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Chengdu Ebyte Electronic Technology Co.,Ltd.
10 Welding instruction
10.1Reflow soldering temperature
Profile Feature
Solder Paste
Preheat Temperature min(Tsmin)
Preheat temperature max(Tsmax)
Preheat Time(Tsmin to Tsmax)(ts)
Average ramp-up rate(TsmaxtoTp)
Liquidous Temperature(TL)
Time(tL)MaintainedAbove(TL)
Peak temperature(Tp)
Aveage ramp-downrate(TptoTsmax)
Time 25° to peak temperature 25℃
10.2 Reflow soldering curve
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Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
E108-GN User Manual
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6C/second max
8 minutes max
33
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