Telit Wireless Solutions xE70-915 User Manual
  1. Manuals
  2. Brands
  3. Telit Wireless Solutions Manuals
  4. Wireless modules
  5. xE70-915
  6. User manual

Telit Wireless Solutions xE70-915 User Manual

Rf module
Hide thumbs
Table of Contents

Advertisement

Quick Links

Download this manual
xE70-915 RF Module User Guide
1VV0301106
rev.3 – 2015-03-04

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the xE70-915 and is the answer not in the manual?

Questions and answers

Related Manuals for Telit Wireless Solutions xE70-915

Summary of Contents for Telit Wireless Solutions xE70-915

  • Page 1 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04...
  • Page 2 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 APPLICABILITY TABLE PRODUCT LE70-915 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 2 of 34...
  • Page 3 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE Notice While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no liability resulting from any inaccuracies or omissions in this document, or from use of the information obtained herein.
  • Page 4 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Usage and Disclosure Restrictions License Agreements The software described in this document is the property of Telit and its licensors. It is furnished by express license agreement only and may be used only in accordance with the terms of such an agreement.

  • Page 5: Table Of Contents

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Contents Introduction ..........7 1.1. Scope ............. 7 1.2. xE70-915 Product Description ......7 1.3. Audience ..........7 1.4. Contact Information, Support ......7 1.5. Text Conventions .......... 8 1.6. Related Documents ......... 8 Regulatory Conformance Information ......
  • Page 6 Soldering Profile (RoHS Process) ......24 Board Mounting Recommendation ....... 26 6.1. Electrical environment ........26 6.2. Power supply decoupling on xE70-915 module ....26 6.3. RF layout considerations ......... 27 6.4. Antenna connections on printed circuit boards .... 28 6.5.

  • Page 7: Introduction

    – 2015-03-04 Introduction 1.1. Scope Scope of this document is to present the features and the application of the Telit xE70-915 radio modules. 1.2. xE70-915 Product Description The xE70-915 module is a multi-channel radio board, delivering up to 500mW in Frequency Hopping technology.

  • Page 8: Text Conventions

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 To register for product news and announcements or for product questions contact Telit Technical Support Center (TTSC). Our aim is to make this guide as helpful as possible. Keep us informed of your comments and suggestions for improvements.

  • Page 9: Regulatory Conformance Information

    The main requirements of the FCC regulation are given in [1]. The xE70-915 module operates in the ISM band. This band is free to use but the module and the user must respect some limitations. Most of these restrictions are integrated in the conception of the module.

  • Page 10: General Features

    General Features 3.1. Main Functionalities The xE70-915 module is a complete solution from serial interface to RF interface. The xE70- 915 module has a digital part and a RF part. The radio link is a Half Duplex bi-directional link. The digital part has the following functionalities: •...

  • Page 11: Mechanical Specifications

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 3.4. Mechanical Specifications Rectangular 25.8 x 15 mm Size Height 3 mm Weight 1.7 g 0.8 mm PCB thickness Cover Mounted above SMD components for EMI reduction and automatic placement • Dimensions : 25 x 14.2 x 2.2mm •...

  • Page 12: Mechanical Dimensions

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 3.5. Mechanical dimensions Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 12 of 34...

  • Page 13: Dc Specifications

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 3.6. DC Specifications Measured on DIP interface with T = 25°C, under 50Ω impedance connected to RF port and default power register setting if nothing else stated. Max limits apply over the entire operating range, T=-40°C to +85°C, Vdd=2.3V to 3.6V and all channels.

  • Page 14: Radio Specifications

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 3.7. Radio Specifications Measured on DIP interface at T = 25°C, Vdd = 3.6V, 50 Ω impedance and default power register setting if nothing else stated. 902 MHz - 928 MHz...

  • Page 15: Digital Specifications

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 3.8. Digital Specifications Function Characteristics • 128 kB + 8 kB in system programmable flash • µC 8 kB RAM • 2 kB E PROM • RS232 TTL Full Duplex •...
  • Page 16 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Equipment and Part Number SMD Version B LE70-915/SMD DIP Version B LE70-915/DIP Demo Case D LE70-915 DemKit Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 16 of 34...

  • Page 17: Pin-Out And Signals Description

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Pin-out and Signals Description 4.1. Module Pin-out (Top View) CAUTION: reserved pins must not be connected CAUTION: In case you want to use in the same application Telit ZE51 or ZE61 modules J9 and J8 should not be connected, since reserved on these modules (see foot notes on Pin- Out tables.

  • Page 18: Module Pin-Out Table

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 4.2. Module Pin-out Table Pin name Pin type Signal level Function RF Ground connection for external antenna Ext_Antenna RF I/O connection to external antenna RF Ground connection for external antenna Ground...

  • Page 19: Pin-Out Of The Module Dip

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 IO2_P Logic I/O N°2 with interrupt RX LED See reference document [2] Frequency Hopping Star Network Protocol Stack User Guide IO1_P Logic I/O N°1 with interrupt TX LED See reference document [2] Frequency Hopping Star Network Protocol Stack User Guide 4.3.

  • Page 20: Dip - Module Pin-Out Correspondence Table

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 4.4. DIP – Module Pin-out Correspondence Table Pin-Out correspondence between xE70-915/DIP and xE70-915/SMD xE70-915/DIP xE70-915/SMD Comments Connector Pin Name Name IO5_A Status TX/RX Reserved Pin RX LED TX LED IO4_A IO3_A...

  • Page 21: Signals Description

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 4.5. Signals Description Signals Description External hardware reset of the radio module. Reset Active on low state. Serial link signals, format NRZ/TTL: TXD, RXD TXD is for outgoing data. RXD is for incoming data.

  • Page 22: Process Information

    5.1. Delivery xE70-915 modules are delivered in plastic tray packaging, each tray including 50 units. The dimensions of the tray are the following: 329 mm x 176 mm x 5.6 mm. Each unit is placed in a 26.6 mm x 16 mm location. An empty tray weights 45 g and a loaded tray weights around 130 g.

  • Page 23: Storage

    After being submitted to the drying bake, modules must be soldered on host boards within 168 hours. Also, it must be noted that due to some components, xE70-915 modules are ESD sensitive device. Therefore, ESD handling precautions should be carefully observed.

  • Page 24: Solder Paste

    5.6. Soldering Profile (RoHS Process) It must be noted that xE70-915 module should not be allowed to be hanging upside down during the reflow operation. This means that the module has to be assembled on the side of the printed circuit board that is soldered last.
  • Page 25 CAUTION - It must also be noted that if the host board is submitted to a wave soldering after the reflow operation, a solder mask must be used in order to protect the xE70-915 radio module’s metal shield from being in contact with the solder wave.

  • Page 26: Board Mounting Recommendation

    6.2. Power supply decoupling on xE70-915 module The power supply of xE70-915 module must be nearby decoupled. A LC filter is strongly recommended in case of DC-DC conversion. It must be placed as close as possible to the radio module power supply pin, VDD.

  • Page 27: Rf Layout Considerations

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 6.3. RF layout considerations Basic recommendations must be followed to achieve a good RF layout: • It is recommended to fill all unused PCB area around the module with ground plane •...

  • Page 28: Antenna Connections On Printed Circuit Boards

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 6.4. Antenna connections on printed circuit boards Special care must be taken when connecting an antenna or a connector to the module. The RF output impedance is 50 ohms, so the strip between the pad and the antenna or connector must be 50 ohms following the tables below.

  • Page 29: Xe70-868/915 Interfacing

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 6.5. xE70-868/915 Interfacing Example of a full RS-232 connection between a PC or an Automat (PLC) and xE70-868/915 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
  • Page 30 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Example of minimum connections for communication between a PC and xE70-868/915 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 30 of 34...
  • Page 31 RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Example for sensor connection with xE70-868/915 Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 31 of 34...
  • Page 32 RF Module User Guide 1VV0301106 rev.4 – 2015-06-16 Conformity assessment issues FCC/IC Regulatory notices 7.1. Modification statement Telit has not approved any changes or modifications to this device by the user. Any changes or modifications could void the user’s authority to operate the equipment.
  • Page 33 RF Module User Guide 1VV0301106 rev.4 – 2015-06-16 Cet appareil est conforme aux limites d'exposition aux rayonnements de l’IC pour un environnement non contrôlé. L'antenne doit être installée de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. Gain et Type de l'antenne doit être ci-dessous:...
  • Page 34 RF Module User Guide 1VV0301106 rev.4 – 2015-06-16 module d'émission », du mot « Contient » ou d'une formulation similaire exprimant le même sens, comme suit : Contains FCC ID: RI7LE70FH Contains IC: 5131A-LE70FH 7.6. CAN ICES-3 (B) / NMB-3 (B) This Class B digital apparatus complies with Canadian ICES-003.

  • Page 35: Safety Recommendations

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Safety Recommendations READ CAREFULLY Be sure the use of this product is allowed in the country and in the environment required. The use of this product may be dangerous and has to be avoided in the following areas: •...

  • Page 36: Glossary

    RF Module User Guide 1VV0301106 rev.3 – 2015-03-04 Glossary Adjacent Channel Power Adaptive Frequency Agility Bits per second Bandwidth Decibel Power level in decibel milliwatt (10 log (P/1mW)) PROM Electrically Erasable Programmable Read Only Memory Effective radiated power E.R.P...

  • Page 37: Document History

    ¡Error! No se encuentra el origen de la referencia. 1VV0301106 rev.4 – 2015-06-16 Document History Revision Date Changes 2013-10-11 First Release 2014-04-02 Updated LE70-915 Demo Kit content 2014-07-21 Corrected partname for L1 on page 26; updated sensitivity and current consumption values 2015-03-04 Updated first channel frequency;...

Table of Contents