Texas Instruments TPA31 D2 Series Manual

Texas Instruments TPA31 D2 Series Manual

15-w, 30-w, 50-w filter-free class-d stereo amplifier family with am avoidance
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TPA3116D2 15-W, 30-W, 50-W Filter-Free Class-D Stereo Amplifier Family With AM

1 Features

Supports Multiple Output Configurations
1
– 2 × 50 W Into a 4-Ω BTL Load at 21 V
(TPA3116D2)
– 2 × 30 W Into a 8-Ω BTL Load at 24 V
(TPA3118D2)
– 2 × 15 W Into a 8-Ω BTL Load at 15 V
(TPA3130D2)
Wide Voltage Range: 4.5 V to 26 V
Efficient Class-D Operation
– >90% Power Efficiency Combined With Low
Idle Loss Greatly Reduces Heat Sink Size
– Advanced Modulation Schemes
Multiple Switching Frequencies
– AM Avoidance
– Master and Slave Synchronization
– Up to 1.2-MHz Switching Frequency
Feedback Power-Stage Architecture With High
PSRR Reduces PSU Requirements
Programmable Power Limit
Differential and Single-Ended Inputs
Stereo and Mono Mode With Single-Filter Mono
Configuration
Single Power Supply Reduces Component Count
Integrated Self-Protection Circuits Including
Overvoltage, Undervoltage, Overtemperature, DC-
Detect, and Short Circuit With Error Reporting
Thermally Enhanced Packages
– DAD (32-Pin HTSSOP Pad Up)
– DAP (32-Pin HTSSOP Pad Down)
–40°C to 85°C Ambient Temperature Range

2 Applications

Mini-Micro Component, Speaker Bar, Docks
After-Market Automotive
CRT TV
Consumer Audio Applications
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Order
Product
Technical
Folder
Now
Documents
Avoidance
Support &
Tools &
Community
Software
TPA3116D2, TPA3118D2, TPA3130D2
SLOS708G – APRIL 2012 – REVISED DECEMBER 2017

3 Description

The TPA31xxD2 series are stereo efficient, digital
amplifier power stage for driving speakers up to 100
W / 2 Ω in mono. The high efficiency of the
TPA3130D2 allows it to do 2 × 15 W without external
heat sink on a single layer PCB. The TPA3118D2 can
even run 2 × 30 W / 8 Ω without heat sink on a dual
layer PCB. If even higher power is needed the
TPA3116D2 does 2 × 50 W / 4 Ω with a small heat-
sink attached to its top side PowerPAD. All three
devices share the same footprint enabling a single
PCB to be used across different power levels.
The TPA31xxD2 advanced oscillator/PLL circuit
employs a multiple switching frequency option to
avoid AM interferences; this is achieved together with
an option of either master or slave option, making it
possible to synchronize multiple devices.
The TPA31xxD2 devices are fully protected against
faults
with short-circuit
protection as well as overvoltage, undervoltage, and
DC protection. Faults are reported back to the
processor to prevent devices from being damaged
during overload conditions.
Device Information
PART NUMBER
PACKAGE
TPA3116D2
DAD (32)
TPA3118D2
DAP (32)
TPA3130D2
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Application Circuit
Audio Processor
And control
Tuner AM/FM
Right
Left
CD/ MP3
Aux in
AM /FM Avoidance
Control
GAIN control and Master /Slave setting
Power Limit
Capable of synchronizing to other devices
Copyright © 2016, Texas Instruments Incorporated
protection and thermal
(1)
BODY SIZE (NOM)
11.00 mm × 6.20 mm
11.00 mm × 6.20 mm
4.5 V-26 V
TPA3116D2
PSU
PBTL
Right
LC Filter
Detect
SDZ
MUTE
FAULTZ
Left
LC Filter
AM2,1,0
GAIN/SLV
PLIMIT
Sync

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Summary of Contents for Texas Instruments TPA31 D2 Series

  • Page 1: Features

    Capable of synchronizing to other devices Sync Copyright © 2016, Texas Instruments Incorporated An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
  • Page 2: Table Of Contents

    Changed the Gain (BTL) Test Condition values for R1 and R2..................... • Changed the Gain (SLV) Test Condition values for R1 and R2..................... • Changed the System Block Diagram............................ Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 3: Pin Configuration And Functions

    PVCC MODSEL PVCC FAULTZ BSPR RINP OUTPR RINN PLIMIT OUTNR GVDD BSNR GAIN/SLV Thermal BSPL LINP OUTPL LINN MUTE OUTNL BSNL PVCC PVCC SYNC AVCC Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 4: Changed Pin 20 Description From: Ceramic Cap To Outpl To: Ceramic Cap To Outnl In The Pin Functions Table

    Connect to GND for best system performance. If not connected to GND, leave floating. (1) TYPE: DO = Digital Output, I = Analog Input, G = General Ground, PO = Power Output, BST = Boot Strap. Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 5: Specifications

    Impedance TPA3116D2, TPA3118D2 (PBTL) Output filter: L = 10 µH, C = 1 µF TPA3130D2 Output-filter Minimum output filter inductance under short-circuit condition µH Inductance Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 6: Thermal Information

    GVDD Gate drive supply IGVDD < 200 µA Output voltage maximum under PLIMIT V(PLIMIT) = 2 V; V = 1 V 6.75 7.90 8.75 control Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 7: Ac Electrical Characteristics

    AM2=1, AM1=0, AM0=1 AM2=1, AM1=1, AM0=0 Reserved AM2=1, AM1=1, AM0=1 Thermal trip point 150+ °C Thermal hysteresis °C TPA3130D2 Over current trip point TPA3118D2, TPA3116D2 Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 8: Typical Characteristics

    Output Power (W) G006 G008 Figure 5. Total Harmonic Distortion + Noise (BTL) vs Figure 6. Total Harmonic Distortion + Noise (BTL) vs Output Frequency Power Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 9 Phase −50 −500 100k PLIMIT Voltage (V) Frequency (Hz) G013 G014 Figure 11. Output Power (BTL) vs Plimit Voltage Figure 12. Gain/Phase (BTL) vs Frequency Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 10 −130 Left to Right Left to Right −140 −140 Frequency (Hz) Frequency (Hz) G021 G022 Figure 17. Crosstalk vs Frequency Figure 18. Crosstalk vs Frequency Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 11 −100 Output Power (W) Frequency (Hz) G028 G030 Figure 23. Power Efficiency (PBTL) vs Output Power Figure 24. Supply Ripple Rejection Ratio (PBTL) vs Frequency Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 12 Supply Voltage (V) G032 G034 Figure 25. Total Harmonic Distortion + Noise (PBTL) vs Figure 26. Maximum Output Power (PBTL) vs Supply Output Power Voltage Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 13: Detailed Description

    Sense PBTL Select Select OUTPL_FB Copyright © 2016, Texas Instruments Incorporated Thermal 7.3 Feature Description 7.3.1 Gain Setting and Master and Slave The gain of the TPA31xxD2 family is set by the voltage divider connected to the GAIN/SLV control pin. Master or Slave mode is also controlled by the same pin.
  • Page 14: Changed 2.3 Hz To 1.9 Hz For High-Pass Filter In Table 2

    1.8 Hz 26 dB 30 kΩ 3.3 µF 1.6 Hz 32 dB 15 kΩ 5.6 µF 1.9 Hz 36 dB 9 kΩ 10 µF 1.8 Hz Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 15 PVCC. This "virtual" rail is approximately 4 times the voltage at the PLIMIT pin. This output voltage can be used to calculate the maximum output power for a given maximum input voltage and speaker impedance. Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 16: Changed R To Gnd Column Row 1 From: "Short" To: "Open" In Table 3

    Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 17 MUTE pin low with the FAULTZ signal with a inverting transistor to ensure a high- Z restart, like shown in the figure below: Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 18 TPA3116D2 FAULTZ MUTE FAULTZ Copyright © 2016, Texas Instruments Incorporated Figure 30. MUTE Driven by Inverted FAULTZ Figure 31. Timing Requirement for SDZ 7.3.11 Thermal Protection Thermal protection on the TPA31xxD2 family prevents damage to the device when the internal die temperature exceeds 150°C.
  • Page 19 GND. This can cause ringing in the audio reconstruction filter unless care is taken in the selection of the filter components and type of filter used. Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 20 Current OUTP OUTN Positive Output PVCC OUTP OUTN Speaker Current OUTP Negative Output OUTN OUTP OUTN - PVCC Speaker Current Figure 33. 1SPW Mode Modulation Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 21 PVCC. Also, make sure the layout of the snubber network is tight and returns directly to the GND pins on the IC. Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 22 LC reconstruction filters can be the lowest cost means to pass LCI tests. Common mode chokes using low frequency ferrite material can also be effective at preventing line conducted interference. Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 23 AM FREQUENCY (kHz) AM FREQUENCY (kHz) 522-540 540-917 540-914 917-1125 914-1122 600 (or 400) 1125-1375 1122-1373 1375-1547 1373-1548 600 (or 400) 1547-1700 1548-1701 600 (or 500) Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 24: Device Functional Modes

    Analog input signal is applied to INPR and INNR. TPA3116D2 4.5 V–26 V OUTPR Right OUTNR LC Filter OUTPL OUTNL PBTL Left Detect Figure 36. Mono Mode Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 25: Application And Implementation

    A 2.1 solution, U1 TPA3116D2 in Master mode 400 kHz, BTL, gain if 20 dB, power limit not implemented. U2 in Slave, PBTL mode gain of 20 dB. Inputs are connected for differential inputs. Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 26 3.3R BSNL 220nF 100k PVCC 10uH PVCC PVCC SY NC AVCC TPA3116D2 100nF 220uF PVCC DECOUPLING Copyright © 2016, Texas Instruments Incorporated Figure 37. Schematic Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 27 Each of the outputs require bootstrap capacitors to provide gate drive for the high-side output FETs. For this design, use 0.22-μF, 25-V capacitors of X5R quality or better. Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 28: Power Supply Recommendations

    EMI performance. The LC filter should be placed close to the outputs. The capacitors used in both the ferrite and LC filters should be grounded. Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 29: Layout Example

    EVM user manual and the thermal pad application reports, SLMA002 and SLMA004, are available on the TI Web site at http://www.ti.com. 10.2 Layout Example Figure 40. Layout Example Top Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 30 TPA3116D2, TPA3118D2, TPA3130D2 SLOS708G – APRIL 2012 – REVISED DECEMBER 2017 www.ti.com Layout Example (continued) Figure 41. Layout Example Bottom Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 31: Heat Sink Used On The Evm

    This size heat sink has shown to be sufficient for continuous output power. The crest factor of music and having airflow will lower the requirement for the heat sink size and smaller types can be used. Submit Documentation Feedback Copyright © 2012–2017, Texas Instruments Incorporated Product Folder Links: TPA3116D2 TPA3118D2 TPA3130D2...
  • Page 32: Device And Documentation Support

    All other trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
  • Page 33 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples Drawing Ball material (4/5) TPA3116D2DAD ACTIVE HTSSOP RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 3116 TPA3116D2DADR...
  • Page 34 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
  • Page 35 PACKAGE MATERIALS INFORMATION www.ti.com 18-Jan-2021 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Reel Reel Pin1 Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant (mm) W1 (mm) TPA3118D2DAPR HTSSOP 2000 330.0 24.4 11.5 12.0 24.0 TPA3130D2DAPR HTSSOP...
  • Page 36 PACKAGE MATERIALS INFORMATION www.ti.com 18-Jan-2021 *All dimensions are nominal Device Package Type Package Drawing Pins Length (mm) Width (mm) Height (mm) TPA3118D2DAPR HTSSOP 2000 350.0 350.0 43.0 TPA3130D2DAPR HTSSOP 2000 350.0 350.0 43.0 Pack Materials-Page 2...
  • Page 37 GENERIC PACKAGE VIEW DAP 32 PowerPAD TSSOP - 1.2 mm max height PLASTIC SMALL OUTLINE 8.1 x 11, 0.65 mm pitch This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4225303/A www.ti.com...
  • Page 41 NOTE 5 DETAIL A TYPICAL 4223691/A 05/2017 PowerPAD is a trademark of Texas Instruments. NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice.
  • Page 42 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. 8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
  • Page 43 EXAMPLE STENCIL DESIGN DAP0032C PowerPAD TSSOP - 1.2 mm max height PLASTIC SMALL OUTLINE (3.04) BASED ON 0.125 THICK 32X (1.5) STENCIL 32X (0.45) 30X (0.65) (3.74) SYMM BASED ON 0.125 THICK STENCIL SEE TABLE FOR DIFFERENT OPENINGS FOR OTHER STENCIL THICKNESSES METAL COVERED SYMM...
  • Page 45 0.05 DETAIL A TYPICAL 4222646/B 02/2020 PowerPAD is a trademark of Texas Instruments. NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice.
  • Page 46 EXAMPLE BOARD LAYOUT DAD0032A PowerPAD TSSOP - 1.15 mm max height PLASTIC SMALL OUTLINE 32X (1.5) SEE DETAILS SYMM 32X (0.45) 30X (0.65) SYMM (R0.05) TYP (7.5) LAND PATTERN EXAMPLE SCALE:8X METAL UNDER SOLDER MASK SOLDER MASK METAL SOLDER MASK OPENING OPENING 0.05 MIN...
  • Page 47 EXAMPLE STENCIL DESIGN DAD0032A PowerPAD TSSOP - 1.15 mm max height PLASTIC SMALL OUTLINE 32X (1.5) SYMM 32X (0.45) 30X (0.65) SYMM (R0.05) TYP (7.5) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:8X 4222646/B 02/2020 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
  • Page 48 TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2021, Texas Instruments Incorporated...

This manual is also suitable for:

Tpa3116d2Tpa3118d2Tpa3130d2

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