Modules Are Fragile; Ber Is Too High; Welding Instructions; Reflow Temperature - Ebyte E104-BT09 User Manual

Chengdu Ebyte Electronic Technology Co.,Ltd.
Metal objects near the antenna, or placed in a metal shell, the signal attenuation will be very serious;

Wrong power register setting, air rate setting is too high (the higher the air rate, the closer the distance);

Low voltage of power supply at room temperature is lower than the recommended value, the lower the voltage

the lower the hair power;
The use of antenna and module matching degree is poor or the antenna itself quality problems.


8.2 Modules are fragile

Please check the power supply to ensure that it is between the recommended supply voltages, if it exceeds the

maximum value it will cause permanent damage to the module;
Please check the power supply stability, the voltage can not be substantial frequent fluctuations;

Please ensure that the installation and use process anti-static operation, high-frequency device electrostatic

sensitivity;
Please ensure that the installation and use of the process of humidity should not be too high, part of the

components for humidity-sensitive devices;
If there is no special demand is not recommended to be used at too high or too low a temperature.


8.3 BER is too high

ear the same frequency signal interference, away from the source of interference or modify the frequency and
 N
channel to avoid interference;
Unsatisfactory power supply may also cause garbled code, be sure to ensure the reliability of the power supply;

Extension cords, feeder cords of poor quality or too long, can also cause high BER.


9. Welding instructions

9.1 Reflow temperature

Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
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Curve Characteristics
Solder Paste
Minimum Preheat
Temperature
Maximum Preheat
Temperature
Preheat Time
Average Rise Rate
Liquid phase
E104-BT09 User Manual
Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
23