input Multi-language Schedule/Ring Tone/Phonebook Quick Access Mode Camera/GPRS/Phonebook(G7050) PC Sync Schedule/Phonebook/SMS...
Page 11 Item Feature Comment Mute Call Divert Call Barring Call Charge Call Duration SMS (EMS) Melody/Picture/Animation Send/Receive/Save WAP Browser WAP 2.0 Java CLDC v1.0.3 / MIDP v1.0.3 Wall Paper Max. 10 preset Download Melody/ Over the WAP Wallpaper (MMS) Long Message Mac.
Page 12: H/W Circuit Description
3. H/W Circuit Description 3.1 RF Transceiver General Description The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a VC-TCXO part. The Aero transceiver is composed of three RF chipsets, Si4200-BM[U502], Si4133T-BM[U505] and Si4201-BM[U503] which is a dual and triple-band GSM/GPRS wireless communications.
Page 13 Figure 1. RF Receiver Block FL501 U502/Si4200 U503/Si4201 100KHz 100KHz Antenna Switch FL502 EGSM EGSM Baseband Baseband (TI) (TI) U102 U102 IOTA IOTA FL503 U101 U101 U505/Si4133T Calypso Calypso U506 ÷2:GSM 0˚/ (CO35) ÷2:GSM 0˚/ (CO35) VC-TCXO 90˚ 90˚ ÷1:DCS ÷1:DCS 13MHz U504...
Page 14 3.2.2. IF A quadrate image-rejection mixer downconverts the RF signal to a 100kHz intermediate frequency (IF) with the RFLO from the Si4133T-BM[U505]. The RFLO frequency is between 1849.8 and 1918.8 MHz, and is divided by two in the Si4200 for EGSM modes. The RFLO frequency is between 1804.9 and 1879.9 MHz, and is divided by one in the Si4200 for DCS modes.
Page 15 Transmit modes should always use fø = 200kHz. The IF and RF output frequencies are set by programming the N-Divider registers and also programmed via 3-wire interface with external system controller. Figure 2. Synthesizer Block Baseband Baseband (TI) (TI) U505/Si4133T U506 U102 U102...
Page 16 Figure 3. RF Transmit Block FL501 Antenna Switch RF_Lo(Tx) IF_Lo(Tx) U504 RF3133 Baseband Baseband (TI) (TI) U102 ÷2 U102 ÷2 IOTA IOTA U101 U101 Calypso EGSM Calypso ÷1 ÷1 Φ (CO35) Φ (CO35) ÷2 ÷2 PA_BAND GATE_VC1 GATE_VC2 3.2.6. IF Modulator The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the Transmit vector modulator.
Page 17 3.2.8. Power Amplifier The RF3133 [U504] is a triple-band GSM/DCS/PCS power amplifier module that incorporates an indirect closed loop method of power control. The indirect closed loop is fully self-contained and it does not require loop optimization. It can be driven directly from the DAC output in the baseband circuit.
Page 18 3.2.10. Power Supplies and Control Signals An external regulator(U508) is used to provide DC power to RF part. Every RF component except power amp module uses this external regulator. Figure 6 External regulator Circuit -19-...
Page 19: Digital Baseband (Dbb) Processor
3.3 Digital Baseband (DBB) Processor Figure 7. Top level block diagram of the Calypso G2(HERCROM400G2) 3.3.1. General Description CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone. This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a Micro- - Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bit SRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOS gates.
Page 20 3.3.2. Block Description CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEA bus standard as interface with their associated application peripherals. CALYPSO is composed from the following blocks: • ARM7TDMIE : ARM7TDMI CPU core •...
Page 21 3.3.3. External Devices connected to memory interface Table 3-2. Memory interface Write Read Device Name Maker Access Time Access Time FLASH1 AM50DL128CG70I 70ns 70ns FLASH2 AM50DL128CG70I 70ns 70ns SRAM AM50DL128CG70I 70ns 70ns S6B33B0A 50ns 50ns Melody IC YMU762 Yamaha 50ns 80ns 3.3.4.
Page 22 SIMCLK SIMCLK SIMIO SIMIO SIMRST SIMRST 150p 150p 3.3.6. UART Interface G5500/7050 has two UART Drivers as follow : UART1 : Hardware Flow Control / Fax & Data Modem UART2 : Handsfree Control / SW trace or IrDA Modem -23-...
Page 23 Figure 3-4. UART Interface spec. UART MODEM (UART1) Resource Name Description TX_MODEM Transmit Data RX_MODEM Receive Data CTS_MODEM Clear To Send RTS_MODEM Request To Send GPIO 3 Data Set Ready UART IrDA (UART2) Resource Name Description TXIR_IRDA TX_IRDA Infra-Red Transmit Pulse TX_IRDA Transmit Data(UART2) RXIR_IRDA...
Page 24: Analog Baseband (Abb) Processor
3.3.7. GPIO Map In total 16 allowable resources, G5500/7050 is using 13 resources except 3 resources dedicated to SIM and Memory. G5500/7050 GPIO (General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table. Table 5. GPIO Map Table...
Page 25 • Battery charging control • Switch ON/OFF • 1.8V/3V SIM card Interface • 4 internal & 4external ADC channels Figure 9. Top level block diagram of the IOTA(TWL3014CGGM) -26-...
Page 26 3.4.2. Audio Signal Processing & Interface The voice codec circuitry processes analog audio components in the voice uplink (VUL) path and applies this signal to the voice signal interface for eventual baseband modulation. In the voice downlink (VDL) path, the codec circuitry changes voice component data received from the voice serial interface (VSP) into analog audio.
Page 27 3.4.3. Audio uplink processing The VUL path includes two input stages. The first stage is a microphone amplifier, compatible with electret microphones containing a FET buffer with open drain output. The microphone amplifier has a gain of typically 25.6 dB (±1 dB) and provides an external voltage of 2.0 V or 2.5 V to bias the microphone (MICBIAS).
Page 28 3.4.4. Audio downlink processing The VDL path receives speech samples at the rate of 8 kHz from the DSP via the VSP and converts them to analog signals to drive the external speech transducer. The digital speech coming from the DSP is first fed to a speech digital filter that has two functions.
Page 29 3.4.6. Voltage Regulation (VREG) There are 7 LDO (Low Drop Output) regulators in ABB chip. The output of these 7 LDOs are as following table. (Figure14) shows the power supply related blocks of DBB/ABB and their interfaces in G5500/7050. -30-...
Page 30 Figure 14. Power Supply Scheme -31-...
Page 31 Table 3-6. LDO Output Table Output Voltage Usage VRDBB 1.5V Digital Core of DBB VRIO 2.8V Peripheral devices VRMEM 2.8V External memory VRRAM 2.8V LCD & peripheral devices VRABB 2.8V Analog Block of ABB VRSIM 2.85V SIM card driver VRRTC 1.5V RTC &...
Page 32 3.4.8. Charging Charging block in ABB processes charging operation by using VBAT, ICHG value through ADC channel. Battery Block Indication and SPEC of G5500/7050 is as follow. Figure 15. Battery Block Indication 4.2V~3.82V 3.82V~3.73V 3.73V~3.62V 3.62V~3.35V 1. Charging method: CC-CV 2.
Page 33 ▶ IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin. ▶ CHARGER_IC :When a charger voltage is above VBAT+0.4V on VCHG. 3.4.10. Memories G5500/7050 using 128Mbit Flash + 64Mbit SRAM with 16 bit parallel data bus thru ADD01 ~ ADD22. 3.4.11. Display & FPCB Interface LCD module include: ▶...
Page 34 LCD connector Interface Spec. Table 3-8 LCD connector Interface Spec. Pin Name Pin Description Backlight LCD Back Light VBAT Battery Voltage L_LCD_CS LCD Chip Select LCD_RESET LCD Reset L_A(1) Address Data Selection L_WR LCD Write Control L_D(0) Data input L_D(1) Data input L_D(2) Data input...
Page 35 3.4.12. Keypad Switching & Scanning Table 3-9. Keypad Map KBC0 KBC1 KBC2 KBC3 KBC4 KBR0 [Vol_Down] [Vol_Up] [OK] [REC] [CAM] KBR1 [F2] [▲] KBR2 [SEND] [◀] KBR3 [F1] [▼] KBR4 [▶] DBB supports 25 Key Map and Switch-ON Key is connected directly to ABB as (Figure16 ). Figure 16.
Page 36 3.4.13. Keypad back-light Illumination There are 12 Deep Blue LEDs in Main Board for Keypad Backlight. Keypad Back-light is driven by ‘LEDB’ line from IOTA . Figure 17. Keypad Back-light Scheme 3.4.14. LCD Illumination There are 3 LEDs in the LCD module for LCD backlighting. DC-DC converter is mounted in LCD module.
Page 37 3.4.15. Audio Circuit Figure 19. Microphone system Microphone circuits Main PCB -38-...
Page 38 Keypad PCB When a call is established, MICBIAS signal goes up to ‘2.5V’ in the G5500/7050. IOTA(ABB) provides both 2.0V and 2.5V for MICBIAS to circuit designer. VA102, VA103 are employed to enhance ESD immunity. -39-...
Page 39 Head set Jack Interface Figure 20. Ear-Jack interface When ear-mic set or head set plug is inserted into the receptacle, JACK_DETECT signal change from ‘L’ to ‘H’. If hook button is pushed for a second to make a call, then HOOK_DETECT signal goes from ‘H’...
Page 40 Speaker Circuits Figure 21. Dual mode speaker system switch Single package dual analog switches are employed to support both voice and MIDI sound mode with one speaker. The speaker is designed to support both receiver and loud speaker characteristics. If the SPK_EN port sets ‘H’, then the speaker will operate as loud speaker. The other case, the SPK_ EN port will remain ‘L’...
Page 41 MIDI SOUND circuit description Figure 22. MIDI sound Circuit Midi synthesizer circuit includes YMU762B, external regulator(3.3V output) -42-...
Page 42 The YMU762 has features as described below. • Simultaneous generation of up to 40 tones: • Polyphonic synthesizer specification • Has built-in default tones for FM and Waveform table synthesizers in the ROM, and the tones can be downloaded to RAM. •...
Page 43: Camera Circuit
3.5. Camera Circuit (G7050 only) Under camera action mode, CLC344E wholly controls LCD by itself to execute camera functions, while, under bypass mode, CLC344E lets all LCD driver-related signals bypass it, as if it does not exist at all in the system. Figure 23.
Page 44 Figure 24. CLC344E, Camera Chip Block Diagram The camera IC, CLC344E, is controlled through _RD, _WR, CAM_INT, CAM_HOLD, CAM_RST, ADD[1-6], DATA[0-15] by PD751992GHH(DBB). In by-pass mode, CLC344E bypasses all LCD control signal from PD751992GHH(DBB) to LCD module. In operating mode, CLC344E samples the image data from camera sensor connected on CN601 through C_CD[0-7], C_MCLK, C_PCLK, C_HS, C_VS, C_SDA, C_SCK, C_RST signals and controls the LCD module through L_A(1), L_D[0-15], L_WR, L_LCD_CS.
Page 45 Table 3-10. CLC344E Interface Port Name Description Write control to CLC344E or LCD module Read control. The phone do not read data from LCD chip CAM_INT Interrupt to DBB. It can be set to level or edge interrupt This signal determines the camera operation mode. Making high, CAM_HOLD disable all CLC344E functions CAM_RST...
Page 46 Figure 25. CLC344E, Camera Chip Circuit -47-...
Page 47 Figure 26. LCD Connection Thru CLC344E, Camera chip 3.5.2. CMOS Image Sensor General description of CIS Camera Module • Optical Size: 1/4 inch • Unit Pixel: 5.6 μm X 5.6 μm • Effective Resolution: 640X480, VGA • 8.5mm X 9.5mm X 6.6mm module size •...
Page 48 Figure 27. Camera Module Block Diagram S5C7322X S5K433LA03 Image Signal Processor CMOS Image Sensor Lens Unit Line Buffer Pixel Array 640(H)×480(V) Pre Processor Luminance Chroma Signal Signal Timing Processor Processor Controller Post Processor MCLK VSYNC RISC Processor Output Formatter HSYNC PCLK DATA0-7 (AE,AWB Processor)
Page 49 Figure 28. Camera Module Circuit -50-...
Page 50: Trouble Shooting
4. TROUBLE SHOOTING 4.1 Main Components Placement (G5500) LED201 U303 SW501 Q201 BAT101 FL501 U203 U510 U204 J301 FL503 FL502 SW202 U508 U504 U502 LCD AREA U503 U505 U301 U506 U507 SW201 U302 U102 CN403 U101 X101 U202 Q203 CN602...
Page 51: Main Components Placement(G7050)
4.1 Main Components Placement (G7050) LED201 U303 CN601 Q601 Q201 SW501 BAT101 U203 FL501 U204 J301 U510 FL503 FL502 U508 SW202 U504 U502 LCD AREA U503 U301 U505 U506 SW201 U507 U302 U102 CN403 U101 X101 U202 Q203 U602 CN602 U601 U201 (LCD)
Page 52: Main Components
4.2 Main Components (Description) G5500 LED201 Indicator LED U201 Memory(128M Flash+64M SRAM) BAT101 Backup battery (3V) U202 IrDA port CN401 IO connector U203 Indicate LED control switch CN402 FPCB connector (Keypad) U204 Vibrator control TR X101 Crystal (24MHz oscillator) U301...
Page 53: Keypad Components Placement
4.3 Keypad Components Placement (Common) KEYPAD KEYPAD KEYPAD KEYPAD CN101 U101 (Hall Effect Switch) -54-...
Page 54: Baseband Components
4.4 Baseband Components LCD FRONT PART LCD REAR PART RECEIVER/SPK VIBTATOR -55-...
Page 55: Power On Trouble
4.5 Power On Trouble 4.5.1 Power On Sequence Connecting Battery • Power-On Key Detection • PWON signal goes to ABB and then ABB reset DBB by ON_OFF signal • ON_OFF turn low(1.5V) to HIGH(2.8V) and it resets Calypso 4.5.2 Check Points •...
Page 56: Charging Trouble
4.6 Charging Trouble • Charging method : CC-CV • Switch-off voltage : 3.35V • Charger detect voltage : Over 4.0V • Charging temperature adc range • Charging time : About 3hours -. ~ -5℃ : not charging operation. • Charging current : 420mA -.
Page 57 Charging Procedure Trouble Shooting Setup • Connecting TA & Charger Detection • Connect Battery & TA to the handset. • Control the charging Current by ABB • Charging Current flows into the Battery Check Points Trouble Shooting Procedure • Connection of TA •...
Page 58: Lcd Display Trouble
4.7 LCD Display Trouble Check soldering around connector LCD Control Signals From Main Board • Backlight, L_LCD_CS, LCD_RESET, L_WR, LCD_ID, L_A(1), L_D(0)~L_D(15) Check Points • The Assembly status of the LCD Module. • The Soldering of connectors • The FPCB which connects the LCD module with the main board. Trouble Shooting Setup •...
Page 59 START Refer to Power is supplied to Power On Trouble the board? Connection between Reconnect LCD Module and board is OK? Module CN602 is soldered well? Resolder the CN602 Paths of LCD control Resolder signals are OK? R658, R619-R638 After changing the board, The board is broken.
Page 60: Receiver Trouble
4.8 Receiver Trouble Block Diagram Control SPKP/SPKN Calypso YMU762 (U101) (U301) Analog SW RECEIVER SPK_RCVP/ (U303) (SPK) SPK_RCVN RCV_P/ EAR_P/ RCV_N EAR_N IOTA RC filter (U102) Melody Generation • U301(YMU762,MIDI) is controlled by DBB. • U301 generates 40poly MIDI sound and it is delivered to the speaker via U303 (analog SW) & connector socket.
Page 61 Check the states these points ! Receiver Trouble Shooting Setup • Initialize GSM MS test equipment. • Connect PIF-UNION and power on. • Make a test call to 112. • Set audio part at test equipment as PRBS or continuous wave, not echo. •...
Page 62 4.8.1. Receiver Trouble START Set audio part at test equipment as PRBS or continuous wave, not echo. Set the audio volume max. ABB is out of order. Does sine wave appear Change the board. at R308, R309? Resolder the U303. SPK_EN signal is low? Otherwise change it.
Page 63 4.8.2. Speaker Trouble START Enter into Engineering Mode and → go to menu “Baseband → Alert Ring” Resolder the U303 Does sine wave appear SPK_EN signal is high? otherwise Change it. at C306, C307? Connection between Reconnect receiver and board receiver is OK? Resolder the U301...
Page 64: Microphone Trouble
4.9 Microphone Trouble Block Diagram IOTA Main Board Keypad -65-...
Page 65 Microphone Signal Flow Check Points • MIC is enable by MICBIAS • Microphone bias • MICBIAS, MICP, MICN signals to ABB • Audio signal level of the microphone • Soldering of components • Connection of FPCB Trouble Shooting Setup • Initialize GSM MS test equipment. •...
Page 66 START Connect the handset to network equipment and setup call. Resolder the The voltage of R116 The soldering of R330, R330, R321 is 2.5V? R321 is OK? Check the signal level at pin 1,2 of the MIC after putting audio signal into the MIC. ABB is out of order.
Page 67: Vibrator Trouble
4.10 Vibrator Trouble Block Diagram Vibrator Operation • Vibrator is controlled by MIDI chip • When vibrator signal is high, vibrator is enabled Check Points • VCC lines (V_IO) of MIDI chip • Vibrator signal path • The connection between the main board and vibrator module •...
Page 68 START Enter into Engineering Mode and select Vibrator Voltage of C308 Signal of pin1 of U204 Change the board is 2.8V is OK? U301 is out of order Resolder the U204, U204, R222, L201 are R222, L201 soldered well ? Connection Reconnection between between cable and...
Page 69: Keypad Backlight Trouble
4.11 Keypad Backlight Trouble Block Diagram Backlight Operation • The keypad LED backlight is controlled with KEY_LED signal. • KEY_LED signal from ABB. • The LEDs are forward biased and turned on. Check KEY_LED signal R113,R114 Trouble Shooting Setup • Connect PIF-UNION to the phone, and power on. •...
Page 70 START Enter into Engineering Mode and select Keypad On The Voltage ABB is out of order. of KEY_LED signal Operation of FPCB is OK? Change the Board. is about 0V? Power off and Measure the Resistor Value of all LEDs. Is there anything that ABB is out of order.
Page 71: Slide Open/Close Trouble
4.12 Slide Open/Close Trouble Block Diagram Keypad Main Board Flip Operation • There is a magnet to detect the Flip status, opened or closed. • If a magnet is close to the hall-effect switch(U101), the voltage at pin 2 of U101 goes to 0V. Otherwise, VBAT.
Page 72 START Resolder the The all paths connected C102,C103, C204,R411 to U101 are OK? Refer to The VBAT is over 3.35V? Power On Trouble. Change FPCB Operation of FPCB is OK? The Flip signal is low Replace the U101. on magnetizing into U101? U101 is broken.
Page 73: Sim Detect Trouble
4.13 SIM Detect Trouble Block Diagram V_IO V_SIM VRSIM DBBSIO SIM_IO DBBSCK SIM_CLK DBBSRST SIM_RST SIMCLK SIM_PWRCTRL S IMIO SIM_CD SIMRST 150p ④ ① ⑥ ③ Connection between SIM and DBB Check Points • SIM_CLK, SIM_IO, SIM_RST • Contact between SIM and socket -.
Page 74 START Insert the SIM Card Resolder the The soldering of SIM connector CN403. is OK? The all paths connected Resolder the to CN403 are OK? C403,C410,C402,R401 SIM card is broken. The SIM Card is OK? Change the SIM Card. The ABB(IOTA) is broken. Change the board.
Page 75: Earphone Trouble
4.14 Earphone Trouble Block Diagram EAR_JACK SPEC From U102(IOTA) SOUND The direction of the audio Signal from ear-mic To U102(IOTA) HSMICP Earphone Detecting Operation • The DBB read JACK_DETECT port periodically and if the voltage of Pin1 of U304 goes to High and the voltage at “JACK_DETECT”...
Page 76 The audio Signal to ear- “JACK_DETECT” The audio Signal to mic (L316, C319) signal (Pin1 of U304) ear-mic(L304) “HOOK_DETECT” signal(R319,C323) The audio Signal from ear-mic (L303,L305,C318) -77-...
Page 77 cf) PRBS : Pseudo Random Bit Sequence START Insert the earphone into the headset. Does the Audio profile change 1. Earphone detection problem to the earphone mode? Set the audio part of test equipment to PRBS or continuous wave mode Can you Soldering hear the sound...
Page 78 1. Earphone detection problem The soldering The Voltage Resolder the of C687,R311, at Pin1 of U304 C687,R311, R665. R665 is is 0V? The soldering of J301 Resolder the J301. is OK? Resolder The soldering of U304 the U304 is OK? The ABB is out of order.
Page 79 2. Sending Path problem Set audio part of the test equipment to the echo mode. The voltage at L303 Resolder the is 1.1V ~ 1.3V? L303,L305 A few tens or hundreds Resolder soldering of C318 of mV of signals at C318 the C318 is OK? are measured ?
Page 80: Infrared Data Association Trouble
4.15 Infrared Data Association Trouble Block Diagram Infrared Signal Flow • Infrared is enable by SD • TX_IRDA,RX_IRDA,SD_IRDA signals from DBB Check Points • Check the power supply. • Check the soldering of Components • Check the IrDA Transceiver -81-...
Page 81 Trouble Shooting Setup • Enter the engineering mode. • Go to menu ‘Baseband → IrDA Test’ Tx_IrDA Rx_IrDA Trouble Shooting Procedure SD_IrDA • Check the SD,TX, RX signal. • Check the soldering. • Check the IrDA Transceiver. Tx_IrDA Rx_IrDA Searching… Enabled (TX_IrDA) Enabled(RX_IrDA) -82-...
Page 82 START Set configuration like Fig 1. Execute PCSync program (ContentsBank.exe) Resolder the The power is supplied to U202? C202 The soldering of U201 is OK? Resolder the U201. The signal “TX_IrDA, RX_IrDA” Change the U201. are measured? The DBB is broken. Change the board.
Page 83: Camera Trouble
4.16 Camera Trouble (G7050 only) SETTING : Connect PIF, and set remote switch ON at PIF Checking Flow START Does the LCD Go to the LCD trouble itself has no trouble Set the camera button ON Check Check the voltage of Pin3 of Q601 is the voltage of Pin1 of Change the main board 2.85V...
Page 84 Test Points U602 U601 CN601 C633 Q601 C686 FB616 -85-...
Page 85 RF Rx pass Trouble Shooting START E5515C : Test Mode CH62, 7 level setting (TCH) CH62, -60 dBm setting (BCCH) Spectrum Analyzer setting Oscilloscope setting Check Regulator Circuit Check VCTCXO Circuit Check PLL Control Signal Check ANT SW & Mobile SW Check SAW Filter Circuit...
Page 86 Checking Regulator Circuit (Rx pass continued) Check Pin 1 Regulator circuit is OK See next page to check 2.85V? VCTCXO circuit Pin 6 High? Replace U508 Check U101 Pin 6 U508 Pin 1 Ch1 : Pin 1 Ch2 : Pin 6 -87-...
Page 87 Checking VCTCXO Circuit (Rx pass continued) Check Pin 3 of X3 VCTCXO circuit is OK See next page to check 13MHz ? ANT SW & Mobile SW Pin 4 2.85V ? Replace U506 Check U508 Pin3 Pin4 Pin 4 Pin 3 -88-...
Page 88 Checking PLL Circuit (Rx pass continued) Check S_CLK, S_EN, S_DATA Signal is Download SW normal? S_EN S_DATA PLL circuit is OK. See nest page to check ANT SW & Mobile SW S_CLK S_EN S_CLK S_DATA S_EN S_DATA S_CLK -89-...
Page 89 Checking ANT SW & Mobile SW (1) (Rx pass continued) Check SW501 Pin 1,2 with no RF cable connected Replace SW510 Short ? Check SW501 Pin 1,2 with RF cable connected Open ? Replace SW501 Rx standalone mode Check VC1, VC2 of FL501 is needed Replace VC1=Low...
Page 90 Checking ANT SW & Mobile SW (2) (Rx pass continued) SW501 pin1 FL501 SW501 pin2 FL501 -91-...
Page 91 Checking SAW Filter Circuit (Rx pass continued) Check RF Level FL502 Pin 4 FL503 Pin 4 Replace ≥ -65dBm FL502/FL503 SAW Filter circuit is OK. See next page to check Rx I/Q FL502 pin4 FL503 pin4 -92-...
Page 92 Checking Rx I/Q (Rx pass continued) Check I/Q Replace U503 I/Q is normal? Redownload the software & Calibration RXQP RXIP RXIP RXQP RXQN RXIN -93-...
Page 93 RF Tx pass Trouble Shooting START E5515C : Test Mode CH62, 7 level setting (TCH) CH62, -60 dBm setting (BCCH) Spectrum Analyzer setting Oscilloscope setting Check Regulator Circuit Check VCTCXO Circuit Check PLL Control Signal Check Tx I/Q Check PAM Control Signal Check ANT SW &...
Page 94 Checking Regulator Circuit (Tx pass continued) Check Pin 1 Regulator circuit is OK. See next page to check 2.85V ? VCTCXO circuit Pin 6 High ? Replace U508 Check U101 Pin 6 U508 Ch1 : Pin 1 Ch2 : Pin 6 Pin 1 -95-...
Page 95 Checking VCTCXO Circuit (Tx pass continued) Check Pin 3 of X3 VCTCXO circuit is OK. See next page to check 13MHz ? ANT SW & Mobile SW Pin 4 2.85V ? Replace U506 Check U508 Pin3 Pin4 파일 Pin 4 Pin 3 -96-...
Page 96 Checking PLL Circuit (Tx pass continued) Check S_CLK, S_EN, S_DATA Signal is Download SW normal? S_DATA S_EN PLL circuit is OK. See nest page to check ANT SW & Mobile SW S_CLK S_EN S_CLK S_DATA S_EN S_DATA S_CLK -97-...
Page 97 Checking Tx I/Q (Tx pass continued) Check I/Q Normal? Replace U102 Redownload the software and calibration TXIP TXQP TXQN TXIN TXQP TXIP -98-...
Page 98 Checking PAM Control Signal (Tx pass continued) Check APC, RF2.85V, PA_ON, PA_BAND Normal? Download the SW Control signal is OK. See next page to Check ANT SW & Mobile SW RF2.85V PA_BAND PA_ON RF2.85V PA_ON PA_BAND -99-...
Page 99 Checking ANT SW & Mobile SW (1) (Tx pass continued) Tx standalone mode is Check RF Level FL501 Pin 3,5 needed Replace U504 ≥ -63dBm Check VC1, VC2 of FL501 Replace VC1=Low & VC2=High or the board VC1=High & VC2=Low ? Check FL501 Pin 8 Replace ≥...
Page 100 Checking ANT SW & Mobile SW (2) (Tx pass continued) SW501 pin1 FL501 SW501 pin2 FL501 -101-...
Page 101: Assembly Instruction
5. ASSEMBLY INSTRUCTION 5.1 Disassembly (G5500) -102-...
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Page 105 -106-...
Page 106 -107-...
Page 107: Disassembly (G7050)
5.2 Disassembly (G7050) -108-...
Page 108 -109-...
Page 109 -110-...
Page 110 -111-...
Page 111 -112-...
Page 112 -113-...
Page 113: Download
6.1 Download Setup 6.1.1 In case of using the Data kit Figure 6-1 Describes Download Setup Preparation • Target Handset (G5500/7050) • Data kit • Battery • IBM compatible PC supporting RS-232 with Windows 98 or newer If you use data kit, you should have a battery with the voltage above 3.7V.
Page 114: Download Procedure
6.2 Download Procedure 1. Execute Fluid_GUI.exe and select “Erase/Program flash” menu. -115-...
Page 115 2. Click the “Add” button. Then, choose m0 file which is going to download. -116-...
Page 116 3. You must choose three programming options in programming options box. One is to decide whether you erase entire flash. If m0 file which is going to download have the change of pcm structure for current target’s m0 file, you must erase entire flash memory. The second programming option is to decide whether you erase bootloader.
Page 117 4. Press “Global Settings” menu. Choose a correct serial port and set the configuration as below. -118-...
Page 118 5. After checking programming options, Click “Erase/Program” button. If you click “Erase/Program” button, you will be able to see that “(reset target)” is displayed in the “Output” window. And then if you push shortly the “Power key” of the mobile, downloading will be started. -119-...
Page 119 6. Wait for downloading to be finished. -120-...
Page 120 7. If downloading is finished, we can switch on the mobile. When you switch on the mobile first time after downloading, you must not remove the battery until switch-on procedure is completed. If you remove the battery before switch-on procedure is completed, we will not be able to save user data in the flash memory of the mobile.
Page 121: Service And Calibration
7. SERVICE AND CALIBRATION 7.1 Service S/W 7.1.1 Overview This service S/W is used for Calibration and Standalone test. 7.1.2 Hardware and Software Environment • More than 486 computer • 16Mbyte RAM • Remained more than 10Mbyte in Hard Disk Memory •...
Page 122 A. Target System Frame This is for initializing the target phone. When you use this program to test G5500 phone, you have to initialize target at first. To initialize target phone, select target (G5500 is default) and COM port used at your computer and then click the Initialize button.
Page 123 C. TX APC Test Frame At this part, you can control transmit path of target phone. Serving Freq. Setting (TCH) You can set TCH of phone. The number means ARFCN of Traffic channel. Beacon Freq. Setting (BCH) You can set BCH of phone. The number means ARFCN of base station broadcasting channel. Power Level Setting First, you have to choose operating mode (GSM or DCS) according to TCH and BCH frequency that you selected before.
Page 124: Calibration
E. User Command and Results Frame Whenever you click button or make some event in service software, every ordered event is displayed in this frame. You can also see calibration results here. F. Ramp shape button This button is for burst shape table. But it is deactivated in service software. 7.2 Calibration 7.2.1 Overview The calibration values of the phone reside on the Flash.
Page 125 7.2.3 Equipment Setup GSM Test Set(8960) GPIB Cable Mobile Switch Cable Power Supply GPIB Cable Battery Simulator Figure 7-1 Calibration Equipment List 7.2.4 Calibration steps A. RX Calibration In order for the RSSI measurements to be within the GSM specifications, some calibration is necessary. Also, due to AGC implementation, some AGC specific constants need calibration.
Page 126 f) Click the PM Start button. g) Repeat above procedure until the displayed number in Power Measurement window is 12. h) Click the Calculate button, then the service software calculate the channel compensation parameters. i) Saving updated calibration data into phone by clicking Calib Saving button. NOTE If the calibration does not done for all channels, 5 channels for EGSM900 and 7 channels for DCS1800, the service software reports, “Please execute after measuring the PM”.
Page 127 Procedure a) Initialize phone by clicking Initialize button. b) Set the BCH and TCH of the phone 62 for E-GSM900 and 699 for DCS1800. Of cause you have to match test equipment’s BCH and TCH ARFCN with this value. For each power level, adjust the DAC value to get target power and click Test button.
Page 128: Circuit Diagram
_F_WE TDO_0 Designer 2003 TDO_ARM RPWON VBAT _BSCAN TDO_1 TDO_ARM Checked RPWON RPWON DRAWING RPWON VBAT VBAT VBAT NAME JTAGEN _BSCAN Approved TDO_ARM _BSCAN DRAWING V1.4 Iss. Notice No. Date Name LG Electronics Inc. LG Electronics Inc. - 129 -...
Page 129: Memory, Etc
INDLED_G C210 Section Date Sign & Name Sheet/ IMX9T110 Q201 0.1u Sheets MODEL G5500/7050 Designer 2003 Checked DRAWING Memory, etc R221 NAME LCD_RESET Approved DRAWING Iss. Notice No. Date Name V1.4 LG Electronics Inc. LG Electronics Inc. - 130 -...
Page 130 MICP MIC_P L301 0.1u Designer 2003 100nH C328 C329 150p C330 Checked MICN MIC_N L302 DRAWING C331 0.1u C333 MIDI, Audio 100nH NAME Approved DRAWING V1.4 Iss. Notice No. Date Name LG Electronics Inc. LG Electronics Inc. - 131 -...
Page 131: I/O, Connector
KEY_LED KBR(1) MIC_BIAS KBR(0) FLIP PWON Section Date Sign & Name Sheet/ Sheets MODEL G5500/7050 Designer 2003 C409 Checked DRAWING I/O, Connector NAME Approved DRAWING V1.4 Iss. Notice No. Date Name LG Electronics Inc. LG Electronics Inc. - 132 -...
Page 132 ADP3330 R532 Designer MS YEO 2003 R533 RF_EN 4.7K _ERR C549 R534 C550 Checked 2.2u BY YANG DRAWING NAME C551 Approved 470p H KANG DRAWING V1.4 Iss. Notice No. Date Name LG Electronics Inc. LG Electronics Inc. - 133 -...
Page 133: Camera
D(15) L_D(15) R649 R650 D(6) L_D(6) _LCD_CS L_LCD_CS R651 R652 D(7) L_D(7) A(1) L_A(1) R653 R654 D(8) L_D(8) L_WR R655 R656 DRAWING V1.4 D(9) L_D(9) Iss. Notice No. Date Name R657 LG Electronics Inc. LG Electronics Inc. - 134 -...
Page 134: Keypad
FLIP PWON C107 0.1u Section Date Sign & Name Sheet/ Sheets MODEL G5500/7050 Designer nobody 2003 Checked VA101 DRAWING KEYPAD NAME Approved DRAWING Iss. Notice No. Date Name 03/08/09 SMT (V1.1) LG Electronics Inc. LG Electronics Inc. - 135 -...
Page 135 9. PCB LAYOUT - 137 -...
Page 136: Pcb Layout
9. PCB LAYOUT - 138 -...
Page 137 9. PCB LAYOUT - 139 -...
Page 138 9. PCB LAYOUT - 140 -...
Page 139: Engineering Mode
10. ENGINEERING MODE Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset. The key sequence for switching the engineering mode on is “2945#*# “Select. Pressing END will switch back to non-engineering mode operation. Use Up and Down key to select a menu and press ‘select’...
Page 140: Standalone Test
11. STANDALONE TEST 11.1 Setting Method 11.1.1 COM Port In the “Dialog Menu”, select the values as explained below. • Port : select a correct COM port • Baudrate : 38400 • Leave the rest as default values 11.1.2 Tx Test 1.
Page 141: Exploded View & Replacement Part List
12. EXPLODED VIEW & REPLACEMENT PART LIST 12.1 Exploded View - 143 -...
Page 142: Accessory
MHBY00 HANDSTRAP MHBY0001101 Neck Strap 400mm (CDMA,common use) Gray SBPL00 BATTERY PACK,LI-ION SBPL0065889 3.7 V,850 mAh,1 CELL,PRISMATIC ,G5500 BATTERY(SV) Silver SGDY00 DATA CABLE SGDY0004401 DK-20G, G7000 ,Cable bulk SGEY00 EAR PHONE/EAR MIKE SET SGEY0003203 G4050 G4010 For USA ,3 POLE Design change...
Page 143 MFBB0003401 G5500 Black MGAD00 GASKET,SHIELD FORM MGAD0039401 G7050 Gold MIAA00 INDICATOR,LED MIAA0009601 G5500 White MMAA00 MAGNET,SWITCH MMAA0000601 LG-G510,511,512 common use, DIA : 3.0mm+1.5t Silver MPBG00 PAD,LCD MPBG0014701 G5500 Black MPBR00 PAD,BUTTON MPBR0001001 G5500 , ATTACHED (BUTTON,SIDE) Black MPBZ00 PAD MPBZ0034201 G5500...
Page 144 Silver MTAB00 TAPE,PROTECTION MTAB0029301 G7050 ADCA00 DOME ASSY,METAL ADCA0014401 G5500 GMZZ00 SCREW MACHINE GMZZ0011201 1.4 mm,2.0 mm,MSWR3(FNM) ,N ,STR ,- , G5500 GMZZ01 SCREW MACHINE GMZZ0011601 1.7 mm,3.0 mm,MSWR3(FN) ,N ,STR ,- , Silver MPBZ00 PAD MPBZ0035001 G7050 F-PCB ATTACH...
Page 145: Replacement Parts
Location Level Description Part No. Specification SVC Color Remark SACY00 PCB ASSY,FLEXIBLE SACY0011401 G5500/7050 MAIN TO KEYPAD FPCB CN101 CONNECTOR,BOARD TO BOARD ENBY0013501 24 PIN,0.4 mm,ETC ,AU , CN102 CONNECTOR,BOARD TO BOARD ENBY0002107 24 PIN,0.5 mm,ETC ,AU ,HEADER SPCY00 PCB,FLEXIBLE SPCY0018501 POLYI ,0.19 mm,DOUBLE ,...

Page 146 PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR VA103 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR SJMY00 VIBRATOR,MOTOR SJMY0006101 3 V,.09 A,12*18 ,G5500 VIBRATOR SUMY00 MICROPHONE SUMY0003802 FPCB ,-42 dB,4*1.5 , SUSY00 SPEAKER SUSY0006204 ASSY ,8 ohm,87 dB,17 mm,...
Page 147 Location Level Description Part No. Specification SVC Color Remark C202 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP C203 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C204 CAP,CERAMIC,CHIP ECCH0000276 1 uF,10V,Z,Y5V,HD,1608,R/TP C209 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP C210 CAP,CERAMIC,CHIP ECCH0000182 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP...
Page 148 Location Level Description Part No. Specification SVC Color Remark C403 CAP,CERAMIC,CHIP ECCH0000130 150 pF,50V,J,SL,TC,1005,R/TP C404 CAP,TANTAL,CHIP ECTH0000121 10 uF,10V,K,STD,3216,TP C405 CAP,CERAMIC,CHIP ECCH0000179 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP C406 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C407 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C408 CAP,CERAMIC,CHIP ECCH0003401 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP...
Page 149 Location Level Description Part No. Specification SVC Color Remark C540 CAP,CERAMIC,CHIP ECCH0000143 1 nF,50V,K,X7R,HD,1005,R/TP C541 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP C542 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C543 CAP,CERAMIC,CHIP ECCH0000110 10 pF,50V,D,NP0,TC,1005,R/TP C544 CAP,CERAMIC,CHIP ECCH0000379 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP C545 CAP,CERAMIC,CHIP ECCH0000128 100 pF,50V,J,NP0,TC,1005,R/TP...
Page 150 Location Level Description Part No. Specification SVC Color Remark C626 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C627 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C628 CAP,CERAMIC,CHIP ECCH0000108 7 pF,50V,D,NP0,TC,1005,R/TP C629 CAP,CERAMIC,CHIP ECCH0000186 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP C630 CAP,CERAMIC,CHIP ECCH0000186...
Page 151 6 PIN,ETC , , mm,Height 2.7mm CN601 CONNECTOR,BOARD TO BOARD ENBY0013409 20 PIN,0.4 mm,ETC ,AU , CN602 CONNECTOR,BOARD TO BOARD ENBY0011002 26 PIN,0.5 mm,ETC ,AU ,G5500 D401 DIODE,SWITCHING EDSY0012101 US-FLAT ,30 V,1 A,R/TP ,2.5*1.25*0.6(t) FB401 FILTER,BEAD,CHIP SFBH0007102 10 ohm,1005 ,Ferrite Bead...
Page 152 Location Level Description Part No. Specification SVC Color Remark FB610 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead FB611 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead FB612 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead FB613 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead FB614 FILTER,BEAD,CHIP SFBH0007101 120 ohm,1005 ,Ferrite Bead FB615 FILTER,BEAD,CHIP...
Page 153 Location Level Description Part No. Specification SVC Color Remark R110 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R111 RES,CHIP ERHY0000280 100K ohm,1/16W,J,1005,R/TP R112 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R113 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R115 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R116 RES,CHIP ERHY0000203 10 ohm,1/16W,J,1005,R/TP R117 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP...
Page 154 Location Level Description Part No. Specification SVC Color Remark R321 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP R330 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP R401 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R402 RES,CHIP ERHY0000265 20K ohm,1/16W,J,1005,R/TP R403 RES,CHIP ERHY0000138 33K ohm,1/16W,F,1005,R/TP R404 RES,CHIP ERHY0000261 10K ohm,1/16W,J,1005,R/TP R405 RES,CHIP ERHY0000241 1K ohm,1/16W,J,1005,R/TP...
Page 155 Location Level Description Part No. Specification SVC Color Remark R526 RES,CHIP ERHY0000106 100 ohm,1/16W,F,1005,R/TP R527 RES,CHIP ERHY0000106 100 ohm,1/16W,F,1005,R/TP R528 THERMISTOR SETY0001201 NTC ,22 Kohm,SMD ,1.0*0.5 / NSM4 SERIES R529 RES,CHIP ERHY0000289 270K ohm,1/16W,J,1005,R/TP R530 RES,CHIP ERHY0000111 680 ohm,1/16W,F,1005,R/TP R532 RES,CHIP ERHY0000201 0 ohm,1/16W,J,1005,R/TP...
Page 156 Location Level Description Part No. Specification SVC Color Remark R665 RES,CHIP ERHY0008203 3 Kohm,1/16W ,J ,1005 ,R/TP RA401 RES,ARRAY,R ERNR0000403 10000 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP RA402 RES,ARRAY,R ERNR0000401 47 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP RA403 RES,ARRAY,R ERNR0000401 47 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP...
Page 157 Location Level Description Part No. Specification SVC Color Remark VA302 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR VA303 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR VA304 RES,VARIABLE,ETC ERVZ0000101 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR VA401 RES,VARIABLE,ETC ERVZ0000101...

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