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EVM IMPORTANT NOTICE Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety measures typically found in the end product incorporating the goods.
EVM schematic located in the EVM User’s Guide. When placing measurement probes near these devices during operation, please be aware that these devices may be very warm to the touch. Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2002, Texas Instruments Incorporated...
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Chapter 1 Introduction This chapter provides an overview of the Texas Instruments (TI) TPA3007D1EVM class-D audio amplifier evaluation module. It includes a list of EVM features, a brief illustrated description of the module, and a list of EVM specifications. Topic...
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Description 1.1 Description The TPA3007D1 evaluation module (EVM) is a 6.5-W class-D mono audio power amplifier complete with a small number of external components mounted on a circuit board measuring approximately 1 1/4 inches by 1 1/4 inches (Figure 1−1 and Figure 1−2). Figure 1−1.
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Description Figure 1−2. The TI TPA3007D1 Audio Power Amplifier EVM—Bottom View Note: Single in-line header pins extend from the underside of the module circuit board to allow the EVM to be plugged into the TI Plug-N-Play audio amplifier evaluation platform, or to be wired directly into existing circuits and equip- ment when used stand-alone operation.
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Easy-to-use configuration controls allow the platform and EVMs to quickly model many possible end-equipment configurations. 1.2 TPA3007D1EVM Specifications Supply voltage range, V ....... .
Chapter 2 Quick Start Follow the steps in this chapter to quickly prepare the TPA3007D1EVM for use. Using the TPA3007D1EVM with the TI Plug-N-Play audio amplifier evaluation platform is a quick and easy way to connect power, signal and control inputs, and signal outputs to the EVM using standard connectors.
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1) ON = Jumper installed, OFF = Jumper NOT Installed, X = Don’t care 2) Set to ON when tone control board SLOP109 is installed in U1, otherwise set to OFF. 3) R3 must be removed from the TPA3007D1EVM to allow the headphone jack to control the shutdown of the TPA3007D1.
Quick Start List for the Platform 2.3 Quick Start List for the Platform Follow these steps when using the TPA3007D1EVM with the TI Plug-N-Play audio amplifier evaluation platform (see the platform user’s guide, SLOU011, for additional details). Platform Preparations 1) Ensure all external power sources and platform power switch S1 are set to OFF.
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Quick Start List for the Platform Figure 2−1. Quick Start Platform Map Power Input Power In/Out Audio Power Signal Conditioning Amps Audio Speaker Input Output Mode Mute ****CAUTION**** Polarity Do not insert or remove EVM boards with power applied Stereo Headphone Output Plug-N-Play Audio Amplifier...
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15) Adjust the signal source level as needed. 2.4 Quick Start List for Stand-Alone Operation Follow these steps to use the TPA3007D1EVM as a stand-alone unit, or when connecting it into existing circuits or equipment. Connections to the TPA3007D1 module header pins can be made via individual sockets, wire-wrapping, or soldering to the pins, either on the top or the bottom of the module circuit board.
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Quick Start List for Stand-Alone Operation Evaluation Module Preparations 6) Adjust the source signal level as needed. 7) Use jumpers GAIN0 and GAIN1 to set the gain as shown in Table 2−5. Table 2−5. TPA3007D1EVM Gain Settings GAIN1 GAIN0 GAIN (dB) 23.6...
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TPA3007D1EVM PCB Layers 3.3 TPA3007D1EVM PCB Layers The following illustrations depict the TPA3007D1EVM PCB assembly and layers. These drawings are not to scale. Figure 3−2. TPA3007D1EVM Top Layer...
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TPA3007D1EVM PCB Layers Figure 3−3. TPA3007D1EVM Bottom Layer Bill of Materials, Schematic, and PCB Layers...
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