Thermo Electron MicroXR Service Manual

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MicroXR

Service Manual

5225 Verona Road

Madison, WI 53711 USA

Tel: (608) 276 6100

Customer Support: (800) 642-6538 (U.S.A.) or +1 608 273 5015 (worldwide)

www.techsupport.analyze@thermo.com

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www.madison.intlsupt@thermo.com

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Page 1 MicroXR Service Manual 5225 Verona Road Madison, WI 53711 USA Tel: (608) 276 6100 Customer Support: (800) 642-6538 (U.S.A.) or +1 608 273 5015 (worldwide) www.techsupport.analyze@thermo.com (U.S.A.) www.madison.intlsupt@thermo.com (worldwide)
Page 2 Thermo Electron Corporation, nor the rights of others. Thermo Electron Corporation does not assume any liability arising out of any infringements of patents or other rights of third parties.
Page 3: Table Of Contents
Table of Contents Chapter 1: Introduction 1.1: Service Documentation Overview 1.2: Terms & Symbols 1.3: Contact Information Chapter 2: Safety 2.1: Introduction 2.2: Safety Hazards 2.3: Safety Interlocks 2-15 2.4: Safety Lockout Procedures 2-23 Chapter 3: Product Overview 3.1: Specifications G, M, and V-series 3.2: Specifications ZXR and LXR series 3-17 3.3: Facilities Requirements...
Page 4 MicroXR Service Manual Chapter 5- GXR: Setup & Adjustment 5.1: Safety Test 5.2: Preliminary Setup & Test Procedures 5-13 5.3: Performance Tests 5-74 5.4: Applications Tests 5-93 Chapter 5- GXRC, MXRP: Setup & Adjustment 5.1: Safety Test 5.2: Preliminary Setup & Test Procedures 5-14 5.3: Performance Tests...
Page 5 Table of Contents Chapter 5- ZXR, LXR: Setup & Adjustment 5.1: Safety Test 5.2: Preliminary Setup & Test Procedures 5-13 5.3: Performance Tests 5-81 5.4: Applications Tests 5-99 Chapter 6: Software 6.1: XPert Service Mode Overview 6.2: Counts Mode 6.3: DAQU Mode 6-12 6.4: Long Term Diagnostics 6-15...
Page 6 MicroXR Service Manual Chapter 8- GXRC, MXRP: Maintenance 8.1: Safety Information 8.2: Periodic Maintenance 8.3: Component Replacement - Overview 8-13 8.4: X-Ray Tube 8-15 8.5: Shutter/Capillary Optic Assembly 8-19 8.6: X-Ray Detector 8-25 8.7: Stage 8-37 8.8: Optics 8-44 8.9: Circuit Boards 8-49 8.10: Power Supplies...
Page 7 Table of Contents Chapter 8- MXR: Maintenance 8.1: Safety Information 8.2: Periodic Maintenance 8.3: Component Replacement - Overview 8-13 8.4: X-Ray Tube 8-15 8.5: Shutter/Capillary Optic Assembly 8-20 8.6: X-Ray Detector 8-26 8.7: Stage 8-32 8.8: Optics 8-39 8.9: Circuit Boards 8-44 8.10: Power Supplies 8-51...
Page 8 MicroXR Service Manual Chapter 8- ZXR, LXR: Maintenance 8.1: Safety Precautions 8.2: Periodic Maintenance 8.3: Component Replacement - General Information 8-13 8.4: X-Ray Tube 8-15 8.5: Shutter/Collimator Assembly 8-20 8.6: X-Ray Detection System 8-24 8.7: Stage 8-33 8.8: Optics Components 8-44 8.9: Circuit Boards...
Page 9: Chapter 1: Introduction
Thermo Electron MicroXR x-ray fluorescence measurement tools. While it is primarily intended as a reference for Thermo Electron service personnel and certified in-house service technicians, all readers will find a great deal of useful information about MicroXR operation, design, performance and system diagnostics contained herein.
Page 10: Service Documentation Overview
Supplemental system documentation including technical notes, new and updated features, component design changes and miscellaneous procedures. Volume 4: Assembly & Schematics Packages Contact Thermo Electron Customer Service for information on obtaining the following supplemental drawings packages: MicroXR Assembly Drawings Package: Detailed mechanical assembly drawings and parts reference.
Page 11 Chapter 5 (select appropriate chapter 5 for your model), System Setup, details the procedures used to configure MicroXR chambers in the factory and to certify that systems are performing to specification. Most of these procedures also have applications in general troubleshooting and repair.
Page 12: Terms & Symbols
MicroXR Service Manual 1.2: Terms & Symbols 1.2.1: Symbols Used in this Manual The table below lists symbols used throughout the manual to alert the reader to important safety issues, user tips, and shortcuts. Label Description General Safety Warning – Read First.
Page 13: Contact Information
Thermo Electron Customer Service (800)-642-6538 1.3.1.2: Remote Diagnostic Troubleshooting Thermo Electron is equipped to troubleshoot the MicroXR via a modem hookup with the instrument. Extensive troubleshooting is provided if both parties feel the problem may be resolved over the telephone.
Page 14 Complex technical skill is not expected. After the warranty period, the degree of involvement is the user's choice. 1.3.1.7: Training From time to time, Thermo Electron offers on-site and in-factory operational training for users. On-site hardware maintenance training is also available. 1.3.1.8: Equipment Exchange All subassemblies are available for instant exchange.
Page 15: Chapter 2: Safety
2.2.4: Motorized Stage Safety 2.2.5: Materials Safety 2.2.6: Chemical Safety 2.2.7: Ergonomics - Safe Transportation & Handling 2.3: MicroXR Safety Interlocks 2-15 2.3.1: Overview 2.3.2: Functional Description of Safety Interlocks 2.3.3: Emergency Machine Off (EMO) Circuit 2.4: MicroXR Safety Lockout Procedures 2-23...
Page 16: Introduction
MicroXR tools have been designed to meet all safety requirements applicable to industrial electrical and radiation devices. However, potential hazards exist in the operation and service of all electrical equipment. In addition, the MicroXR and the OEM equipment built into it present potential hazards specific to their modes of operation.
Page 17 Chapter Two: Safety 2.1.2: Responsibility for Safe Operation X-ray producing equipment should be used only under the guidance and supervision of a responsible qualified person. All equipment operators must be given adequate radiation safety instruction as specified by governing state regulations. Adequate precautions should be taken to make it impossible for unauthorized or unqualified persons to operate this equipment or to expose themselves or others to its radiation or electrical dangers.
Page 18 Voice: (440) 248-9300 · Fax: (440) 349-2307 Toll Free Voice: (800) 850-4608 E-mail: sales@inovision.com Thermo Electron recommends the use of personal dosimeter badges for all personal operating radiation producing devices. This may be required by your state as well. Normally a contract...
Page 19 (708) 755-7000 2.1.5: Federal and State Registration Requirements Thermo Electron files all necessary reports for MicroXR to be accepted as a Listed Electronic Product with the U.S. Department of Health and Human Services, the FDA, and the Bureau of Radiological Health. MicroXR users are exempt from such filing.
Page 20: Safety Hazards
X-ray tube from the high voltage power supply. 2.2.1.3: MicroXR Radiation Safety Features MicroXR units are designed to provide maximum protection to the operator. Key safety features include: The X-ray tube housing and sample chamber walls completely shield operators from all radiation generated by the X-ray tube.
Page 21 2.2.1.4: Radiation Levels The MicroXR conforms to applicable X-ray emissions standards under Title 21, Code of Federal Regulations, §1040.20. MicroXR systems can be utilized in complete safety under normal operating conditions.
Page 22 Power supplies. Circuit boards. High voltage (tube, detector) interconnects. All potential shock hazard locations are clearly marked in the MicroXR chamber by a safety label. (See section 2.5.) 2.2.2.2: Preventive Measures Always disconnect and lockout the AC power cord to completely de-energize the chamber before working in areas with exposed electrical circuits or components with potentially large stored charges.
Page 23 IEC Standard 1010-1, “Safety Requirements for Electrical Equipment for Measurement, Control and Laboratory Use”. Main Disconnect Per IEC 1010-1, the power cord acts as a mains disconnection device on the MicroXR. Therefore, ensure that the power cord is easily accessible at all times. Hazard Warning Graphics Electrical safety warning symbols used to mark the MicroXR (per IEC 1010-1) as listed in Section 2.5.
Page 24 (greater than 1000 seconds). All MicroXR models use a laser to aid in sample focusing. A second laser aids in stage positioning when loading samples into the chamber on G-, M-, and V-series benchtop and console chambers.
Page 25 2.2.4: Motorized Stage Safety 2.2.4.1: Nature of the Hazard MicroXR stages are driven by powerful stepper or servo motors. Placing hands, arms, or head inside the chamber while the stage is moving can result in severe injury. 2.2.4.2: Preventive Measures Always be careful to remove tools, samples, fixtures or other objects from the stage following service.
Page 26 MicroXR Service Manual 2.2.5: Poisoning Hazard - Beryllium Window 2.2.5.1: Nature of the Hazard The exit window of the X-ray tube and the entrance window of the X-ray detector are made of thin (<10 mil) beryllium foil. Beryllium metal is highly toxic. Do not touch or otherwise handle the foil.
Page 27 Data sheets are provided on the XPert installation CD- ROM in Adobe Acrobat (.pdf) format (viewable using the freely distributed Acrobat Reader software utility). They may also be obtained by contacting the Thermo Electron Customer Service Department at (800) 495.3839.
Page 28 2.2: M XR C & W IGURE ICRO HAMBER EIGHT EIGHT PECIFICATIONS MicroXR Chamber Height & Weight Specifications Dimensions Height Width Length ZXR/LXR 24.0 in (61.0 cm) 24.3 in (61.7 cm) 29.3 in (74.4 cm) ZXRH/LXRH 30.5 in (76.3 cm)
Page 29: Safety Interlocks
Emergency Off (EMO) switch can be depressed to immediately shut of all power to the unit. EMO circuitry is a standard feature on MicroXR CE units and all CXR console models. It is available on non-CE units as part of the optional S2-93 Safety Package.
Page 30 MicroXR CXR-series console units use a single magnetic switch in place of SWT2 & 3 CE units only: MicroXR CE systems do not have a lower sample loading door. An latch ( ) closes when the Start button is pressed, preventing the user from opening the door while a measurement is in progress.
Page 31 Chapter Two: Safety Figure 2.3: MicroXR Safety Interlocks Diagram 2-17...
Page 32 MicroXR Service Manual MicroXR Safety Interlocks Description System Status/ System Response System System Reset User Action Message Emergency Off User depresses red AC power to system is Pull out EMO button. (EMO) switch EMO button on front immediately cut off...
Page 33 All MicroXR CE units are configured with an Emergency Machine Off (EMO) circuit. EMO circuitry is available by customer request on MicroXR US units (except ZXR and LXR) as part of the optional S2-93 Certification Package. EMO circuitry is standard on all MicroXR CXR configurations.
Page 34 MicroXR Service Manual 2.4: E (EMO) S IGURE MERGENCY WITCH OCATIONS ENCH HAMBERS A: Emergency Off Button Immediately cuts all power to X-ray chamber when pressed. B: Disconnect Reset Switch (CE units only) Must be turned fully clockwise before resetting EMO switch.
Page 35 Chapter Two: Safety 2.5: E (EMO) S IGURE MERGENCY WITCH OCATIONS ONSOLE HAMBERS MERGENCY UTTON Immediately cuts power to X-ray chamber and all equipnment powered through chamber. HAMBER UTTONS Turn power to entire system On or Off. OLTAGE EYSWITCH Place in ON position enable high voltage ramp up cycle. Actual HV ramp up is under software control.
Page 36 MicroXR Service Manual 2.6: EMO C -VXRV C IGURE IRCUIT IAGRAM ENCH OP AND ONSOLE UNITS 2.7: EMO C (VXRV C IGURE IRCUIT IAGRAM ONSOLE NITS 2-22...
Page 37: Safety Lockout Procedures
Chapter Two: Safety 2.4: Safety Lock Out Procedures It is imperative that the MicroXR system be “locked out” before performing any MicroXR maintenance procedures that may pose an electrical shock hazard. MicroXR is considered locked out when: The chamber has been powered down and shut off.
Page 38 MicroXR Service Manual 2.4.1: MicroXR Service Shutdown and Safety Lockout Procedure This section provides instructions for safe powering down and locking out of MicroXR units whenever service or regularly schedule maintenance tasks are performed. All lockout procedures and restrictions should be observed in order to prevent the unexpected energization or start-up of the unit, and/or the unintended release of any stored energies that could cause injury to personnel.
Page 39 All employees are required to comply with the restrictions and limitations imposed upon them during the use of lockout. All employees, upon observing a MicroXR unit that has been locked out, shall not attempt to start, energize, or operate that unit.
Page 40 Once locked out, the MicroXR has no user-serviceable components that expose the user to hazards resulting from the discharge of stored energies (such as that in capacitors,...
Page 41 2.4.2: Restoring MicroXR to Service When the servicing or maintenance is completed, and MicroXR is ready to return to normal operating condition, the following steps shall be taken: Check the X-ray chamber and peripheral equipment, as well as the immediate area around the unit, to ensure that nonessential items have been removed and that all MicroXR components are operationally intact.
Page 42: Chapter 3: Product Overview
This chapter provides mechanical and performance specifications, exterior and interior chamber views, facility requirements and computer-chamber interconnection details common to all MicroXR series bench top models. (See Model Comparison, section) Detailed, platform-specific information is located in the following sections: Chapter 5: Setup and Adjustment...
Page 43: Specifications G, M, And V-Series
MicroXR Service Manual Chapter Topics 3.1: Specifications G-, M-, and V-series 3.1.1: General 3.1.2: Applications Performance 3.1.3: Model Comparison 3.1.4: Chamber Views Figure 3.3: Slotted and Closed Chamber Views Figure 3.4: Benchtop Chamber Dimensions (G, M and V-series) Figure 3.5: Interior Component Layout (GXR, GXRS Typical) Figure 3.6: Interior Component Layout (GXRC, MXR Typical)
Page 44 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.1: M XR B XRF T IGURE ICRO ENCH...
Page 45 MicroXR Service Manual Figure 3.2: MicroXR System Z/LXR (Low Profile Chamber)
Page 46 Slotted or Closed Chamber Slotted chamber can accept oversized PC board. (GXR< GXRC option only.) Note: All MicroXR CE and US units with optional S2-93 safety package are closed-chamber configurations. 3.1.1.2: Electrical Power Source: [110/120 VAC, 50/60 Hz, 5 amps] or [220/240 VAC, 50/60 Hz, 2.5 amps].
Page 47 MicroXR Service Manual 3.1.1.3: X-Ray Source Beryllium window spectroscopy grade x-ray tube; 50W max; Mo, Be, W, Cr, Rh, or Cu target 3.1.1.4: X-Ray Detector Proportional Counter (GXR, GXRC, MXRP): Air cooled, 950eV x-ray resolution [FWHM]. Solid State: GXRS, MXR: PIN Diode, Peltier cooled, 280eV x-ray resolution [FWHM].
Page 48 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.1.1.8: Environment/Facilities Requirements Indoor/Outdoor Use: System designed for indoor use only. Temperature Range: 5°C (13°F) to 40°C (105°F). Maximum Relative Humidity: 80% up to 30°C (78°F), decreasing linearly to 50% at 40°C (105°F). Altitude: Below 2000 meters.
Page 49 MicroXR Service Manual 3.1.2: Applications Performance Capabilities Measurable Elemental Ranges: GXR, GXR-C, MXR-P: Sc (21) to U (92) GXR-S, MXR: Sc (21) to U (92) VXR: Al (13) to U (92) General film thickness (single, dual, triple layer). Measure up to five layers with six elements per layer (with optional Advanced FP package).
Page 50 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.1.3: MicroXR Benchtop Model Comparison GXRS GXRC MXRP Slotted Option Chamber Transmission Focusing Focusing Focusing Element Element Element Element Mechanical, Mechanical, Collimation (35µm beam (75µm beam (75µm beam (75µm beam 6 position 6 position...
Page 51 MicroXR Service Manual 3.1.4: Chamber Views Slotted and Closed Chamber Designs Slotted X-ray chambers can accommodate large printed circuit boards and other oversize applications while shielding the operator from X-rays at all times. Slotted chambers are currently available on standard US versions of the GXR and as an option with GXR-C models.Slotted chambers are not available on CE and US/S2-93 configurations.
Page 52 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.4: M XR G/M/V-S IGURE ICRO ERIES ENCHTOP HAMBER XTERIOR IMENSIONS 23.5 in. 58.8 cm. 33.3 in. 83.3 cm. 28.3 in. 70.8 cm. 3-11...
Page 53 MicroXR Service Manual 3.5: M XR GXR, GXRS I IGURE ICRO NTERIOR OMPONENT AYOUT YPICAL Description Description High Voltage Power Supply Transformer Camera/Zoom Optics Assy. Safety/Stepper Board (20321) X-Ray Tube Enclosure System Status Control Board (20223) Sample Loading Laser Integrated Pulse Processing Board (20220)
Page 54 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.6: M XR GXRC, MXRP, MXR I IGURE ICRO NTERIOR OMPONENT AYOUT YPICAL Description Description High Voltage Power Supply Transformer Camera/Zoom Optics Assy. Safety/Stepper Board (20321) X-Ray Tube Enclosure System Status Control Board (20223) Sample Loading Laser Integrated Pulse Processing Board (20220) X-Axis Servo Motor...
Page 55 MicroXR Service Manual Figure 3.7: M XR VXR I ICRO NTERIOR OMPONENT AYOUT YPICAL Description Description High Voltage Power Supply Cooling Fan Camera/Zoom Optics Assy. Detector Cooler Head (Note: Location only; version shown in illustration discontinued) X-Ray Tube Enclosure Safety/Stepper Board (20321)
Page 56 Chapter Three: Product Overview (G/M/V Benchtop Series) F igure 3.8: M XR G/M/V-S ICRO ERIES ENCHTOP HAMBER RONT LEVATION IEWS Note: Illustrations depict generalized layout. Platform-specific system and component views are located in Chapters 5 (Setup and Adjustment), 8 (Maintenance and Component Replacement) and 9 (Electronics). Detailed assembly drawings and electronics schematics are provided in Volume 4 (provided on CD-ROM, or through Customer Service) OMPONENT AYOUT...
Page 57 MicroXR Service Manual 3.1.5: Chamber Control Panel 3.9: M XR C (GXR/MXR/VXR B IGURE ICRO ONTROL ANEL ENCHTOP AND ONSOLE HAMBERS High Voltage Off Lamp: Indicates high voltage is being supplied to the x-ray tube and x-rays are being generated.
Page 58 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.2: System Specifications LXR and ZXR series 3.2.1: General 3.2.1.1: X-Ray Chamber Dimensions: Height Width Length ZXR/LXR 24.0 in (61.0 cm) 24.3 in (61.7 cm) 29.3 in (74.4 cm) ZXRH/LXRH 30.5 in (76.3 cm) 24.3 in (60.8 cm) 29.3 in (73.3 cm) Weight:...
Page 59 MicroXR Service Manual 3.2.1.3: X-Ray Source ZXR/ZXRH: Microfocus W target, Al-Be window spectroscopy grade x-ray tube; 50W max. LXR/LXRH: Microfocus W or Mo target, Be window spectroscopy grade x-ray tube; 50W max. 3.2.1.4: X-Ray Detector Proportional Counter: Air-cooled, 950eV X-ray resolution [FWHM].
Page 60 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.2.1.7: Optics Standard: Sample View: CCTV Camera, fixed-focus optics. (0.477” focal plane.) Option: Multi-planar optical (MPO) package (H-series chambers only) Variable focus measurement. Allows focal plane to be set at multiple heights (0.5 - 4.5” range) in Z-axis.Distance measurements are independent.MPO magnification range is 10 to 100x.
Page 61 MicroXR Service Manual 3.2.2: Applications Performance Capabilities Measurable Elemental Ranges: Sc 21 – U 92 Fundamental Parameters and empirical calibration modes. General film thickness (single, dual, triple layer). Measure up to five layers with six elements per layer (with optional Advanced FP package).
Page 62 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.2.3: Chamber Views Figure 3.10: MicroXR ZXR/LXR X-Ray Chamber - External Dimensions 24.0 in. 60.0 cm. 29.3 in. 73.3 cm 24.3 in. 60.8 cm. Figure 3.11: MicroXR ZXRH/LXRH Extended Z Chamber - External Dimensions 3-21...
Page 63 MicroXR Service Manual 30.5 in. 76.3 cm. 29.3 in. 73.3 cm. 24.3 in. 60.8 cm. 3-22...
Page 64 Chapter Three: Product Overview (G/M/V Benchtop Series) Figure 3.12: MicroXR LXR Chamber (Cutaway View) EGEND 6 Stage Lamp 1 Power Supply 7 PS4000 Main Power Supply Board 2 CCTV Camera 8 System Control Board 3 X-Ray Tube 9 Cooling Fan...
Page 65 MicroXR Service Manual Figure 3.13: MicroXR LXR (Interior Components) EGEND 1 Power Supply PS4000 Main Power Supply Board 2 Stage Lamp System Control Board 3 X-Ray Tube 10 Cooling Fan 4 Detector/Filter Assembly 11 Transformer 5 Collimator Stepper Motor 12 Detector Filter Stepper Motor...
Page 66 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.2.4: Chamber Control Panel A: P OWER WITCH POWER URNS CHAMBER POWER N OR HE RED INDICATOR TO THE LEFT OF THE LABEL ILLUMINATES WHEN THE CHAMBER IS ON B: H OLTAGE NABLE HE HIGH VOLTAGE NABLE FUNCTION IS OPERATED USING A KEY SWITCH URNING THE KEY TO THE...
Page 67: Facilities Requirements
This section describes power, environmental and other site requirements necessary for system installation and operation. 3.3.1: Site Requirements 3.3.1.1: Power MicroXR units are configured per customer request to operate at one of the following line power ratings: 110/120 VAC, 50/60 Hz, 5 amps (350W max) 220/240 VAC, 50/60 Hz, The AC power supply should be as noise-free as possible.
Page 68 AFETY LEARANCES The MicroXR operator should have a clear view of the chamber sample loading area, chamber controls, and video monitor at all times. A minimum clearance of 36 in (91.5cm) measured from front of chamber should be provided for all bench top and console units to insure that unobstructed physical access to critical system controls is provided at all times.
Page 69: Hardware Installation And Setup
This information should be reviewed prior to setting up your system. Your system computer is pre-configured by Thermo Electron in the factory. All software and hardware used to communicate with the X-ray chamber and peripheral devices is installed and tested prior to shipping.
Page 70 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.4.2: Safe Lifting, Handling, and Transportation 3.4.2.1: X-Ray Chamber Once unpacked, the chamber should be transferred from the shipping palette to an electric or manually operated hydraulic elevating cart capable of raising the chamber to the level of the intended support surface.
Page 71 MicroXR Service Manual Figure 3.15: Chamber Center of Gravity and Recommended Manual Lifting Points Axes indicate approximate chamber of center of gravity Arrows indicate best manual lifting points (lifting points for sides of chamber on bottom left; lifting points for front of chamber on bottom right).
Page 72 The shipping bracket must be removed before powering up the chamber. The bracket should be saved in case the hamber must be transported in the future Loosen the (4) hex screws indicated in figure to remove the bracket Note: Tools for removing shipping hardware are included in your MicroXR Accessories Package. 3-31...
Page 73 MicroXR Service Manual 3.4.4: Chamber –Computer and AC Power Interconnects (G, M-Series) Chamber-to-computer and line AC power interconnect details for GXR, GXRS, GXRC, MXRP, and MXR chambers are illustrated in figures 3.17 - 3.21. 3.17: S IGURE YSTEM OMPUTER ARDS...
Page 74 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.18: GXR/MXR C IGURE HAMBER OMPUTER NTERCONNECTS Rotary Encoded Servo Stage Systems (See Section 3.1) Item Description VIDEO Cable PATREC Cable (Option) CHAMBER CONTROL Cable SERVO Cable Fuses (HVPS, STAGE LAMP) AC Power Input Receptacle Aux.
Page 75 MicroXR Service Manual 3.19: GXR/MXR C IGURE HAMBER OMPUTER NTERCONNECTS Dual Rotary-Linear Encoded Servo Stage Systems (See Section 3.1) Item Description Stage Control Cable (SERVO 1) Stage Control Cable (SERVO 2) 3-34...
Page 76 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.20: GXR/MXR C IGURE HAMBER OMPUTER NTERCONNECTS Dual Rotary-Linear Encoded Servo Stage Systems (See Section 3.1) Item Description VIDEO Cable PATREC Cable (Option) CHAMBER CONTROL Cable Fuses (HVPS, STAGE LAMP) AC Power Input Receptacle Aux.
Page 77 MicroXR Service Manual 3.21: GXR/MXR AC P IGURE OWER NTERCONNECTIONS IAGRAM 3-36...
Page 78 The PGT Avalon is a preamp/power PGT Avalon supply and logic interface for the MicroXR VXR SiDD X-ray detector system. PGT Sahara Temperature Controller Box: The PGT Sahara box monitors and controls thermoelectric cooling for the detector.
Page 79 MicroXR Service Manual 3.22: VXR C - AC P IGURE HAMBER NTERCONNECTS OWER HAMBER ANEL TO OMPUTER Item Description Pattern Recognition card to chamber PATREC port (optional) Chamber Control card to CHAMBER CONTROL port Video card to chamber chamber VIDEO jack Fuses (Left: HVPS;...
Page 80 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.23: VXR C IGURE HAMBER NTERCONNECTS ACUUM TAGE ONTROL ANEL TO OMPUTER Item Description Vacuum Hose (3/4" flexible metal tubing with NPD fittings at both ends) PicoDry logic interconnect (15 pin male) to chamber VAC port (9 pin female) Computer (25 pin male) to chamber SERVO I port (25 pin female) Computer (100 pin) to chamber SERVO II port (100 pin) 3-39...
Page 81 MicroXR Service Manual 3.24: VXR C – SDD D IGURE HAMBER NTERCONNECTS ETECTION YSTEM OMPONENTS TO OMPUTER Item Description Sahara Temp Controller Box (15 Pin) to Detector Head (15 Pin) Avalon Pulse Reset Preamp Interface connector (15 Pin) to Detector Head Power/Signal Connector...
Page 82 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.25: M XR VXR AC P IGURE ICRO OWER UPPLY HAIN 3-41...
Page 83 MicroXR Service Manual 3.4.6: Computer-Chamber and AC Power Interconnects (ZXR, LXR series) Chamber-to-computer and line AC power interconnect details are shown in figures 3.26 - 3.28 Note: Figure 3.27 depicts generalized PC-compatible computer and typical card installation. Actual locations of computer cards and slots on your system may vary.
Page 84 Chapter Three: Product Overview (G/M/V Benchtop Series) Figure 3.26: System Z/LXR Chamber Rear Panel EGEND IAGNOSTIC HAMBER ONTROL IDEO ERVO ONTROL PTIONAL USES AC P OWER ECEPTACLE HAMBER CCESS 3-43...
Page 85 MicroXR Service Manual Figure 3.27: System Computer Connections (Typical Configuration Shown) LEGEND: USB Ports CHAMBER Control Trackball Port SERVO Port (Optional) Keyboard Port MONITOR Port AC Power Input VIDEO Port Serial Port (COM2) Not Shown: Network interface card Parallel Port (to Printer)
Page 86 Chapter Three: Product Overview (G/M/V Benchtop Series) Figure 3.28: MicroXR Z/LXR AC Power Interonnection Diagram...
Page 87 The Silicon Drift Detector (SDD) requires two external components. Figure 3.37 illustrates the proper connections of the SDD and the system computer. 3.4.7.5: AC Power Connections Figure 3.38 shows the recommended AC power connections between the MicroXR VXR chamber and main outboard components. 3-46...
Page 88 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.29: T (NSS) D IGURE HERMO YSTEM IGITAL ULSE ROCESSOR...
Page 89 MicroXR Service Manual 3.30: S (SDD) S IGURE ILICON RIFT ETECTOR UPPORT 3.31: U (UPS). IGURE NINTERRUPTIBLE OWER UPPLY 3-48...
Page 90 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.32: V IGURE ACUUM ONDUIT EFT SHOWN WITH COVER IGHT SHOWN WITHOUT COVER 3-49...
Page 91 MicroXR Service Manual 3.4.7.1: VXR Chamber and Computer Interconnects Figures 3.33 and 3.34 illustrate data and device interconnects on the VXR system computer. Detailed connection diagrams for all system devices are provided in sections 3.4.7.2 - 3.4.7.5. 3.33: S IGURE...
Page 92 Chapter Three: Product Overview (G/M/V Benchtop Series) EGEND Detector Bios Voltage and Temperature Controller Port Detector Preamp Output Video Out Jack (VIDEO) Pattern Recognition Port (PATREC) – Available Option. Chamber Control Port (CHAMBER) Fuses (HVPS, STAGE LAMP) AC Power Input Receptacle Vacuum Control Port (VAC CONTROL) Vacuum Line Connection Stage Control Port (STAGE I)
Page 93 MicroXR Service Manual 3.4.7.2: VXR Vacuum Pump/Stage Control Panel Interconnects The VXR uses a vacuum pump to evacuate the X-ray beam generation column, thereby extending the detectable elemental range of the system. Figure 3.35 illustrates the proper connections for the vacuum pump.
Page 94 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.36: V IGURE ACUUM AND TAGE ONTROL NTERCONNECTS Legend: Vacuum Hose (3/4" flexible metal tubing with NPD fittings at both ends) Pump logic interconnect (15 pin male) to chamber VAC port (9 pin female) Computer (25 pin male) to chamber STAGE I port (25 pin female) Computer (100 pin) to chamber STAGE II port (100 pin) Note: Actual card locations on your system computer may differ from those shown.
Page 95 MicroXR Service Manual 3.4.7.3: VXR Power/Chamber Panel Interconnects Interconnect ports for the Chamber Control, Video, and Pattern Recognition cards, as well as AC power receptacles and fuses, are located on the right side (facing) of the VXR chamber. Figure 3.37 illustrates the proper chamber-to-computer connections for these features.
Page 96 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.4.7.4: Detector Connections The Silicon Drift Detector (SDD) requires two external components. Figure 3.38 illustrates the proper connections of the SDD and the system computer. 3.38: D IGURE ETECTOR ONNECTIONS LEGEND: “Detector” (15pin D-Sub Female) to “SDD Controller” (15pin D-Sub Male) “SDD Detector”...
Page 97 MicroXR Service Manual 3.4.7.5: AC Power Connections Figure 3.39 shows the recommended AC power connections between the MicroXR VXR chamber and main outboard components. Maximum power ratings are given in section 3.3.1 and in the manufacturer documentation provided with each component 3.39: M...
Page 98 ). The system Start > Programs > XPert Analysis> XPert Analysis will perform communications, electricals, and stage travel testing. When all tests are successfully completed, MicroXR is ready for use. 3.4.8.2: To Power Down MicroXR VXR Exit XPert Analysis. Turn off the chamber.
Page 99 MicroXR Service Manual 3.4.9: Thermo SuperDry II X-ray Detector Installation The SuperDry II X-Ray Detector is a detector option available for the MicroXR VXR systems. The SuperDry II requires a stable temperature chilled water supply to cool an internal heat sink. A chilled water system is provided with each system.
Page 100 3.4.9.1 BENCHTOP VXR SuperDry II INSTALLATTION Objective: This procedure provides procedures for installation of a SuperDry II X-ray detector in a MicroXR VXR benchtop system. Tools Needed: T-handle hex driver set (various sizes, Metric and English) and standard ball-driver hex wrench set.
Page 101 MicroXR Service Manual 3.40: VXR S II D IGURE UPER ETECTOR HIPPING OVER Shipping Tube (700P138260) X-ray window Remove the SuperDry II cover (item 5, page 2) from the detector. Cover removal is necessary because detector mounting holes are only accessible with cover removed.
Page 102 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.41: VXR S II D & A IGURE UPER ETECTOR OUNTING DJUSTMENT ARDWARE Legend: Description Description 8-32 x ¾” Socket Head Cap Screw (5) Detector Mounting Plate #8 Split Lock Washer (5) Front Position Adjuster (X-axis adjustment) Nylon Shoulder Washer (6) Center Pivot Adjustment (one each side) M3 x 10mm Button Head Screw (4)
Page 103 MicroXR Service Manual Note that nylon shoulder washers (item 3) are to be used in the mounting holes to assist with electrical isolation of detector. These nylon shoulder washers may already be inserted in the mounting holes from the factory. If not, carefully insert the nylon shoulder washers (item 3) that came with the SuperDry II installation hardware, into the six counterbore mounting holes.
Page 104 Chapter Three: Product Overview (G/M/V Benchtop Series) Tighten the six (6) ¼-20 socket cap screws that were loosened in Step 11 as well as any other mounting hardware that was loosened, to secure the detector mounting plate into position, checking tip alignment as you proceed. If the detector tip shifts out of alignment after retightening, back off on the hardware and repeat steps 12 &...
Page 105 MicroXR Service Manual 3.43: D IGURE ETECTOR ONNECTIONS Power supply NSS analyzer Computer SuperDry II LEGEND: “TO DETECTOR” (9pin D-Sub Male) to “POWER SUPPLY” (Cable P/N 085-874100) “PREAMPLIFIER” (15pin D-Sub Female) to “Detector PreAmp” (Cable P/N 085-874400) RJ-45 Cable provided with Analyzer (special crossover cable p/n 610A151595) Proceed to COOLING WATER section of this document for Plumbing Kit and water tubing connection details prior to powering up any equipment.
Page 106 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.4.9.2 COOLING WATER MOUNTING/CONNECTIONS Objective: This procedure provides procedures for mounting and installation of the water plumbing kit and water line connections to the SuperDry II detector. 3.6.2.1 Cooling Water Specifications Power Requirement for NESLAB Recirculating Chiller [Domestic] 115VAC 60Hz;...
Page 107 MicroXR Service Manual PLUMBING KIT (470-263500) FLOWMETER MAGNETIC BASE The Plumbing Kit (470-263500) is provided on a magnetic base which normally can just be located on top of the water chiller unit as shown in the image above. The magnetic base provides the flexibility of locating the Plumbing Kit on other steel surfaces (horizontal or vertical) if the water chiller unit is not in a handy location.
Page 108 Chapter Three: Product Overview (G/M/V Benchtop Series) “DRAIN” WATER RETURN TUBE TO WATER CHILLER “SUPPLY” WATER SUPPLY TUBE FROM WATER CHILLER WATER CHILLER UNIT Connect the water supply tube (from the water chiller) to the back of the flow meter bottom quick connector.
Page 109 MicroXR Service Manual 3.46: W IGURE ATER HILLER ONNECTIONS Two water tubes with quick-connect fittings are supplied to connect the SuperDry II detector to the Plumbing Kit as shown in Figure 3.46. Connect one of the tubes from the “SUPPLY” port on the Plumbing Kit to the “WATER IN”...
Page 110 Chapter Three: Product Overview (G/M/V Benchtop Series) 3.4.9.3 VXR POWER UP Reengage main power cord from the VXR instrument to the AC power source. Turn on the UPS. To turn this on, press and hold the ‘ON’ button until you hear the UPS beep (~ 1 sec).
Page 111 MicroXR Service Manual Record final Resistance Reading: Ω When at operating temperature, the green READY light on the rear of the SuperDry II detector should be illuminated. Turn on the NSS System Six Analyzer (DPP) and wait for three LED’s visible in the front window to light up.
Page 112: Chapter 4: Theory Of Operation
4.3.4: Tube Related Service Issues 4.4: X-Ray Collimation 4-18 4.4.1: Overview 4.4.2: Mechanical Collimation 4.4.3: Optical Collimation 4.5: X-Ray Detection 4-21 4.5.1: Overview 4.5.2: Proportional Counter Detectors 4.5.3: Solid State Detectors 4.5.4: Detector Resolution 4.5.5: Comparison of MicroXR Detector Types...
Page 113 MicronX Service Manual 4.6: Pulse Processing 4-32 4.6.1: Overview 4.6.2: Preamplifier 4.6.3: Amplifier 4.6.4: Analog-to-Digital Converter and Multi-Channel Analyzer 4.6.5: Pulse Processing Issues 4.7: Qualitative & Quantitative Analysis 4-39 4.7.1: Calibrating the System 4.7.2: System Adjust (Peak Correction) 4.7.3: Measurement Variation 4.8: X-Ray Beam Targeting 4-50 4.8.1: Overview...
Page 114: Principles Of X-Ray Fluorescence
Chapter Four: Theory of Operation 4.1: Principles of X-Ray Fluorescence 4.1.1: Atomic Structure On a schematic level, all atoms can be represented by a positively charged nucleus surrounded by negatively charged electrons occupying discrete orbitals or “shells” around the nucleus. The nucleus is composed of protons and neutrons. Protons have mass and are positively charged particles.
Page 115 MicronX Service Manual 4.1: X-R IGURE LUORESCENCE An incoming X-ray photon strikes an electron orbiting the atomic nucleus. The electron breaks free of its orbit and leaves the atom. An electron from a higher energy orbital replaces the freed electron (electron cascading).
Page 116 Chapter Four: Theory of Operation 4.2: K-L-M L IGURE PECTRA HART The chart diagrams intra-atom electron β5 transitions responsible for principal x-ray spectral δ1 lines of analytical interest (K-L-M). The numeral α1 δ2 following each orbital symbol (K,LI,LII, etc) is the α2 β...
Page 117 MicronX Service Manual Ι/Ι = exp(-µ ρd) ο Ι/Ι ρ Where is the fraction of x-rays transmitted through thickness of a material of density ο The parameter µ is referred to as the mass absorption coefficient, and is a function of the atomic number Z of the absorbing element and the energy E of the incident x-ray.
Page 118 Chapter Four: Theory of Operation 4.1.3.1: Secondary Fluorescence When an atom in the sample absorbs an x-ray, the absorbing atom is left in an excited state. It subsequently “relaxes” emitting its own characteristic x-rays in a process termed secondary fluorescence. Since an x-ray can be absorbed only in an interaction with an electron having a binding energy less than the energy of the absorbed x-ray, energy from secondary fluorescence is necessarily less than the energy of the primary x-ray.
Page 119 MicronX Service Manual 4.1.3.4: Auger Electrons As indicated previously, when a primary electron ejects an orbital electron, creating a vacancy, and the vacancy is filled by an intra-atomic transition, a characteristic x-ray is emitted. This x-ray may escape from the sample and be detected, or it may be re-absorbed within the same atom, ejecting a lower energy electron.
Page 120 Chapter Four: Theory of Operation 4.1.3.5: Coherent (Thompson-Rayleigh) Scattering Coherent scattering, sometimes referred to as Thomson-Rayleigh scattering, occurs from strongly bound electrons, if a very low energy x-ray photon interacts with a strongly bound electron that may be set into vibration. It involves no energy loss, but results in the deflection of the incident x-ray photon from its original path, as shown in figure 4.5.
Page 121 MicronX Service Manual 4.6: I IGURE NCOHERENT OMPTON CATTERING Part of the photons energy has been used up in removing a loosely bound orbital electron. Therefore, the emerging photon has less energy; it has also undergone a change in direction. 4-10...
Page 122: Xrf System Overview
Chapter Four: Theory of Operation 4.2: XRF System Overview 4.2.1: Introduction The basic design of any XRF thickness and composition metrology tool incorporates the following features: A source of high intensity x-rays. A collimation apparatus to define the x-ray beam size. X-ray beam targeting and sample positioning mechanisms.
Page 123 MicronX Service Manual 4.2.2: How It Works When an element is exposed to a source of high intensity x-rays, it will emit x-rays (fluoresce) at energy levels unique to that element. The XRF tool uses a high intensity x-ray tube to generate x-rays. These primary beam x-rays are directed through a collimator and emerge in a tightly focused resultant beam with a specific cross-sectional geometry.
Page 124: X-Ray Generation
To use x-ray fluorescence to measure coating thickness, it is necessary to excite the sample atoms with some form of ionizing radiation. MicroXR systems employ a spectroscopy grade x-ray tube powered by a 47kV high voltage power supply (HVPS). Consistent tube output is required to produce the controlled, non-varying source of x-rays essential to obtaining re- peatable, stable measurement results from the instrument.
Page 125 MicronX Service Manual Current applied to the filament liberates electrons into free space within the tube. Electrons are accelerated toward the target by an electric field produced by a high voltage power supply. Electrons interact with the target to produce primary beam x-rays.
Page 126 Chapter Four: Theory of Operation 4.9: X-R IGURE BSORPTION AND LUORESCENCE [A] Photoelectric Effect Filament electrons transfer energy to target atom electrons, causing ejection of those electrons from their orbitals and a resultant photoelectric emission (fluorescence). [B] Bremstrahlung Literally, “braking radiation”. Filament electrons are attracted to the strong positive charge of the nuclei, causing deceleration and release of energy.
Page 127 Additional factors include: Heat: Since the tube is a major heat-producing source in the MicroXR chamber, a fan with accompanying duct supplies a constant flow of cooler air to the tube assembly. Excessive heat can damage the tube and/or enclosure, typically resulting in oil leakage and eventual arcing of the x-ray tube, leading to catastrophic tube failure.
Page 128 Chapter Four: Theory of Operation Tube Aging: Long term, all x-ray tubes will exhibit a very gradual degradation, which is natural and will affect output intensity. Compensating for normal tube aging accomplished by re-calibrating the instrument. Oil Leakage: Leaking tube enclosures must be replaced since the loss of dielectric material is almost certain to result in tube arcing and consequent damage.
Page 129: X-Ray Collimation
MicronX Service Manual 4.4: X-Ray Collimation 4.4.1: Overview For accurate XRF sample analysis, it is necessary to assure that the measurement area (the area of a sample exposed to x-rays) does not vary. The purpose of the collimator is cohere the primary beam x-rays into a consistent, controlled, well-defined beam geometry.
Page 130 Chapter Four: Theory of Operation Precise physical alignment of the collimator with the central axis of the x-ray beam emerging from the shutter assembly is critical to maximizing incident beam x-rays and therefore x-ray counts induced from the measurement area. Mechanical binding or obstruction of any kind in the collimator assembly will affect x-ray output, and therefore overall measurement precision.
Page 131 MicronX Service Manual Polycapillary x-ray optics use hollow capillaries as wave guides for x-rays. The optics are formed from 100,000 to several million hollow glass channels bundled together. The principle behind their operation is the multiple total external reflection of x-rays from the smooth inner walls of the capillary channels (see below).
Page 132: X-Ray Detection
Chapter Four: Theory of Operation 4.5: X-Ray Detection 4.5.1: Overview Once a sample has been excited to fluorescence, a detection apparatus is required to collect x- rays and convert them into electronic signals (pulses) which can then be used to determine characteristic energies and intensities (number of x-rays per unit time) emitted from the sample.
Page 133 MicronX Service Manual When the ions reach their respective oppositely charged electrodes, a sudden drop in potential is measured at the detector output. The detector behaves just like a partially discharged capac- itor. The power supply will tend to restore the original 1.85kV bias through a load resistor. The resultant output from the proportional counter will be similar to that shown in figure 4.17.
Page 134 Chapter Four: Theory of Operation 4.18: A IGURE BSORPTION In the example nickel on copper sample measurement below (fig. 4.19), the sample fluoresces both Ni x-rays and Cu x-rays Ni (7.4 KeV) and Cu (8.0 KeV) are relatively close in energy and as a result the unfiltered spectrum will show one broad peak, with no evidence of two dif- ferent characteristic x-ray energies immediately noticeable.
Page 135 Numerical filtering (or peak deconvolution) employs special algorithms to mathematically de-compose spectral overlap. When a purely mathematical filtering technique is available for an application, the above situations are eliminated. MicroXR incorporates both mechanical and numerical filtering methods. 4-24...
Page 136 Chapter Four: Theory of Operation 4.5.3: Solid State Detectors Semiconductor detectors use a high-purity crystal (typically silicon, although other designs employ germanium) that responds to x-rays in a manner similar to the gas in the proportional counter. The two most common semiconductor detectors are the PIN Diode and Si(Li) types.
Page 137 MicronX Service Manual 4.5.3.1: P-N Junction In a perfect silicon crystal, all atoms share valence electrons (covalent bond) and no electrons are in the conductance band. However, it is difficult to obtain pure crystals and normally occurring impurities within the crystal create local areas of electron shortages (or “holes”) and excesses.
Page 138 Chapter Four: Theory of Operation 4.5.3.2: Detector Cooling Even the purest silicon crystal structure will demonstrate a residual conductivity, or leakage current, primarily due to thermal excitation of electrons (thermionic noise). To minimize electron-hole creation due to thermal effects (insuring that pulses are produced in response to x-ray ionizations only), detector crystals are held at very low temperatures by the use of thermoelectric coolers (or in older designs, liquid nitrogen).
Page 139 MicronX Service Manual 4.5.4: Detector Resolution Resolution refers to a detector's ability to: Produce the same signal for two x-ray photons with the same energy. Distinguish between x-ray photons with different characteristic energies. Higher-resolution solid-state detectors tend to produce narrow, sharp spectral peaks in comparison to the broader peaks produced by lower-resolution gas proportional counter detectors.
Page 140 Chapter Four: Theory of Operation The standard formula used to represent detector resolution is Full Width-Half Max (FWHM). FWHM is derived by first identifying the peak channel (the channel containing the highest number of x-ray counts) in a spectrum obtained from a pure element (typically Fe). The total number of counts in all channels left of the peak channel is subtracted from the total number of counts in all channels to the right of the peak channel.
Page 141 MicronX Service Manual 4.5.4.1: Factors Affecting Spectral Resolution If a “perfect” detector existed and if all x-ray producing events occurred at discrete and predictable intervals, all of the characteristic x-rays counted for a specific x-ray line would accumulate within a single energy range (channel) in the spectrum (as shown in figure 4.25, top).
Page 142 Chapter Four: Theory of Operation 4.5.5: MicroXR Detector Types by Model Four types of detector are currently used in MicroXR systems: a gas proportional counter and three varieties of semiconductor based design: PIN Diode, lithium-drifted silicon or Si(Li) and Silicon Drift Chamber (SDD). General features and models using each type are summarized below.
Page 143: Pulse Processing
MicronX Service Manual 4.6: Pulse Processing 4.6.1: Overview While a measurement is in progress, the pulses produced by the detector occur in a time sequence with many other pulses. The time between incoming x-rays is variable and unpre- dictable. The pulse processing section of the detection hardware is used to make sense of this output, allowing us to discriminate and count pulse heights, thereby extracting usable information about the x-ray energies and intensities detected.
Page 144 Chapter Four: Theory of Operation steps from the photon charges. (See fig. 4.28b.) The magnitude of each step is proportional to the integrated current conducted by the detector for each X-ray event. To reduce thermal and transmission noise, the FET is physically positioned adjacent to the crystal and is thermoelectrically cooled.
Page 145 MicronX Service Manual From this information a frequency distribution (histogram of x-ray counts and channel numbers, or energies can be generated. This histogram is known as a spectrum. From the spectrum, the analyzer (i.e, system computer & software) can determine thickness and in some cases, composition, of the sample.
Page 146 Chapter Four: Theory of Operation 4.6.5: Pulse Processing Issues An XRF measurement represents the detection of x-ray events over some finite preset time period. At all stages along the pulse processing signal chain, proportionality between the detected x-ray energy, the analog pulse amplitude, the digitized pulse value and the corresponding channel number is strictly maintained.
Page 147 MicronX Service Manual Left: Spectrum before background processing. Right: Spectrum with background removed. 4.6.5.3: Dead-Time Correction "Dead-time" refers to the finite amount of time required to detect an x-ray photon, process the signal into a pulse and sort the digitized pulse into a channel. During this time, additional x-rays entering the detector cannot be detected or processed.
Page 148 Chapter Four: Theory of Operation Some pulse pile-up will occur at any x-ray counting rate, but as countrates increase, the likelihood that pulse pile-up will occur increases so that it can be a significant problem at high x-ray intensity rates. 4.32: P IGURE ULSE...
Page 149 MicronX Service Manual 4.6.5.6: Charge Trapping (Dead Layer) In semiconductor detectors, the “dead layer” is a layer at the silicon crystal surface in which impurity neutralization has not been achieved by the lithium drifting process. Excess “holes” therefore remain. The result is the phenomenon of incomplete charge collection or charge trapping, in which charges created as a result of x-ray absorption may be trapped in the crystal rather than being swept out by the bias voltage and measured in the output pulse.
Page 150: Quantitative Analysis
Chapter Four: Theory of Operation 4.7: Quantitative Analysis 4.7.1: Calibrating the System To convert processed spectral data into quantitative and qualitative determinations requires mathematical models that correlate x-ray countrates to thickness and composition. These models are called calibrations. Calibration is accomplished by both empirical and fundamental parameters techniques.
Page 151 MicronX Service Manual applications. Each unique application requires a stored calibration performed using standards composed of the same materials as the sample under analysis. Accurate calibration of the XRF tool is dependent on the availability of high-quality standards for the specific application under analysis. 4.35: C IGURE ALIBRATION...
Page 152 The mathematical model is often enhanced through the use of physical standards (the Standard-FP method). FP techniques offer versatility and generally enhanced capability. For certain applications, however, empirical calibration offers a more accurate, simple, flexible and reliable solution. MicroXR incorporates both calibration techniques. 4-41...
Page 153 MicronX Service Manual 4.7.2: System Adjust (Peak Corrections) Variation in pulse output by detection system components may be due to environmental factors (such as temperature), normal aging or other performance factors will directly affect x- ray counting and, therefore, measurement performance. This type of instrument “drift” is routinely compensated for by means of a System Adjust procedure.
Page 154 Chapter Four: Theory of Operation 4.7.2.3: Stability and Drift-Related Measurement Issues It is important when troubleshooting stability problems that you determine whether they are repeatability problems (erratic measurements with random variations) or drift problems (systematic, one-way continuous shift in results). It is also important to determine if these problems are related to overall countrate (intensity) changes, or to peak shifts.
Page 155 MicronX Service Manual Examples include measurements on samples that are very non-uniform and do not always compare well unless carefully performed. Certain applications are simply more prone to drift and are less repeatable than others (for example, Cr/Fe is more sensitive to drift and not as repeatable as Ag/Cu).
Page 156 Chapter Four: Theory of Operation 4.7.3: Measurement Variation To complete our discussion of the concepts behind XRF thickness measurement, a few words about the statistical nature of XRF measurements are necessary. If you measure the same sample at the same location repeatedly, you will notice that the values for each measurement are not identical;...
Page 157 MicronX Service Manual While peak location variation can affect countrates when using a fixed, unchanging region of interest, countrate variation is mainly associated with radiation statistics. When using x-ray sources excite a measurable response from a material, we cannot completely assure that the same number of radiation "particles"...
Page 158 Chapter Four: Theory of Operation Fortunately, it is possible when measuring thickness to predict that level of uncertainty or variation we may expect from the instrument. Based on radiation statistics, we can approximate the predicted countrate variation and incorporate the possible countrate variations into our thickness calculating function.
Page 159 MicronX Service Manual 4.39 IGURE A second and crucial factor to keep in mind is that variation in number of counts (not countrate) decreases as time increases. In other words, as we increase measuring time, we increase the overall number of counts collected. The tendency is to collect a more consistent number of counts from measurement interval to measurement interval when that interval is of longer duration.
Page 160 Therefore, the solution to "erratic", "unstable" measurements in some cases will be to simply recommend an increased measurement time. The MicroXR displays the predicted measurement uncertainty, or Relative Standard Devia- tion (RSD), when XPert's onscreen statistics window is displayed. This statistic is constantly updated after each measurement to reflect the uncertainty expected, also taking into account the conditions of use (i.e., beam size, intensity setting, application, thickness).
Page 161: X-Ray Beam Targeting
MicronX Service Manual 4.8: X-Ray Beam Targeting - Optics & Stage 4.8.1: Overview Precise and consistent x-ray beam to sample orientation is essential to insuring accurate, repeatable, and reproducible XRF measurements. As sample structures become smaller, advanced optics and high-precision stage mechanisms for x-ray targeting are required to maintain overall XRF measurement performance.
Page 162 Chapter Four: Theory of Operation When measuring extremely small sample structures (in some instances so small that the incident x-ray beam and the area to be measured are close in size), accurate, repeatable XYZ staging is critical to maintaining precise beam-to-sample alignment for maximum x-ray counts.
Page 163 MicronX Service Manual 4.8.3.2: Stage Types Used in MicroXR Systems Figure 4.42 lists MicroXR sample staging configurations by model. 4. 42: M XR S IGURE ICRO TAGE YPES BY ODEL Stage Travel Model Mfg. Stage/Encoder Type Mechanical Limit Type (Nominal, Inches)
Page 164 Chapter Four: Theory of Operation problems will result in a discrepancy between actual stage position and the location at which computer expects and reports the stage to be. The only way to accurately re-establish the stage position is to re-initialize by sending it “home” through a software command in XPert. (Click onscreen “Z”...
Page 165: Safety Test
Setup & Adjustment VXR: Introduction This chapter provides detailed instructions for the setup and adjustment of MicroXR model VXR x-ray chambers. Also included are the procedures used to test and calibrate system performance following preliminary configuration. You will find that most of the information in this chapter also has applications in general troubleshooting and maintenance.
Page 166 MicroXR Service Manual 5.2.4.3: Stage Travel Limits Setup (X, Y Axes) 5.2.4.4: Stage Travel Limits Setup (Z Axis) 5.2.4.5: Crash Protection Setup 5.2.4.6: Stage XYZ Travel Test 5.2.4.7: Stage X-Y Rotation Test 5.2.4.8: Stage Flatness Test 5.2.4.9: Stage Repeatability Test 5.2.4.10: Reference Standard Setup...
Page 167 Chapter Five: Setup & Adjustment (VXR) 5.1: Safety Tests 5.1.1: Overview This section provides procedures to verify that all system safety interlocks are performing to specification. Section Procedure Description Overview of software-based chamber test procedures. (See 5.1.1.1 Chamber Tests Window Chapter 6 for additional software diagnostic and test functions.) 5.1.2 Survey Meter Testing...
Page 168 MicroXR Service Manual 5.1.1.1: Chamber Tests Window The Chamber Tests utility lets you test and troubleshoot radiation safety interlocks, stepper motor and stage repeatability, and overall system measurement stability. The Chamber Tests window (fig. 5.1) is accessed in XPert Analysis service mode by clicking the toolbar button shown at left.
Page 169 Chapter Five: Setup & Adjustment (VXR) 5.1.2: Survey Meter Testing The Survey Meter test holds the shutter open for up to 300 seconds. During this time, radiation levels around the X-ray chamber are measured to verify system compliance with federal and state personnel radiation safety standards. Note: Additional information regarding federal and state radiation safety standards and regulations is provided in Chapter 2, Safety.
Page 170 MicroXR Service Manual If radiation levels at any location exceed 0.05 mR/hr above background level consistently for more than one minute, the survey test has failed. Record the radiation reading and immediately ramp down chamber high voltage and troubleshoot the system to identify and remedy the source of the failure.
Page 171 Chapter Five: Setup & Adjustment (VXR) 5.1.3: Safety Interlock Tests The X-ray chamber is designed to insure that the shutter closes immediately if a chamber door is opened while a measurement is underway. The Door Interlocks test verifies that all door and shutter radiation safety interlocks are functioning properly.
Page 172 Currently, testing these indicators requires you to temporarily remove the front service access cover and detach connections on the membrane panel and Control Panel Board (P/N 16600). Note: A fixture may be available that allows testing without removal of the CPB; contact the Thermo Electron service department for additional information.
Page 173 Chapter Five: Setup & Adjustment (VXR) 5.4: M XR C IGURE ICRO HAMBER ONTROL ANEL When illuminated, high voltage is being supplied to the X-Ray tube and X-rays OLTAGE are being generated. Depressing the switch immediately cuts tube current, halting X-ray generation. Toggles chamber power On or Off.
Page 174 Replace the malfunctioning LED. (See figure 5.6.) If there is a lamp malfunction and you are still able to ramp tube current, shut down the system immediately and report the problem to the Thermo Electron Service Department. Testing the Interlocks: Exit XPert Analysis and power down the system.
Page 175 If either interlock fails, you should contact the Thermo Electron Service Department and report the problem. Under no circumstances should you attempt to operate MicroXR equipment if an interlock failure occurs! (See Chapter 2, Safety for addition interlock descriptions.)
Page 176 MicroXR Service Manual 5.1.4: Background Test The Background Test measures for radiation leakage inside the chamber and/or excessive "noise" in the system electronics. The test is initiated in XPert service mode by clicking the Background button in the Chamber Tests window. (See figure 5.1.) The test consists of a series of measurements, performed with the shutter alternately open and closed.
Page 177 5.2.1: Overview This section details setup, adjustment and test procedures necessary to configure new MicroXR systems. Tasks are sequenced according to the order in which they are generally performed following production. Most of the information included in this section is also relevant to troubleshooting and overall system maintenance.
Page 178 MicroXR Model. Note: To view and/or alter system default settings in MicroXR Utilities, you will need to enter the service password for your system. If you do not know your service password, or need to change the password, contact the Thermo Electron service department.
Page 179 Chapter Five: Setup & Adjustment (VXR) 5.7: M XR U IGURE ICRO TILITIES YSTEM ELECT CREEN Use Existing Configuration: Use previously configured system settings. Reconfigure: Proceed to Chamber and Stage Settings to review/reconfigure options. (See figure 5.8.) 5.8: M XR U IGURE ICRO TILITIES...
Page 180 Linear) encoder configuration. (Rotary Encoder is default setting.) Stage Gear Ratios Default parameters shown. May need to be changed if stage mechanism is upgraded. Users should not alter default settings for selected model without first consulting Thermo Electron service department! 5-16...
Page 181 Chapter Five: Setup & Adjustment (VXR) 5.2.3: Optics Setup Procedures This section details the adjustments necessary to align the video camera and focusing optics for accurate sample placement and X-ray beam targeting. Section Procedure Description Calibrate optics for maximum focus at optimum work 5.2.3.1 Focal Height Setup distance (the distance between the emergent incident...
Page 182 MicroXR Service Manual 5.10: Z IGURE PTICS SSEMBLY Description Description Video Camera Zoom Gear (See detail, figure 5.14) Camera Mounting Collars Fiber Optics Cable Input (Parfocality/Colinearity Adjustment) Clamp Focus Adjust Wheel Relay Mirror Housing Zoom Optics Mechanism Zoom Stepper Motor...
Page 183 Chapter Five: Setup & Adjustment (VXR) 5.2.3.1: Focal Height Setup Objective: Calibrate optics so that fine sample focus is achieved at the optimum collimator-to-sample work distance for the system. Tools Needed: Focus alignment tool (P/N 21204) or 0.080” (2.0 mm) shim. (See fig. 5.11.) A flat sample object with fine surface detail to aid in focusing (or a commercially available resolution standard).
Page 184 MicroXR Service Manual 5.11: W IGURE ISTANCE OMBINATION 0.477” (11.93 mm) 5.13: F XR C IGURE OCAL EIGHT ETTINGS FOR ICRO HAMBERS 0.375” (9.4 mm) 0.080” (2.0 mm) 5.12: W IGURE ISTANCE OMBINATION IN PLACE 5.13: F XR C IGURE...
Page 185 Chapter Five: Setup & Adjustment (VXR) 5.2.3.2: Calibrate Zoom Optics Home Position Objective: Adjust opto gear alignment relative to limit sensor and zoom optics position. (See detail, figure 5.14.) When properly adjusted, you should be able to send the zoom optics mechanism to its “home”...
Page 186 MicroXR Service Manual 5.2.3.2.2: Adjust Zoom Optics Home Position & Offset Note: After completing this procedure, you must recalibrate Point & Shoot. (See section 5.2.3.5.) 5.14: Z IGURE PTICS ECHANISM ETAIL Opto Gear Drive Gear Zoom Gear Zoom Motor Rotate the zoom motor shaft (use knob on rear of motor) until you locate the Drive gear setscrew.
Page 187 Chapter Five: Setup & Adjustment (VXR) Manually rotate the Opto gear until the hole is aligned between the sensor posts. (Note: The red LED on the sensor lights up to indicate alignment.) Reinstall the Zoom and Drive gears removed in steps 1 - 4. Be careful to maintain the relative positions of the opto gear and zoom mechanism during reinstallation.
Page 188 MicroXR Service Manual 5.2.3.3: Zoom Optics Parfocality Adjustment Objective: Samples should remain consistently focused at all zoom levels (parfocality). If precise focus is not maintained, optics require mechanical adjustment. Tools Needed: 0.050”, 5/64” hex driver or allen key. To Check & Adjust Parfocality: Locate a horizontal line on the stage (or fixtured wafer sample) to use as a position reference.
Page 189 Chapter Five: Setup & Adjustment (VXR) 5.15: IGURE CCTV C AMERA OUNTING SSEMBLY A : Parfocality Adjust Set Screws, (3) .050” B: Parfocality Adjust Set Screws, (2) 5/64” C: Colinearity Adjust Set Screws, (3) 5/64” CCTV CAMERA Note: Actual assembly may vary slightly from figure shown.
Page 190 MicroXR Service Manual Zoom to Mag 5. If the reference point remains centered, no further adjustment is necessary; if it does not, move the stage to re-center the reference point. Zoom to Mag 1. Continue adjusting the colinearity set screws as described in Step Continue this zoom-and-adjust process until the reference point is precisely centered at both highest and lowest magnification levels.
Page 191 Chapter Five: Setup & Adjustment (VXR) 5.2.3.5: Reticle Calibration Objective: To accurately target the x-ray beam and maneuver the stage using “Point & Shoot”, the computer-generated reticle must be properly scaled and aligned relative to the sample view video display, as follows: Reticle Centering and Overlay Stretch: Check and if necessary, adjust reticle centering.
Page 192 MicroXR Service Manual 5.2.3.5.2: Check/Adjust Video Overlay Offset Factor Click the Reticle Calibration button. (Note: In reticle calibration mode, the video window is always maximized.) Focus on the stage plate. Locate a small, but readily visible surface mark to use as a reference point.
Page 193 Chapter Five: Setup & Adjustment (VXR) Once again, check the position of the reference mark in the smaller window; if it is centered, no further adjustment is required. If it is still off-center, continue adjusting as described in steps 1 - 8 until the video overlay is consistent at both minimized and maximized views.
Page 194 MicroXR Service Manual 5.16: R IGURE ETICLE ALIBRATION PTIONS Off: Switch back to normal point and shoot operation. Reticle Center: Use control arrow keys (or click with cursor) to center reticle origin over video window. (Tip: Reticle axes should be centered at stage control slide boxes on left and botton sides of display.)
Page 195 Chapter Five: Setup & Adjustment (VXR) 5.2.4: Stage Setup Procedures This section describes how to test and adjust the motorized sample stage, as follows: Section Procedure Description Set proper gap between encoder strip (on X and Y stage Linear Encoder Adjustment axes) and encoder reading modules, verify that encoders 5.2.4.1 are reporting correct stage coordinates to software.
Page 196 Set proper gap (approximately 0.8mm) between encoder strip on X and Y stage rails and encoder read head modules. Tools Needed: 0.8mm Read Head Spacer tool (included with the MicroXR Service Toolkit). Before You Begin: To enable stage movement while the chamber door open, you can either: Detach J3 on the Stage Interconnect Board.
Page 197 Chapter Five: Setup & Adjustment (VXR) 5.17: A IGURE DJUSTING NCODER EADS Read head is secured to mounting bracket using two socket cap screws. Loosen screws to adjust gap between read head and encoder strip using the 0.8mm spacer tool (top). Mounting bracket is secured to stage using two socket cap screws.
Page 198 MicroXR Service Manual 5.2.4.2: Stage Tuning Objective: Test stage motion and, if necessary, use the software utility Galil SDK.exe to tune servo motors for smooth, rapid, accurate and repeatable stage positioning. In addition to initial system setup, this procedure may need to be performed: If you have recently re-installed XPert Analysis As part of scheduled periodic maintenance or certification process.
Page 199 Chapter Five: Setup & Adjustment (VXR) Open the Galil Servo Design Kit application (C:\Galil\WSDK\WSDK32.exe). 5.19: G SDK - M IGURE ALIL INDOW From the Select Option menu, click Tuning Methods 5.20: G SDK - T IGURE ALIL UNING ETHODS INDOW In the main menu, click Terminal.
Page 200 MicroXR Service Manual 5.21: G SDK - C IGURE ALIL OMMAND ERMINAL INDOW Enter commands exactly as shown: BL-900000 BL,-900000 BL,,-900000 IT1, IT1,, Reposition the stage to roughly the middle position in the X, Y, and Z axes. In the Tuning Methods window: Select Manual from the Tuning Method drop list.
Page 201 Chapter Five: Setup & Adjustment (VXR) 5.22: G SDK - E IGURE ALIL XAMPLE AVEFORMS OLLOWING UNING ROCEDURE After optimum settings have been determined, record the final KD, KP, and KI values. Axis Repeat Steps 10 - 12 for the remaining axes. Open the initialization file WXPert.ini.
Page 202 If stage movement halts when the chamber door is opened, this function will need to be temporarily overridden. To accomplish this, exit XPert Analysis, launch MicroXR Utilities, and uncheck the “Stage is disabled when Door is open” option in the Chamber and Stage Settings window.
Page 203 Chapter Five: Setup & Adjustment (VXR) Note: Use extreme caution whenever operating the stage while the crash protection system is bypassed! Do not allow the stage table or sample object to crash into the collimator block! 5.23: S & S IGURE TAGE RAVEL...
Page 204 MicroXR Service Manual 5.2.4.3.2: Limits Test (Z Axis) Clear the stage table and roughly center the stage table beneath the collimator block. Bring the surface of the stage table into focus. Click the cursor over the onscreen X-Y- Z coordinates to toggle the display to “relative” mode (i.e., “zero out” the stage coordinates).
Page 205 Chapter Five: Setup & Adjustment (VXR) 5.25: T IGURE RAVEL IMIT ENSOR OCATIONS Description Description X-axis linear encoder rail Y-axis opto limit switch* X-axis linear encoder read head Y-axis home sensor* X-axis home sensor* X-axis limit sensor* Y-axis linear encoder read head Z-axis home sensor* Y-axis linear encoder rail Z-axis limit switch &...
Page 206 MicroXR Service Manual 5.2.4.5: Crash Protection Setup Objective: Optical sensors mounted within the chamber protect drop plate components from sample and stage crashes. If the beam between the sensor modules is interrupted, stage movement halts immediately. This procedure demonstrates how to: Test crash protection sensors to verify that they are not triggering too low or too high.
Page 207 Chapter Five: Setup & Adjustment (VXR) Part One - Test Crash Protection Sensitivity Place the sample object on the stage and bring the surface of the sample into rough focus. Fine focus on the sample using the focusing laser to raise the sample to focal height. Click on the coordinates in upper left corner of the video window to toggle display to relative distance mode (RX, RY, RZ).
Page 208 MicroXR Service Manual Test crash protection sensitivity by again laser focusing on the sample, then slowly and carefully raising the stage. If crash protection triggers within 25 mils (±5) past the focal height (see fig. 5.26), the sensitivity setting is acceptable.
Page 209 DJUSTMENT Old vs. New Sensor Mounting/Adjustment Hardware: On older MicroXR units, crash protection sensor modules were mounted to brackets. Adjusting the position of the sensors required loosening, repositioning, and retightening of the brackets, a relatively time-consuming and trial- and-error process.
Page 210 MicroXR Service Manual The Stage Travel Tests utility is accessed in XPert service mode by clicking the Chamber Tests toolbar button (left). The utility tests the effectiveness of the stage limit sensors and checks that stage movement is not inhibited. During the test cycle, the stage is automatically moved its full range in each selected axis.
Page 211 Chapter Five: Setup & Adjustment (VXR) 5.2.4.7: Stage X-Y Rotation (Parallelism) Test Objective: Verify that the stage remains consistently parallel relative to X and Y-axes as it is driven the full range in each axis. Tools Needed: Stage alignment plate fixture. (See below). Hex driver set (to remove stage table).
Page 212 MicroXR Service Manual 5.2.4.8: X-Y Stage Focus (Flatness) Test Objective: Verify that stage plate remains level relative to focal plane at all X-Y positions. Focus on the sample table using the focusing laser. With the laser on, drive the stage to all four corners of the chamber.
Page 213 Chapter Five: Setup & Adjustment (VXR) 5.2.4.9: Stage Repeatability Test Objective: Create an XYZ program to drive the stage to multiple locations and in various directions. Cycle the program at least 300 times. Analyze the resultant X, Y and Z positioning data in Excel to uncover intermittent or long-term stage repeatability problems.
Page 214 MicroXR Service Manual In the Data Export Field Settings window, use the Add/Remove buttons to select data export parameters, as shown below: 5.31: IGURE XPORT IELD ETTINGS INDOW Add the following parameters to the Current Export Fields list to export stage repeatablitly data to Excel:...
Page 215 Chapter Five: Setup & Adjustment (VXR) 5.32: E IGURE XPORTING TAGE ATA TO XCEL To generate the above chart in Excel (version 2000 and above) from Stage Repeatability Test data: In the Excel spreadsheet, click the Measurements tab. Click the Chart Wizard toolbar icon. In the Chart Type window, select a simple line graph.
Page 216 MicroXR Service Manual 5.2.4.10: Reference Standard Setup Objective: Program coordinates for automatic positioning of reference standard. To Set Reference Standard Coordinates: Enter XPert service mode and click the onscreen Z control. Click the Ref. Std. tab. Select the Automatic option. Click Go To to check the currently Stored Coordinate.
Page 217 Chapter Five: Setup & Adjustment (VXR) 5.2.5: Sample Loading Laser Adjustment Objective: A laser spotlight is used to assist in sample loading. When the chamber door is opened, the laser projects a beam onto the stage. (Note: To use this feature, automatic stage out operation must first be enabled;...
Page 218 MicroXR Service Manual 5.34: S IGURE AMPLE ASER POTLIGHT 5.35: C IGURE ALIBRATE AMPLE OAD AND EASURE OSITIONS 5-54...
Page 219 Chapter Five: Setup & Adjustment (VXR) 5.2.6: Detector Configuration and Amplifier Adjust (PGT SDD Detector) Overview: This procedure describes the software settings and hardware adjustments required to configure PGT SDD-type X-ray detectors. The complete procedure consists of the following sections: 5.2.6.2: Detector Hardware Communications Setup 5.2.6.3: Detector Amp/Bias Configuration 5.2.6.4: “Hard Adjust”...
Page 220 MicroXR Service Manual 5.2.6.2: Detector Hardware Communications Setup Objective: Configure software settings to establish communication between the detector and controller unit. From the taskbar Start menu, select Programs > Pgt > Hwssuper. At the top of the window, in the section labeled General Categories of Devices, make sure the Serial Port checkbox (fig.
Page 221 Chapter Five: Setup & Adjustment (VXR) 5.36: D IGURE ETECTOR ARDWARE OMMUNICATIONS ETUP 5-57...
Page 222 MicroXR Service Manual 5.2.6.3: Detector Amp Bias Configuration To Set Detector Amp Bias: From the taskbar Start menu, select Programs >Pgt >Excalibur. Towards the bottom left of screen in the Bias Voltage frame, make sure the Enable checkbox is NOT checked at this time.
Page 223 Chapter Five: Setup & Adjustment (VXR) Click the Load button. Select the file XPertStartUp.ANH from the C:\Program Files\XPert Analysis\Config directory and click the Open button. (Note: Click the OK button if a warning about the bias voltage setting appears) Open initialization file WXPert.ini (C:\Windows\WXPert.ini). Verify that “XpertStartUp.ANH”...
Page 224 MicroXR Service Manual Click Save then Close. Access the Amplifier Bias, ADC, Special Presets and Common Controls through the eXcalibur dialog boxes (see Step 1). Configure settings as shown in the following table, then proceed to the next step. Within the Bias Voltage group, enter the value 180 into the Set Point field.
Page 225 Chapter Five: Setup & Adjustment (VXR) 5.38: D IGURE ETECTOR ONFIGURATION ARAMETERS ABLE SDD Detector Amp Bias Configuration Parameters Amp/Bias Configuration Parameter Setting Preamplifier Type Other Preamplifier Mode Differential Amp Selection Internal Amp Input Polarity Negative Shaping Type Triangular 0.5 µs Shaping Time ADC Gate Mode Dead Time Mode...
Page 226 MicroXR Service Manual 5.2.6.4: “Hard Adjust” Procedure Objective: Following detector installation, a “hard” system adjust must be performed in XPert Analysis Counts Mode to achieve final calibration of detector and amplifier software settings. Tools Needed: Infinite Ag reference standard. To Perform the Hard Adjust Lauch XPert Analysis and enter Counts Mode.
Page 227 In the Fine Beam Align column, uncheck Use Offsets. Click Apply to save changes. Note: When making any changes to the Fine Beam Align column, XPert Analysis software will prompt user to enter a password. Contact the Thermo Electron Customer Service Department if you do not know your service password. 5-63...
Page 228 Note: To view and/or alter system default settings in DPPCal, you will need to enter the service password. If you do not know your service password, contact the Thermo Electron service department. Select the Service Calibration and Detector Calibration Tabs and enter the settings as shown below.
Page 229 Chapter Five: Setup & Adjustment (VXR) Detector Calibration Window Calibration Level Set to Course, then fine Parameter Selection Set Standard Element to Cu Select All TC/CG Click on Set TC & CG to save selected parameters Tip: Make sure the Cu peak (channel 800) is higher then the Cr peak (channel 550) if not, rotate the sample 90 degrees until the Cr peak is about half the size of the Cu peak.
Page 230 MicroXR Service Manual Check the Soft Gain and Soft Offset parameters after the adjust cycle is completed. The values shown must fall within the specifications below Soft Gain: 1.0 ( 0.2) ± Soft Offset: 0.0 ( 6.0) ± 5-66...
Page 231 Chapter Five: Setup & Adjustment (VXR) 5.2.8: Tube Target Identification Objective: Verify the type of target material (Mo or W) used by installed x-ray tube. Tools Needed: Infinite Sn standard. To Check Tube Target Material: In Counts Mode, set up the system as follows: Select an intensity level that produces approx.
Page 232 MicroXR Service Manual 5.39: IGURE Example Sn Spectra, Mo Tube Target 5-68...
Page 233 Chapter Five: Setup & Adjustment (VXR) 5.2.9: Shutter & Filter Test Utility The Shutter and Filter Test utility lets you exercise the shutter mechanism and detector filter stepper motor and test for repeatability problems. (Note: The Collimator test is enabled on mechanically collimated ZXR, LXR, GXR and GXRS systems only.) If the test does not detect a full range of movement for each component selected, an error condition is recorded.
Page 234 MicroXR Service Manual 5.2.10: Beam Alignment Overview: The focusing element must be precisely aligned with the X-ray beam path and accurately targeted at the sample. The beam alignment procedure consists of three main tasks: Section 5.2.9.1 (Maximize Countrates): Manual adjustment (using alignment jig) of the focusing element relative to primary X-ray beam to achieve maximum X-ray countrates.
Page 235 Chapter Five: Setup & Adjustment (VXR) Warning! Be extremely careful when operating the stage with crash protection disabled! A stage crash may result in catastrophic damage to critical system components such as capillary optic. 2. Relocate Focusing Laser Assembly: The focusing laser assembly must be loosened and turned in the opposite direction in order to create room for the X-axis alignment jig.
Page 236 MicroXR Service Manual 5.42: C IGURE APILLARY PTIC LIGNMENT Rotation bracket; mount to bottom of cap optics housing. Attach to X-axis jig at [A]. (See below.) Y-Adjust bracket; mount to front of shutter block. Adjustment knob; rotate to align cap optic in Y-axis.
Page 237 Chapter Five: Setup & Adjustment (VXR) 5.43: I IGURE NSTALLED ALIGNMENT JIG RONT 8/32 x 3/4” socket cap screws X-Adjust Knob Y-Adjust Knob Shoulder screw (702-54-027) 5.44: I IGURE NSTALLED ALIGNMENT JIG OTTOM 6/32 x 1/2” Shoulder screws socket cap screw (702-54-026) Shoulder screw (702-54-027)
Page 238 MicroXR Service Manual To Mount the Alignment Jig: Lower the stage, if necessary, to provide maneuvering room for jig installation. Remove the two socket cap screws securing the relay mirror block to the capillary optic housing. Mount the X-axis jig to the drop down plate using four 2/56 x 1/2” socket cap screws, as shown in Figure 4.
Page 239 Chapter Five: Setup & Adjustment (VXR) Connect the rotation bracket to the capillary optic base using two 8/32” socket cap screws. (See fig. 5.47.) 5.47: C IGURE ONNECT ROTATION BARCKET TO CAP OPTIC BASE To Align the Capillary Optic and X-Ray Beam: Tip: Alignment of the focusing element and shutter can be a somewhat time-consuming trial-and-error process, so prepare to be patient!
Page 240 MicroXR Service Manual Note: Be extremely careful when moving the stage during the following step! Place the infinite Fe reference standard on the stage. Slowly and carefully raise the stage until the surface of the reference standard is in rough focus.
Page 241 Chapter Five: Setup & Adjustment (VXR) 5.2.10.2: Coarse Beam Alignment Tools Needed: Reference standard (installed on stage). A beam alignment wafer standard. (P/N 21031; see figure 5.49.) Tape (to secure alignment standard to the stage). To Perform the Coarse Beam Alignment: Launch Chamber Diagnostics.
Page 242 MicroXR Service Manual Compare the measured ratio from Step 7 to the target ratio from Step 5. The ratios should be roughly equal. If they are not, left click in the upper left corner of the sample view screen to zero out the stage coordinates, then: Incrementally step the stage by 1/4 mil to the right or left of the Y crosshair (i.e.,...
Page 243 Note: When changing either the X or Y offset values, XPert Analysis software will prompt user to enter a password. Contact the Thermo Electron Customer Service Department if you do not know your service password. Re-measure the Cu ⎢Sn border. Calculate the Cu to Sn CPS ratio. If the result does not match the target ratio from Step 5, repeat Steps 1 - 11.
Page 244 MicroXR Service Manual 5.2.10.3: Fine Beam Alignment (Adjust Stage X-Y Offsets) Following coarse X-Y alignment, the reticle origin and X-ray beam will be very closely aligned (generally ±1 mil, or 25 steps). At this point, a 4-mil collimator hole alignment standard (see fig.
Page 245 Chapter Five: Setup & Adjustment (VXR) 5.2.11: Focusing Laser Alignment Objective: Set correct deflection and spot size for laser focusing beam. Adjust Laser Autofocus Factor to calibrate laser for accurate laser-assisted focusing. Tools Needed: Hex/allen key set. Laser spot adjust tool. 5.2.11.1: Aim Focusing Laser Turn on the laser and visually fine focus on some detail on a sample or the stage table.
Page 246 MicroXR Service Manual 5.2.11.2: Adjust Focusing Laser Spot Size Adjust the size of the laser spot by rotating the lens at the end of the laser tube using the laser spot adjust tool. Laser spot should be small as possible.
Page 247: Performance Tests
Chapter Five: Setup & Adjustment (VXR) 5.3: Performance Tests This section provides instructions for each of the major tests used to gauge MicroXR measurement performance. These procedures are also used in general diagnostics, troubleshooting, and maintenance. Section Procedure Description 5.3.1 DAQU Test Verify that system electrical parameters are performing to specification.
Page 248 5.53: DAQU S IGURE CREEN VXR) NOTE ACUUM PARAMETER NOT SHONW IN FIGURE BELOW ETECTOR ONITOR ARAMETER NOT USED ON DAQU Target Specifications for MicroXR VXR-series Chambers Parameter Standard Deviation Range HV Program <0.002 47kV ±0.5kV HV Monitor <0.002 47kV ±0.5kV Tube Program <0.0005...
Page 249 Chapter Five: Setup & Adjustment (VXR) 5.3.2: Countrate Tests Objective: Measure infinite reference standards. Compare countrates to specification for unit. If readings are out of spec, refer to Chapter 7, Troubleshooting to isolate source of problem. Setup/Tools Needed: Infinite silver (Ag), iron (Fe), gold (Au), aluminum (Al) standards. To Perform the Countrate Test: Enter Counts Mode and set up the following parameters: Meas.
Page 250 MicroXR Service Manual 5.54: C IGURE OUNTRATE PECIFICATIONS PGT SDD Detectors Standard Mo Target Tube Cr Target Tube Countrate (kCPS) Au- M ROI: 28 - 38 3.0 - 3.5 19 - 22 Spec: ROI: 276 - 293 Au- Lβ Spec: 4.1 - 5.2...
Page 251 Chapter Five: Setup & Adjustment (VXR) 5-87...
Page 252 MicroXR Service Manual 5.3.3: Detector Resolution Test Objective: Resolution refers to a detector's ability to: Produce the same signal for two X-ray photons with the same energy. Distinguish between X-ray photons with different characteristic energies. Tools Needed: Infinite iron (∞Fe) standard.
Page 253 Chapter Five: Setup & Adjustment (VXR) To Test Detector Resolution: Enter Counts Mode and set the following parameters: Meas. Time: 30 seconds ROI: Use Fe ROI (141-155) Focus on the ∞Fe standard. Click Start. Observe the resultant CPS reading. Alter the tube current setting and remeasure until your measurement produces a CPS reading of as close to 2,000 CPS as possible.
Page 254 MicroXR Service Manual Note: The InSpectra software will automatically calculate FWHM. If available use InSpectra, otherwise follow the procedure as described in this procedure. Note the Low and High channel values indicated in row 6 of the dialog box. Click on one of the ROI buttons in the toolbar. In the Set [color] ROI dialog box, enter the Low and High values you noted in Step 6 into the corresponding Lower and Upper Limit fields.
Page 255 Chapter Five: Setup & Adjustment (VXR) 5.3.4: Pulse Pile-Up Test Objective: The following procedure verifies that pulse pile-up rejection electronics are performing to specification. Pulse Pile-Up occurs when two x-ray photons enter the detector at nearly coincidental times. The system interprets the resultant pulse as originating from an x-ray with much higher energy than either of the two incident photons.
Page 256 MicroXR Service Manual 5.3.5: Dead Time Test Overview: Dead Time refers to the amount of time required to by the system to detect an incoming X-ray photon, process the signal into an analog pulse, and convert the pulse into a corresponding digital value that can be sorted into a channel number and counted.
Page 257 Chapter Five: Setup & Adjustment (VXR) 5.3.6: Peak Shift Test Objective: Peak Shift refers to a condition in which X-rays collected during measurement do not accumulate within the ROI established during calibration. As a result, the system does not obtain an accurate X-ray count, and measurement accuracy is degraded. Peak shift is generally attributable to changes in the performance of the X-ray detection electronics.
Page 258 MicroXR Service Manual 5.3.7: Long Term Tests Overview: Conditions not readily apparent during short-term testing often manifest themselves more clearly when tracked over a longer period. The Long Term Diagnostics (LTD) utility cycles measurements on the installed reference standard while monitoring the same chamber parameters as DAQU mode. (See section 5.3.1.) LTD results can be saved in data files and output in various formats for further...
Page 259 Chapter Five: Setup & Adjustment (VXR) 5.56: L & T IGURE IAGNOSTICS ETUP INDOWS : DET S VXR) ENS PARAMETER NOT INDICATED ON Long Term Diagnostics Tests & Specifications Test # Description "Pass" Specification (as indicated in Summary) Countrate Stability Test Part [A]: >...
Page 260 MicroXR Service Manual 5.3.8: Vacuum Test Overview: The VXR uses a vacuum conduit section to evacuate the X-ray beam generation/detection column, thereby extending the detectable elemental range of the system. The following procedure verifies that over time the vacuum level does not degrade.
Page 261: Applications Tests
5.4: Applications Tests 5.4.0: Overview The following procedures are used to evaluate MicroXR measurement performance and system stability. Results must fall within the given specification(s) to pass each test. If unsatisfactory results are obtained, refer to Chapter 7, Troubleshooting to diagnose and remedy the source of the problem.
Page 262 MicroXR Service Manual 5.4.1: Au/Ni/Cu 5-Day Drift Test Objective: Test for measurement drift by performing repeated measurements on an Au/Ni/Cu calibration standard over a five-day period. Tools Needed: A stock Au/Ni/Cu calibration standard set with the following thicknesses (±25µi): Au: 75µi (± 5µi) 325µI (±...
Page 263 Chapter Five: Setup & Adjustment (VXR) 5.58: A IGURE RIFT 1: A ABLE RIFT AILY DJUSTS Thickness (µm) Mean % Error Combined Mean Calculations Specification Combined Mean Layer: Day (1+2+3+4+5)/5 % Error % Error: <5% <10% (Daily Mean/Combined Mean) * 100 2: A ABLE RIFT...
Page 264 MicroXR Service Manual 5.4.2: Au/Ni/Cu Accuracy Test Objective: This test is used to determine how closely measured thickness values conform to the actual standard thickness (accuracy). Tools Needed: A stock Au/Ni/Cu calibration standard set. To Perform the Au/Ni/Cu Accuracy Test: Perform an Au/Ni/Cu calibration using Dual Layer A with Scan Mode (40 x 40 area).
Page 265 Chapter Five: Setup & Adjustment (VXR) 5.59: A IGURE CCURACY Thickness Percent Error Mean Std. Dev. Labeled (see [2]) Calculations Specification [1] Absolute Error: Layer: Thickness (Labeled) - Thickness (Measured) [2] % Error: % Error: ±5% ±10% (Absolute Error / Thickness (Labeled)) * 100 5-101...
Page 266 MicroXR Service Manual 5.4.3: Au/Ni/Cu Measurement Time Variation Test Objective: This test is used to determine standard variation for given times. A larger than expected range (Mean or Std. Dev.) may indicate the system’s inability to perform within specification at different measurement times.
Page 267 Chapter Five: Setup & Adjustment (VXR) 5.60: A IGURE EASUREMENT ARIATION Thickness (µm) Mean Std. Deviation % RSD Est. RSD Test 5 sec 15 sec 60 sec Mean High Mean Low Combined Mean Range of Mean Calculations Specification Combined Mean Layer: ⎯...
Page 268: Chapter 6: Software
Chapter 7, Troubleshooting provides a table listing XPert-generated “Error” conditions and suggested remedial actions. The MicroXR Software Reference (Vol. 2 of this manual, located on the CD-ROM supplemental disc) contains XPert Analysis revision histories and release notes; installation/configuration details for major and incremental release versions; known software bugs and fixes;...
Page 269 MicroXR Service Manual 6.3: DAQU Mode 6-12 6.3.1: Overview 6.3.2: The DAQU Window 6.4: Long Term Diagnostics 6-15 6.4.1: Overview 6.4.2: Running the Long Term Diagnostics Test 6.4.3: Viewing & Printing LTD Data 6.4.4: LTD Report Formats 6.4.5: Analyzing LTD Report Data 6.5: XPert Utilities...
Page 270 Mode interface is shown in figure 6.1. 6.1.1: Service Mode Password A Service Mode password is configured in the factory prior to shipping. If you do not know your service password, you should contact the Thermo Electron Customer Support for instructions. 6.1.2: Starting Service Mode In XPert Analysis, open the XPert Log In screen by clicking the Log In toolbar icon or clicking the "X"...
Page 271 MicroXR Service Manual 6.1.3: Service Mode GUI The main Service Mode interface is shown in Figure 6.1. Figure 6.2 provides a brief explanation of service mode toolbar functions. 6.1: XP IGURE NALYSIS ERVICE NTERFACE...
Page 272 Switch back to XPert Analysis measurement mode. Calibrate Multi-Planar Optics (MPO): Set multiple focal depths for Chapter 5, System Setup, Section 5.2.11. MPO enabled systems. [ZXR, LXR only] See MicroXR User Scan Mode: Enable Scan Mode measurements. Manual for additional information. System Debug Info: Collect information Section 6.6...
Page 273: Counts Mode
A brief summary of Counts Mode functions and MicroXR system parameters that can be manipulated in Counts Mode is provided in sections 6.2.3 -6.2.7.
Page 274 Click buttons to select elements and associated ROI from the Periodic Chart. OK: Save settings and return to Counts Mode. Default: Apply MicroXR default limits and return to Counts Mode. 6.2.2.2: DAC Set Opens the System Settings window. (See section 6.2.7 for descriptions of settings.) 6.4: S...
Page 275 MicroXR Service Manual 6.2.2.3: Clear Clears countrate data and accumulated statistics from the Counts Mode window. The upper left corner of the data table indicates the number of accumulated measurements taken since the statistics were last cleared or reset. 6.2.2.4: PHA Displays spectrum from most recent counts mode measurement.
Page 276 Chapter Six: Software 6.2.4: The Stats Tab Displays statistics derived from current group of measurements. The number of measurements in the group is indicated in top left corner of the grid. Click Clear to remove accumulated measurement statistics. The Stats tab displays the following data: Std Dev: Displays the Standard Deviation from the mean for accumulated countrate measurements within the specified ROI.
Page 277 MicroXR Service Manual 6.2.6: System Parameter Settings Two columns of system parameters are displayed on the lower portion of the Counts Mode window. The left column displays electrical settings; the right column displays measurement and chamber parameters. You can change settings for these parameters by clicking directly on individual cells.
Page 278 Chapter Six: Software 6.2.6.2: Measurement/Chamber Settings Parameter Description Beams Indicates the diameter of the X-ray beam used for Counts Mode measurements. Click the (Mechanically Beams label to select a new beam size. When Counts Mode is exited, the system reverts Collimated to the beam size specified in the active cal file.
Page 279: Daqu Mode
6.3.1: Overview The Data Acquisition/Electrical Settings Diagnostics (DAQU) utility is a primary MicroXR diagnostics tool. In DAQU mode, the analyzer continuously samples data from chamber sensors monitoring critical electrical and ambient conditions. These data are compared to target performance specifications stored by the system software.
Page 280 Chapter Six: Software 6.5: D (DAQU) W IGURE CQUISITION INDOW DAQU C & S ONTROLS ETTINGS Start: Initiate data acquisition; number of data sampling cycles is indicated in upper left corner of grid. Stop: Halt data acquisition (Note: clicking Stop does not clear accumulated statistics). Clear: Remove accumulated statistics from DAQU window.
Page 281 MicroXR Service Manual Figure 6.6: DAQU Parameters and Specifications Parameter Description Std. Deviation Range Indicates the actual high voltage level (in kilovolts) HV Program <0.002 47kV ±0.5kV being set for the HV power supply. Indicates the actual voltage being fed to the X-ray HV Monitor <0.002...
Page 282: Long Term Diagnostics
The statistical models generated from LTD data are extremely helpful in identifying the nature and source of MicroXR performance problems. (Note: Long Term Diagnostics may also be accessed from XPert Analysis measurement mode if it has been added to the toolbar.) 6.4.2: Running the Long Term Diagnostics Test...
Page 283 MicroXR Service Manual 6.7: L IGURE IAGNOSTICS ETUP F ile Name: Automatically assigned if none entered. User ID: Enter optional user identifier. Warmup Time: Select 2 hours, 1 hour, 30 minutes, or No Warmup (default 2 hour warm up recommended).
Page 284 Chapter Six: Software 6.4.3: Viewing and Printing LTD Data Selecting the Report option opens the XRFLTD32 program (figure 6.9.c), a utility that enables you to store, view, and print reports from LTD data. XRFLTD32 may also be run as a stand-alone application by choosing Start > Programs > XPert Analysis > Long Term Diagnostics and Setup.
Page 285 MicroXR Service Manual 6-18...
Page 286 Chapter Six: Software 6.4.4: LTD Report Formats 6.4.4.1: Summary The Summary report displays Pass/Fail results for the following tests: Countrate Stability, Countrate Drift, Peak Stability, Peak Drift, Electrical Data and Tube Temperature. Detailed test descriptions are provided in section 6.4.5, Analyzing Long Term Report Data.
Page 287 MicroXR Service Manual 6.4.5: Analyzing LTD Report Data The Long Term Diagnostics (LTD) test evaluates 6 key indicators of instrument "health". Pass/Fail criteria for each LTD test are given in figure 6.11. 6.6.5.1: Countrate Stability [LTD Test #1] Countrates are recorded in the full ROI (channels 1 - 1022) over a 12-hour period. The means and standard deviations are then calculated for all counts obtained within each hourly interval.
Page 288 5.6.5.6: Tube Temperature [Test #6] Monitors X-ray tube enclosure temperature. Temperature should not exceed 55 degrees centigrade. Figure 6.11: MicroXR Long Term Diagnostics Tests & Specifications Test # Description "Pass" Specification (as indicated in Summary printout) Countrate Stability Test Part A: >...
Page 289: Xpert Utilities
MicroXR Service Manual 6.5: XPert Utilities 6.5.1: Overview The XPert Utilities application provides tools for MicroXR hardware and software configuration. You can also back up and restoring critical data and system files, as well as compress stored files to improve computer performance.
Page 290 When XPert Utilities is launched following an XPert Analysis installation, a dialog box (fig. 6.12) prompts you to select a base MicroXR model type. Check the appropriate setting for your unit and click Reconfigure to update settings, or Use Existing Configuration to load previously stored settings.
Page 291 MicroXR Service Manual 6.5.2: Chamber and Stage Settings Utility The Chamber and Stage Settings utility is used to match your system software to the hardware installed in your X-ray chamber. These parameters are initially configured in the factory. They will generally need to be reconfigured if you have had to reinstall XPert Analysis on your system computer, or additional hardware options have been installed in your chamber.
Page 292 Chapter Six: Software 6.5.3: Backup/Restore System Files Utility It is a good practice to periodically create backup copies of your XPert Analysis data files. The Back Up Files utility provides a convenient way accomplish this routine maintenance task. To Create Backup Files: Click the Backup/Restore button (right).
Page 293 MicroXR Service Manual 6.5.4: Compact Utility Periodically compacting accumulated measurement data and program database files conserves hard disk space and helps XPert Analysis to run more efficiently. To Compact Database Files: Click the Compact button (right). Check option boxes to compress measurement and/or program database files.
Page 294 Chapter Six: Software 6.5.5: Beam Install Utility The Beam Install utility lets you configure software settings to match the beam sizes installed on your system. In the Common Beam Packages window (fig. 6.16), you can choose from stock collimator packages or specify custom sizes and block arrangements.
Page 295 MicroXR Service Manual 6.5.6: Serial Communications Setup Utility The Serial Communications Setup utility lets you configure data transfer settings for the system computer’s two default serial I/O ports (Comm 1 & 2). Default settings shown in figure 6.18, below; refer to third-party documentation or consult the Customer Service Department for additional setup details for bar code readers or other peripheral devices.
Page 296 Advanced FP (FPII) parameters using the FP Wizard (fig 6.18b). (Note: For detailed information on Advanced FP configuration, refer to Volume 2, MicroXR Software Reference, located on the CD-ROM supplement to this manual, or contact Customer Service for up-to-date information and instructions.)
Page 297: System Debug Information Utility
MicroXR Service Manual 6.6: System Debug Information Utility Section Procedure Description 6.6.2 Data Collection Settings Collect DAC Values and save raw spectrum data for evaluation. Display detailed view of parameters used in the creation of Advanced 6.6.3 Advanced FP Options FP applications.
Page 298 Chapter Six: Software 6.6.1.1: System Debug Information Window Click the toolbar button at left to launch the System Debug Information utilities. 6.19: S IGURE YSTEM EBUG NFORMATION INDOW 6-31...
Page 299 MicroXR Service Manual 6.6.2: Data Collection Settings The Data Collection Settings options are to collect run-time application data while a measurement is performed. These functions can be very useful in helping to debug measurement problems. Collect DAC Values controls the collection of hardware information, including the high voltage, tube current levels and chamber temperature values.
Page 300 Chapter Six: Software 6.6.2.2: Save Spectra Files After Measurement When this option is enabled, a copy of the “raw” (uncorrected) spectra and a copy of the “fixed” (adjusted) spectra are indexed and written to disk. The “real” spectrum is a copy of the fixed spectra as seen by the empirical calibration and measurement procedures.
Page 301 Spectrum Calibration settings will be wrong as well. Check the Optic setting and Spectrum Model as well. The typical tube type for all MicroXR models should be set to Fitted # 1. If these settings are not correct, all Advanced FP calibrations will give exceptionally poor results. If there are any problems, run MicroXR Setup Utilities and select the Advanced FP button and run FP Wizard to install parameters for the proper instrument type.
Page 302 XPert Analysis are currently running, as well as other currently running processes on the system computer. It then generates a text-file report that can be e-mailed to Thermo Electron for analysis and troubleshooting/debugging. XPert Spy is an extremely useful tool for resolving installation and compatibility issues that often result in page faults and general system failure errors in Windows.
Page 303 Clicking the Package Debug Data button collects all log files and moves them to a separate directory, after which they may be zipped and forwareded to Thermo Electron for analysis and debugging assistance. The packaging procedure runs XPert Spy to generate an up-to-date report of currently installed and running software modules.
Page 304 Chapter Six: Software XPert Revisions 4.0.0 to 4.0.4: C:\NORAN\DEBUG_ON_MMDDYY [First log file stored, using old naming convention] C:\NORAN\DEBUG_2, 3, 4,…_ON_MMDDYY [Subsequent log files, using old naming convention] XPert Revision 4.0.5 and later: C:\XRFDATA\THERMO\DEBUG_ON_MMDDYY [First log file stored, using updated naming convention] C:\XRFDATA\THERMO \DEBUG_2, 3, 4,…_ON_MMDDYY [Subsequent log files, using updated naming convention] 6.6.7: Show DAC Data...
Page 305: Capturing And Reporting Xpert Software Errors
Note: Refer to Chapter 7, Troubleshooting for a compilation of standard MicroXR operating errors and system warnings. The handler message for “unexpected” software-related errors displays a title bar (“XPert Analysis”) and five lines of text.
Page 306 This will capture the screen image to a buffer that can be pasted into a Word or E-mail document. Open a Word or email document, then hold down the <CRTL> key and press <V> to paste the image into the document. E-mail the information to Thermo Electron for evaluation.
Page 307 MicroXR Service Manual Depending on the error, there may not be an easy resolution or work around. Some problems require code changes after identifying the actual cause of the problem. A new release of software is required, which is why it is so important to send those error messages back to Thermo Electron.
Page 308: Chapter 7: Troubleshooting
Troubleshooting Overview This chapter provides troubleshooting tips, flowcharts and tables to aid in diagnosing and correcting MicroXR performance problems. Section 7.1 provides a brief compilation of commonly encountered operator, setup and maintenance-related problems. When troubleshooting an inoperative or poorly performing system, taking the time to double-check these (generally) easily remedied conditions can save you hours of “chasing ghosts.”...
Page 309: Preliminary Checklist
MicroXR Service Manual Chapter Topics 7.1: Preliminary Checklist 7.1.1: Ruling Out Common Errors 7.2: Troubleshooting Techniques 7.2.1: Introduction 7.2.2: General Troubleshooting Tips 7.2.3: Specific Troubleshooting Techniques 7.2.4: Likely Failures in Proven Systems 7.3: Diagnostic Flowcharts 7-17 7.2.1: Using the Flowcharts 7.2.2: Table of Flowcharts...
Page 310 Chapter Seven: Troubleshooting 7.1: Troubleshooting - Preliminary Checklist 7.1.1: Ruling Out Common Errors If a MicroXR unit is producing erratic or inaccurate measurement results, operations and maintenance-related factors should be ruled out before troubleshooting specific sub-systems and components. Listed below are some of the most common and readily remedied causes of poor system...
Page 311: Troubleshooting Techniques
Cause-effect relationships are often complex, even for seemingly simple systems. MicroXR field engineers must be able to evaluate and remedy the cause or causes of a problem by observing the behavior of the system and asking the right questions.
Page 312 Chapter Seven: Troubleshooting 7.2.2: General Troubleshooting Tips When first approaching a failed or otherwise misbehaving system, the novice MicroXR service engineer often doesn't know where to begin. The following strategies are not exhaustive by any means, but they provide the service engineer with a set of starting points for the troubleshooting process.
Page 313 Example 1: The Ag/Cu (silver over copper) application works fine, but not Ni/Cu (nickel over copper). What to do: Eliminate from the list of possible causes, anything in the MicroXR system necessary for the Ag/Cu calibration to function. Whatever the source of the problem is, it is specific to the Ni/Cu calibration and not to Ag/Cu.
Page 314 What to do: Consider possible causes for the x-ray tube to overheat, based on what you know of the MicroXR system operation. Either the x-ray tube is generating too much heat, or not getting rid of the heat well enough (most likely the latter). Brainstorm some possible causes: a damaged fan, clogged fan filter, wrong airflow, airflow blocked, excessive facility temperature, etc.
Page 315 MicroXR Service Manual 7.2.3: Specific Troubleshooting Techniques After applying some of the general troubleshooting tips to narrow the scope of a problem, there are techniques useful in further isolating it’s location. Here are a few: 7.2.3.1: Swap Identical Components In a system with identical or parallel subsystems, swap components between those subsystems and see whether or not the problem moves with the swapped component.
Page 316 Chapter Seven: Troubleshooting Example 1: You're working on a MicroXR system with servo X, Y, and Z-axis drives. The Y-axis is not working, but the X and Z-axes are working. All three axes share identical components (feedback encoders, servo motor drives (servo controller card), servo motors).
Page 317 7.2.3.3: Trap a Signal Set up the MicroXR to monitor a signal over a period of time (such as saving spectra files, collecting DAC values, running an overnight long-term test, running a DAQU test) is especially helpful when tracking down intermittent problems, which have a way of showing up the moment you've turned your back and walked away.
Page 318 After many recalibration and system adjusts, the customer has reported that the MicroXR system is continuing to measure inaccurately. What to do: MicroXR systems are equipped with diagnostics (DAQU) that will monitor critical system functions. When this feature is enabled, XPert Analysis software will monitor all electrical and temperature related values (47kV, 1.85kV, tube current and...
Page 319 Semiconductor devices are notoriously prone to failure due to electrical transient (voltage/current surge) overloading and thermal (heat) overloading. The following are the most likely active components to fail in the MicroXR system: X-ray Tube Assembly: X-ray tubes are mounted inside a thick walled brass tube enclosure, which is filled with high dielectric oil, then sealed.
Page 320 Chapter Seven: Troubleshooting fan filter(s) cleaned and running the x-ray tube at a lower tube current, if possible, can do this. SCB (Z/LXR): Power transient and HV arcing problems cause the pic micro controller (U7) to fail. Always use a UPS (uninterruptible power supply) or constant voltage power supply (a power supply that regulates its output voltage within specified limits, against changes in line, load, ambient temperature and time) Preamp (proportional counter systems): Susceptible to damage from over...
Page 321 This may change the voltage(s) present between other conductors in the circuit and ground, thereby causing bizarre system malfunctions and/or personnel hazard. The following components are the most susceptible to wiring failures in MicroXR system: 7-14...
Page 322 The following are the most likely power supply failures in the MicroXR system: PS4000 (Z/LXR) PS6000 (G, M, V-series) 47kV power supply (all) 7.2.4.5: Passive Components...
Page 323 (arc-over) or physical damage (vibration or impact). Resistors may also change resistance value if overheated! The following are the most likely passive component failures in the MicroXR system: X-ray Detectors: Failed detectors generally manifest poor resolution (spectral separation), poor peak stability or no counts (more specific to solid state detectors).
Page 324: Diagnostic Flowcharts
Start troubleshooting at the appropriate Flow Chart #2 for your unit to trace an X-ray generation problem. 7.2.3: Table of Flowcharts MicroXR Diagnostic Flow Charts Flowchart #1: No, Low or Erroneous Counts: X-Ray Generation or X-Ray Detection Problem? ZXR, LXR...
Page 325 MicroXR Service Manual Flow Chart 1 No Counts or Z/LXR Very Low Counts X-Ray Is this an X-Ray Generation Goto Flow Chart Run DAQU. Did generation or detection Problem # 2 (Generation) it pass? problem ? Check X-Ray Detection collim ator...
Page 326 Chapter Seven: Troubleshooting Flow Chart 1 No Counts or GXR, GXRC & M XRP Very Low Counts X-Ray Is this an X-Ray Generation G oto Flow Chart Run DAQ U. Did generation or detection Problem # 2 (Generation) it pass? problem ? Check X-Ray Detection...
Page 327 MicroXR Service Manual Flow Chart1 No Counts or GXRS & MXR Very Low Counts X-Ray Is this an X-Ray Generation Goto Flow Chart Run DAQU. Did generation or detection Problem # 2 (Generation) it pass? problem ? Check X-Ray Detection...
Page 328 Chapter Seven: Troubleshooting Flow Chart1 VXR w ith SDD No Counts or Very Low Detector Counts X-Ray Is this an X-Ray Generation Goto Flow Chart Run DAQU. Did generation or detection Problem # 2 (Generation) it pass? problem ? Check X-Ray Detection collim ator Is the shutter...
Page 329 MicroXR Service Manual Flow Chart1 VXR w ith JT Cooled No Counts or Very Low Detector Counts X-Ray Is this an X-Ray Generation Goto Flow Chart Run DAQU. Did generation or detection Problem # 2 (Generation) it pass? problem ?
Page 330 Chapter Seven: Troubleshooting Flow Chart 2 X-Ray Generation Z/LXR Problem Follow this path if the Follow this path if Follow this path if tube current program tube current program is >0.999 mA and the HV<47kV. Set and monitor current = there is no m onitor HV to Maxim um .
Page 331 MicroXR Service Manual Flow Chart 2 X-Ray Generation Problem Follow this path if the Follow this path if Follow this path if tube current program tube current program is >0.999 m A and the HV<47kV. Set and m onitor current = there is no m onitor HV to Maxim um .
Page 332: Troubleshooting Tables
A representative, but by no means comprehensive, list of XPert Analysis “Error” messages is supplied in Table J. For additional information on XPert and Windows error handling and software troubleshooting, refer to Chapter 6, Software and Volume 2, MicroXR Software Reference (located on the supplemental CD-ROM provided with this manual).
Page 333 MicroXR Service Manual 7-26...
Page 334 Chapter Seven: Troubleshooting Table A No Power to Chamber Condition Possible Cause(s)/Symptoms Suggested Action Reference Facility AC power problem, faulty AC Check facilities AC power. Cannot power receptacle. power up Verify proper line AC voltage at chamber. receptacle. AC line power disconnected. Check all cabling, connections, &...
Page 335 MicroXR Service Manual Condition Possible Cause(s)/Symptoms Suggested Action Reference Check connections, test ribbon §9.3 cabling between: IPPB, SSCB, §8.9 PS6000, AT Link & ICB. Verify all boards are firmly seated into ICB buses; check for damaged contacts on board(s) and slots.
Page 336 Chapter Seven: Troubleshooting Table B Power On - Chamber Not Responding Condition Possible Cause(s)/Symptoms Suggested Action Reference Chamber door(s) open; X-ray safety Close chamber door(s) and or Power is §5.1 interlock tripped. service access panel(s). supplied to computer and All doors, panels are verified closed; Check for proper door latching §5.1 chamber, but...
Page 337 MicroXR Service Manual 7-30...
Page 338 Chapter Seven: Troubleshooting Table C Poor Repeatability, Inaccurate Measurements Condition Suggested Action Reference Poor Rule out common operations & maintenance-related issues. §7.1-3 repeatability, inaccurate Determine whether a No Counts or Low Counts condition exists. Go to row [C2] measurements to row C2) No Counts [2a] §6.2...
Page 339 MicroXR Service Manual [3b] Detector Resolution Test: **Refer to §5.3.2 for In Counts Mode, set up an Fe ROI (channels 135-157) and 30 second specifications measurement time. for your unit) Perform measurements, adjusting intensity after each measurement until a countrate of 10,000 CPS is attained. At 10kCPS, check FWHM...
Page 340 Chapter Seven: Troubleshooting X-Ray Detection System Troubleshooting Table D1 (Prop. Counter Systems – ZXR, LXR, GXR, GXRC, MXRP) Condition Possible Cause(s)/Symptoms Suggested Action Reference Bad/intermittent connection. Inspect all cabling and connections No Counts between preamp box, 1.85kV power (0.0 kCPS) supply, amplifier, and SCB [Z/L], IPPB [G, M] (see below).
Page 341 MicroXR Service Manual Condition Possible Cause(s)/Symptoms Suggested Action Reference Detector filter problem. Filter carriage improperly §5.2.6 (Z/L) positioned; filter carriage is §5.2.5 (G, M) obstructing detector window. §5.3.9 (All) Filter "home" position needs to be calibrated. Filter(s) are installed in wrong position(s).
Page 342 Chapter Seven: Troubleshooting X-Ray Detection System Troubleshooting Table D2 PIN Diode Detector Systems (GXRS, MXR) Condition Possible Cause(s)/Symptoms Suggested Action Reference No Counts Loose or damaged cable Inspect power-signal cabling & §8.6 connection(s). interconnections, especially: (0.0 kCPS) §9.3.2 Detector/preamp to amplifier/power supply box.
Page 343 MicroXR Service Manual Bad/intermittent connection(s). Test/replace cable(s). Inspect Low/erratic §8.6 terminals on cabling and counts preamp/detector unit for debris, dirt, condition. damage. Noise, poor Physical obstruction is preventing X- Inspect detector assembly, stage, resolution. rays from reaching detector. bottom plate for physical Failed obstructions.
Page 344 Chapter Seven: Troubleshooting X-Ray Detection System Troubleshooting Table D3 SDD Detector Systems (VXR series) Condition Possible Cause(s)/Symptoms Suggested Action Reference Loose or damaged cable Inspect all power and signal cabling No Counts §3.5 connection(s). and interconnect terminals, (0.0 kCPS) especially: Detector/preamp to amplifier/power supply box.
Page 345 MicroXR Service Manual Condition Possible Cause(s)/Symptoms Suggested Action Reference Problem with Avalon amp/power Check/set detector hardware & §8.6 supply. communications parameters. Perform manual adjust of peaks §5.2.6 (only if hard adjust fails). Replace unit. Problem with Sahara temperature Check indicators on temperature §8.6...
Page 346 Chapter Seven: Troubleshooting Table E X-Ray Generation System Troubleshooting Condition Probable Cause(s)/Symptoms Suggested Action Reference Low or Focusing element is blocked or Visually inspect focusing element §8.5 damaged. and guard for damage, erratic (GXRC, MXRP, MXR, VXR) contamination. Check guard, countrates detector tip orientation.
Page 347 MicroXR Service Manual Condition Probable Cause(s)/Symptoms Suggested Action Reference Mechanical Filter Problem: Mechanical problem, binding, or Run filter test in service mode. §5.2 obstruction. Inspect belts, pulley wheels; §8.7 adjust or replace. §8.6 Check/replace filter motor. Inappropriate filter material being Check/replace filter material or reset §5.2, 5.3...
Page 348 Chapter Seven: Troubleshooting Condition Probable Cause(s)/Symptoms Suggested Action Reference Electrical noise in detection system. Test/replace: Preamp, Amplifier, Detector, §8.6 1.85kV IPPB, AT Link. §8.9, 9.3 Incorrect tube collimator fitting Check/replace installed fitting if aperture is not 0.094 inches. tube installed on x-ray tube. 7-41...
Page 349 MicroXR Service Manual Table F Calibration/Standards/Applications Problems Condition Probable Cause(s)/Symptoms Suggested Action Reference Rule out common errors per section §7.1.1 Measured Operations, maintenance related 7.1.1. problem(s). standard thickness does System Adjust is needed. Perform a system adjust & re- not match measure.
Page 350 Chapter Seven: Troubleshooting Condition Probable Cause(s)/Symptoms Suggested Action Reference §5.2 Perform filter repeatability test. §5.2 Check/adjust filter home position. Check/adjust the temperature See Technical Temperature correlation problem. compensation feature in wxpert.ini Bulletins file. (Vol. 3) Stage positioning repeatability Troubleshoot stage per Table [G]. Table [G] problems.
Page 351 MicroXR Service Manual Table G Stage Problems Condition Probable Cause(s)/Symptoms Suggested Action Reference Binding, Positioning error due to Check, tighten chamber control communication, software, limit cable(s), replace if necessary. noise, rough sensor, or encoder problem. travel, not §5.2 Try to reset stage by sending to repeatable "Home"...
Page 352 Chapter Seven: Troubleshooting Condition Probable Cause(s)/Symptoms Suggested Action Reference §5.2 Stage disabled in software. Check XPert – Utilities and make certain stage is not set to disable or stage disable when door is open. Stage is disabled in hardware as Close door during stage movement.
Page 353 Check/adjust stage speed Stage moves adjusted. [Z, L only:] settings in XPert Service Mode. too fast/slow Incorrect stage configuration Exit XPert Analysis; launch specified in MicroXR Utilities MicroXR Utilities, verify Chamber program. & Stage Settings. §5.2 Point-and- Electronic reticle requires Perform Reticle Calibration calibration.
Page 354 Check/replace stage cable. Dirty encoder strip on linear §8.7 encoded systems - clean encoder strip. See MicroXR Problem with XYZ program. Check XYZ program settings: User Manual. check XYZ program links and override settings. Use Deskew (global 2-Point...
Page 355 MicroXR Service Manual Table H Optics and Video Problems Condition Probable Cause(s)/Symptoms Suggested Action Reference Bad, erratic Work distance (Z-height) Perform Z-height alignment. §5.2 measurements improperly calibrated. Check/adjust View/Measure with sample View/Measure positions are coordinates in Stage Tools. focused: incorrectly configured.
Page 356 Chapter Seven: Troubleshooting Condition Probable Cause(s)/Symptoms Suggested Action Reference Video image Incorrect monitor refresh rate In Windows Display Properties appears to selected. > Settings tab, change monitor have noise, refresh rate to 75Hz. Video board (Flash Point) jumper static on screen settings are set wrong.
Page 357 MicroXR Service Manual Table I Software Problems Condition Probable Cause(s)/Symptoms Suggested Action Reference XPert runs in Communications problem or no Check cables, interconnects, communication between chamber chamber power. Emulator and computer. mode Check ATLINK Card, IPPB and §6.5 cable connections.
Page 358 Chapter Seven: Troubleshooting Condition Probable Cause(s)/Symptoms Suggested Action Reference Installation/configuration problem. Invalid filepath (software Have individual XPert files been component(s) have been relocated? Verify installation file relocated. path(s). Physical damage to hard drive. §6.5 Cannot find, Corrupted database. Restore to previous state using Backup/Restore utility.
Page 359 MicroXR Service Manual Condition Probable Cause(s)/Symptoms Suggested Action Reference data. Default directory for Excel when Set up the Excel default directory: Cannot find exporting XPert Analysis data is not exported data Start Excel. correct. files. Select Tools > Options >...
Page 360 Chapter Seven: Troubleshooting Table J XPert Analysis Error Messages Condition Probable Cause(s)/Symptoms Suggested Action Reference STAGE ERRORS “Stage Stage attempts to back away from limit, without success. Positions Error! The stage or Power or communications Check signal, communications, and sample has hit problem.
Page 361 MicroXR Service Manual Condition Probable Cause(s)/Symptoms Suggested Action Reference §8.9, 9.3 “Stage Motion Stage does not move. Communication error - Check Error - No signal, communications, and Power to power interconnections computer Chamber” and chamber. Check motion control, AT-Link, and stage driver boards.
Page 362 Chapter Seven: Troubleshooting Condition Probable Cause(s)/Symptoms Suggested Action Reference "Door switch System senses that service access Check that all chamber service sensed to be panel interlock sensor has been panels are properly installed. open. triggered and closes shutter. Measurement aborted." CALIBRATION, APPLICATIONS, &...
Page 363 MicroXR Service Manual Condition Probable Cause(s)/Symptoms Suggested Action Reference Allow automatic adjust System adjust needed. procedures to proceed when prompted by system. “Intensity Intensity select procedure failed to Check reference standards, correction produce usable countrate data. reference standard positioning. error; adjust...
Page 364 Chapter Seven: Troubleshooting Table K Miscellaneous Problems Problem Possible Cause/Symptoms Suggested Action/Remedies Reference Hardware Check to make sure BIOS settings Reserve the following in the on computer have been reserved computer BIOS section or through communica- properly. the Windows Device Manger. tion problems related to Interrupt 7...
Page 365 MicroXR Service Manual Properly maintained and Check/follow Thermo Electrons See Tech. What is the calibrated thickness Standards recommendations for recertification Bulletins recommended are paramount to obtaining intervals on thickness standards. (Volume 3) thickness accurate, reliable results from standard thickness testing instruments.
Page 366 Chapter Seven: Troubleshooting Spectrum Installing a new IPPB (P/N 20220- Check the following board modifications energies 2) from stock may result in on the IPPB. shifted to lower energies being shifted to the channels on lower channels on the PHA GXR, GXRC, C12 (1200pf) and C28 (47pf) must (resultant spectrum may appear...
Page 367 Procedures are organized by system and subassembly (tube, shutter & collimator assembly, detector, stage, optics, circuit boards, power supplies, miscellaneous). Sections 8.3-8.11 are primarily intended as a reference source for Thermo Electron service personnel and Thermo-certified in-house technicians. You should review your warranty agreement prior to undertaking any of the service procedures listed in Sections 8.3-8.11.
Page 368 MicroXR Service Manual Chapter Topics 8.1: Safety Precautions 8.2: Periodic Maintenance 8.2.1: Changing the Air Filter 8.2.2: Lubricating the Stage 8.2.3: Changing the Halogen Lamp 8.2.4: Clean Relay Mirrors 8.3: Component Replacement – Overview 8-13 8.3.1: General Information 8.3.2: Service Qualifications 8.3.3: Scope of Sections 8.4 - 8.11...
Page 369 Chapter 8: Maintenance & Component Replacement (VXR) 8.8: Optics 8-50 8.8.1: Overview 8.8.2: Camera/Optics Assembly 8.8.3: Replacing the CCTV Camera 8.8.3: Replace Relay Mirror 8.9: Circuit Boards 8-55 8.9.1: Overview 8.9.2: PCB Handling & Safety Precautions 8.9.3: Circuit Board Configuration Settings 8.10: Power Supplies 8-63 8.10.1: Overview...
Page 370: Safety Information
MicroXR Service Manual 8.1: Safety Information MicroXR operators and service personnel should observe recommended safety precautions provided in each section in order to minimize exposure to potentially hazardous conditions. All readers should take the time to thoroughly review the information provided in Chapter 2, Safety prior to undertaking service tasks described in this chapter.
Page 371: Periodic Maintenance
The procedures described in sections 8.2.1-8.2.3 are routine chamber maintenance tasks that require no special training and may be safely performed by all MicroXR operators. All other service procedures detailed in this chapter are intended to be performed by Thermo Electron...
Page 372 MicroXR Service Manual 8.2.2: Removing and Cleaning Air Filters MicroXR units use one or more cooling fans to circulate room air through the upper region of chamber, where most of the system's heat generating electrical components are located. Console systems use an additional fan to cool the lower portion of the console, where various outboard components are located.
Page 373 Grease application brush.* Lint-free cleaning cloth. Adjustable task lighting, flashlight. *(Included with MicroXR Grease Kit, P/N 16650) 8.2.3.1: Safety Notes Electrical Hazards: Never attempt to service the stage without first powering down the unit and removing AC power to the chamber. All appropriate electrical hazard precautions, including safety lock out/tag out should be observed.
Page 374 MicroXR Service Manual 8.2.3.2: To Clean and Lubricate the Stage: Home the stage. Log out of XPert Analysis and exit the program. Depress the Power On/Off button on the chamber front panel to turn off power to the unit. De-energize the chamber by disconnecting the AC power cable. Lock out the AC power cable per Section 2.4.
Page 375 Chapter 8: Maintenance & Component Replacement (VXR) Apply oil to stage rails Apply oil to stage rails Apply grease to leadscrews...
Page 376 8.2.4: Replacing the Halogen Lamp Overview: The MicroXR uses a fiber-optics cable to deliver illumination from a remote light source (halogen lamp). If the chamber light source is not functioning, it is not possible to view samples in the video window, and therefore impossible to properly position the sample to take a measurement.
Page 377 Chapter 8: Maintenance & Component Replacement (VXR) Eject the lamp from its socket by pulling on the small wire lever located on the side of the lamp assembly. Grip the replacement lamp with a clean, lint-free cloth and insert it into the lamp socket until snug.
Page 378 MicroXR Service Manual 8.2.5: Clean Lenses & Mirrors The lenses and mirrors on the sample focusing and positioning optics should be cleanded as necessary to insure optimum viewing resolution. Remove any dust and/or debris from the main lens and relay mirrors using isopropyl alcohol and a clean, lint-free cloth or swab.
Page 379: Component Replacement - Overview
Section 8.11: Miscellaneous 8.3.1.1: Service Qualifications Sections 8.4 - 8.11 are primarily intended as a reference source for Thermo Electron service personnel and Thermo-certified in-house technicians. You should review your warranty agreement prior to undertaking any component replacement procedures. If you have any questions regarding the scope and terms of your agreement, please contact the Thermo Electron Customer Service Department.
Page 380 If you require further information, you may wish to consult the technical bulletins and supplemental documentation compiled on the CD- ROM volume shipped with this manual. If you have any further questions about the information presented here, please contact the Thermo Electron Customer Service Department. 8-14...
Page 381: X-Ray Tube
Chapter 8: Maintenance & Component Replacement (VXR) 8.4: X-Ray Tube 8.4.1: Replacing the X-Ray Tube Objective: This procedure demonstrates how to replace an X-ray tube on MicroXR System VXR bench top chambers. Tools Needed: T-handle hex driver set (British). #2 Phillips screwdriver.
Page 382 MicroXR Service Manual 8.3: X-R IGURE LACE HV C ABLE HIELD NCLOSURE ILAMENT ONITOR ABLE XFORD “T ” S LACE ENSOR OUNTING RACKET 8-16...
Page 383 Chapter 8: Maintenance & Component Replacement (VXR) ENSOR OLTAGE UPPLY ABLE OUNTING RACKET ILAMENT ONITOR ABLE EVEX On the left side of the tube, remove the socket cap screws securing the high voltage cable cover, and ground wire. Detach all power, signal and sensor connections from the tube enclosure, as follows: Twist the green High Voltage cable connector counter-clockwise and disconnect the cable from the tube.
Page 384 MicroXR Service Manual tubes, the cable terminates in a two pin, right-angle connector, and is attached to the left side of the tube. (Most chambers are equipped with cabling to accommodate both tube types.) Mounting brackets on either side of the tube are secured to the top plate by ¼-20 socket cap screws.
Page 385 Chapter 8: Maintenance & Component Replacement (VXR) Place the new tube on the top plate, making sure the primary beam collimator is properly seated in the top plate through-hole. Reverse steps 1 - 5 in section 8.3.1.1 to complete installation of the new tube. Record the chamber and tube serial numbers, the tube type, the date of service, and service technician’s initials on an FMR form.
Page 386 MicroXR Service Manual 8.5: Shutter/Capillary Optic Assembly 8.5.1: Overview Figures 8.7 - 8.9 illustrate the shutter and capillary optic assembly used in VXR chambers. Instructions and specifications for the replacement of specific focusing element and transmission element types are provided in section 8.5.2.
Page 387 Chapter 8: Maintenance & Component Replacement (VXR) 8.9: S IGURE HUTTER APILLARY PTIC SSEMBLY XPLODED EGEND OLLOWING 8-21...
Page 388 MicroXR Service Manual 8.9 L IGURE EGEND Description Shutter Block Shutter Block Cover Tube Interface Fitting (VXR) Shutter Hub Shutter Shutter Flag Shutter Stop Bracket Opto Mount - - - - - - - - - Bracket (Seal) Bracket (Actuator)
Page 389 Chapter 8: Maintenance & Component Replacement (VXR) 8.5.2: Replacing the Capillary Optic Objective: Disassemble and replace a capillary optic tube. Tools Needed: Digital caliper. Hex key set. Before You Begin: Power down the chamber and detach the A/C power cable from the rear of the chamber.
Page 390 MicroXR Service Manual Following cap optic re-installation, perform tests & adjustments as follows: Section 5.2.9: Beam Alignment Section 5.2.3.1: Focal Height Setup Section 5.2.10: Focusing Laser Adjustment Section 5.3.2: Countrate Tests Section 5.4.2: Au/Ni/Cu Accuracy Tests 8.10: A IGURE DJUSTING...
Page 391: X-Ray Detection System
8.6: X-Ray Detection System 8.6.1: PGT SDD X-ray Detector The Sahara SDD X-Ray Detector is used in many of the MicroXR VXR systems built in 2004 and earlier. The PGT SDD can be identified by its ugly black finned heat-sinks on three sides.
Page 392 MicroXR Service Manual VXR PGT Detector Mounting & Adjustment Hardware Note: Illustration depicts discontinued detector type; mounting/adjustment hardware details are identical. See detail photos for current PGT detector image.. Legend: Description Description 1 / 4 – 20 Socket Cap Screw (1 of 6)
Page 393 Chapter 8: Maintenance & Component Replacement (VXR) PGT SDD X-Ray Detector Views, Installed Detector Tube & Capillary Optic Orientation Capillary Optic Guard 8-27...
Page 394 MicroXR Service Manual 8.6.1.2: Replacing the PGT SDD Detector Objective: This procedure describes replacement of a PGT SDD X-ray detector on MicroXR System VXR units. Tools Needed: T-handle hex driver set (various sizes) Before You Begin: Power down the chamber and detach the A/C power cable from the rear of the chamber.
Page 395 Chapter 8: Maintenance & Component Replacement (VXR) Rotate the front adjuster handle counterclockwise until there is a gap of approximately 1/2” between the adjuster and the mounting plate. Temporarily remove the tension block (two 10-32 socket screws) and spring assembly from the top plate.
Page 396 MicroXR Service Manual Reverse Step 11 to position the new detector/mounting plate assembly onto the top plate. Once again, make certain that the detector tip is carefully inserted through the top plate and carefully positioned during the reinstallation and final adjustment process.
Page 397 Chapter 8: Maintenance & Component Replacement (VXR) 8.6.2: Thermo SDD X-ray Detector The Thermo SDD X-Ray Detector has replaced the PGT SDD for use in the MicroXR VXR systems built in 2004 and later. The Thermo SDD can be identified by its rear mounted heat sink with attached cooling fan.
Page 398 MicroXR Service Manual VXR Thermo SDD Detector Mounting & Adjustment Hardware Legend: Description Description 8-32 x ½” Socket Head Cap Screw (4) Front Position Adjuster (X-axis adjustment) #8 Split Lock Washer (4) Rear Position Adjuster (Y-axis adjustment) Detector Adapter Plate...
Page 399 Chapter 8: Maintenance & Component Replacement (VXR) 8.6.2.2: Replacing the Thermo SDD Detector Objective: This procedure describes replacement of a Thermo SDD X-ray detector on MicroXR System VXR units. Tools Needed: T-handle hex driver set (various sizes) and standard ball-driver hex wrench set.
Page 400 MicroXR Service Manual Remove the four (4) 8-32 x ½” socket screws from the detector adapter plate identified on the image above. This frees up the detector and allows it to move so do not bump or shift it. Carefully lift the detector assembly out of the chamber, following the sequence described...
Page 401 Chapter 8: Maintenance & Component Replacement (VXR) 13. Use the front (X-axis), rear (Y-axis), and center pivot (tilt) adjusters to fine tune the detector tip-to-cap optic orientation for maximum X-ray collection, as depicted in the image below. 14. Tighten the six (6) ¼-20 socket cap screws to secure the detector mounting plate into position, checking tip alignment as you proceed.
Page 402 MicroXR Service Manual 8.6.3: Thermo SuperDry II X-ray Detector The SuperDry II X-Ray Detector is a detector option available for the MicroXR VXR systems. The SuperDry II requires a stable temperature chilled water supply to cool an internal heat sink. A chilled water system is provided with each system.
Page 403 Chapter 8: Maintenance & Component Replacement (VXR) VXR SuperDry II Detector Mounting & Adjustment Hardware Legend: Description Description 8-32 x ¾” Socket Head Cap Screw (5) Detector Mounting Plate #8 Split Lock Washer (5) Front Position Adjuster (X-axis adjustment) Nylon Shoulder Washer (6) Center Pivot Adjustment (one each side) M3 x 10mm Button Head Screw (4) Rear Position Adjuster (Y-axis adjustment)
Page 404 MicroXR Service Manual 8.6.3.2: Replacing the SuperDry II Detector Objective: This procedure describes replacement of a SuperDry II X-ray detector on MicroXR System VXR units. Tools Needed: T-handle hex driver set (various sizes, Metric and English) and standard ball-driver hex wrench set.
Page 405 Chapter 8: Maintenance & Component Replacement (VXR) connections during this operating to absorb any water that may leak out. Temporarily secure the removed chilled water tubes at an elevated location to avoid water drainage or plug the hoses. Remove the capillary optic tip guard (see figure c, pg 8-27 Remove the SuperDry II cover (item 5) by removing the four M3 button head screws (item 4).
Page 406 MicroXR Service Manual Reverse Step 10 to position the new detector assembly onto the detector mounting plate. Once again, make certain that the detector tip is carefully inserted through the top plate and carefully positioned to avoid contacting the x-ray window located in the tip.
Page 407 Chapter 8: Maintenance & Component Replacement (VXR) Use the front (X-axis), rear (Y-axis), and center pivot (tilt) adjusters to fine tune the detector tip-to-cap optic orientation for maximum X-ray collection, as depicted in the image below. Tighten the six (6) ¼-20 socket cap screws that were loosened in Step 18 as well as any other mounting hardware that was loosened, to secure the detector mounting plate into position, checking tip alignment as you proceed.
Page 408 MicroXR Service Manual 8.7: Stage Components 8.7.1: Overview This section describes the removal, installation and mechanical adjustments of key stage components, as follows: Section 8.7.2: Replace Stage Motors, Belts & Pulleys. Section 8.7.3: Replace Limit Sensors. Recommended Tools: Adjustable task light & mirror.
Page 409 Chapter 8: Maintenance & Component Replacement (VXR) 8.18: S . 8.19 IGURE ERVO OTOR OCATIONS EE FIG FOR ADDITIONAL DETAIL VIEWS Z Motor Mount X Motor X Motor Y Motor 8-43...
Page 410 MicroXR Service Manual 8.7.2: Replacing Servo Motors The following section provides general procedures for replacing XYZ servo motors, including pulley and belt replacement. To Replace Servo Motors: Move stage & power down unit. Move stage in Z to halfway point for access to...
Page 411 Chapter 8: Maintenance & Component Replacement (VXR) 8.19: X-Y-Z S 8.18 IGURE ERVO OTOR ETAILS YPICAL NSTALLATION EE FIGURE FOR ADDITIONAL VIEWS X-Axis Servo Motor (Mounted to bracket on left side of chamber) Y-Axis Servo Motor (Mounted beneath Y-axis mechanism) Z-Axis Servo Motor (Mounted on rear of chamber) 8-45...
Page 412: Stage
MicroXR Service Manual 8.7.3: Replace Limit Sensors Objective: Remove and replace X, Y (if applicable) and/or Z-axis travel limit sensor modules. Tools Needed: Wire cutters. Heat shring tubing. Heat gun or electronics mini-torch. 8.20 IGURE OMPARISON OF TAGE NCODER ECHANICAL...
Page 413 Chapter 8: Maintenance & Component Replacement (VXR) Strip back the insulation on the limit sensor signal wires approximately ¼”. Slide an approximately ½” section of shrink tubing over each wire. Connect the wires to the terminals on the new limit sensor; make sure to reference the wiring to the old limit sensor.
Page 414 MicroXR Service Manual 8.20: L IGURE IMIT ENSOR OCATIONS ONFIGURATION Description Description X-axis linear encoder rail Y-axis home sensor* X-axis linear encoder strip read head X-axis limit sensor* X-axis home sensor* Z-axis home sensor Y-axis linear encoder strip read head Z-axis limit switch &...
Page 415: Optics
Chapter 8: Maintenance & Component Replacement (VXR) 8.8: Optics 8.8.1: Overview This section describes removal and installation of key optics system components, as follows: Section 8.8.2: Replace CCTV Camera Section 8.8.3: Remove Optics Assembly from Chamber Section 8.8.4: Replace Relay Mirror 8.22: C .
Page 416 MicroXR Service Manual 8.23: C IGURE AMERA PTICS SSEMBLY ETAIL Description Description Video Camera Zoom Gear (See detail, figure 5.14) Camera Mounting Collars Fiber Optics Cable Input (Parfocality/Colinearity Adjustment) Clamp Focus Adjust Wheel Relay Mirror Housing Zoom Optics Mechanism Zoom Stepper Motor...
Page 417 Chapter 8: Maintenance & Component Replacement (VXR) 8.8.2: Remove/Replace CCTV Camera Objective: Remove CCTV camera onto optics assembly for service, replacement. Tools Needed: 1/16” Allen or T-handle hex key. To Replace Camera: Unplug the Power and Video Out cables from the camera enclosure. Loosen the (3) 1/16”...
Page 418 MicroXR Service Manual 8.8.3: Remove/Replace the Zoom Optics Assembly Objective: Remove entire zoom optics assembly from chamber for service or replacement. Tools Needed: Hex driver set. To Remove the Optics Assembly: Detach the following interconnections inside the chamber. Fiber optics (fig. 8.23-10) cable.
Page 419 Chapter 8: Maintenance & Component Replacement (VXR) 8.8.4: Replace Relay Mirror Objective: Replace damaged or defective sample view relay mirror. Tools/Supplies Needed: RTV adhesive compound. Replacement relay mirror Small flat-head screwdriver. To Replace the Relay Mirror: Remove the mirror block from the front of the shutter assembly. (See fig. 8.8.) Pry the old mirror from the block using a small flat head screwdriver or other suitable tool.
Page 420: Circuit Boards
MicroXR Service Manual 8.9: Circuit Boards 8.9.1: Overview This section describes the removal, installation and configuration of chamber circuit boards and computer cards. This section is organized as follows: Section 8.9.2: Safety Precautions and Circuit Board Handling Describes personnel safety precautions and general board handling and installation techniques.
Page 421 Chapter 8: Maintenance & Component Replacement (VXR) 8.24: VXR T IGURE LATE IEWS LECTRONIC OMPONENTS RONT Integrated Pulse Processing Board (20220) System Status Control Board (20223) Safety/Stepper Board (20321) Photo Sensor Board (16661) Tube Current Regulator (20227) SDD Chamber (Detector Cooling) 47kV High Voltage Power Supply (Beneath Cover) ETECTOR...
Page 422 MicroXR Service Manual 8.25: R IGURE LECTRONICS ANEL Servo Motor (Z-Axis) Servo Amplifier (Z-Axis) Servo Interconnect Board (21182-2) Servo Amplifiers (X, Y Axes) (Note: Amp modules are stacked;X-axis module is not visible in photo.) Ground PS6000 Voltage Power Supply Power...
Page 423 Chapter 8: Maintenance & Component Replacement (VXR) 8.9.2: Safety Precautions and Circuit Board Handling Techniques 8.9.2.1: Electrical Shock Hazard Protection Before replacing circuit boards: The system should be powered down. The system should be completely de-energized by detaching the cable from the chamber AC power input receptacle.
Page 424 Replaced circuit boards should be carefully repackaged and returned to the Service Department for evaluation. If you require additional information or technical assistance, please contact the Thermo Electron Service Department. 8.9.3.2: Circuit Board Configuration Reference Table Notes: In all instances, electrical hazard precautions and safe PCB handling techniques detailed in section 8.9.2 should be observed.
Page 425 Chapter 8: Maintenance & Component Replacement (VXR) MicroXR Circuit Board Configuration Reference Circuit Board Configuration Settings/Installation Notes: Chamber Boards: 20223 System Status Control Board Perform a system backup routine in XPert Utilities prior to removal of board. Make sure that FPGA U29 (I/O interface) is firmly seated in its socket.
Page 426 MicroXR Service Manual MicroXR Circuit Board Configuration Reference Circuit Board Configuration Settings/Installation Notes: 16031 Detector Filter Sensor Board Detach all cabling and replace board. Board positioning should allow for free movement of opto wheel through sensor posts. Perform Filters Test (section 5.2.10) to confirm successful installation.
Page 427 Chapter 8: Maintenance & Component Replacement (VXR) 8-61...
Page 428: Power Supplies
MicroXR Service Manual 8.10: Power Supplies 8.10.1: Overview This section details the replacement and configuration of MicroXR power supply modules, as follows: Section 8.10.2: PS6000 Power Supply. Section 8.10.3: Changing Line Input Voltage Setting (120 or 240VAC Operation) Section 8.10.4: 47kV High Voltage Power Supply.
Page 429 Chapter 8: Maintenance & Component Replacement (VXR) 8.10.2: Replace PS6000 Power Supply Overview: The PS6000 is the main power module for MicroXR G-, M, and V-series chambers. It is mounted on the lower left side of the rear electronics panel. (See figure 8.21.) Tools Needed: #2 Philips screwdriver.
Page 430 8.10.3: Configure Chamber for 120 or 240 VAC Operation Objective: Configure MicroXR systems for 100-120VAC/50-60Hz or 220-240VAC/50-60Hz operation. Tools/Parts Needed: Small flat-bladed screwdriver. Philips-head screwdriver. MicroXR Voltage Conversion Kit (120VAC or 240VAC version, see below). OLTAGE ONVERSION ONTENTS 120VAC Conversion Kit 240VAC Conversion Kit...
Page 431 Chapter 8: Maintenance & Component Replacement (VXR) To Configure VAC Input Voltage Setting: Power Down the Chamber Power down the system and disconnect the AC power input cable from the chamber. The power cable should be placed under safety lockout for the duration of the procedure. (Recommended safety lockout procedures are detailed in Section 2.4.) Configure PS6000 “VSEL”...
Page 432 MicroXR Service Manual Add/Update Electrical Hazard Warning Labels Affix the three “Hazardous Voltage (120V or 240V)” labels provided in the conversion kit to the following locations (refer to figures 8.20 and 8.21 for locations): Top of the PS6000 plexiglass safety cover.
Page 433 Chapter 8: Maintenance & Component Replacement (VXR) Close Up Chamber Re-install the cover over the PS6000 module. Replace the lower rear electronics panel using the screws previously removed. Replace the top rear chamber cover. Affix External Hazard Warning Labels Locate the existing voltage warning label on the lower rear panel of the system. Place the label marked “Hazardous Voltage Inside (120V at 5A or 240V at 2.5A)”...
Page 434 8.10.4: Replace 47kV High Voltage Power Supply (HVPS) Overview: This section describes removal and installation of the 47kV high voltage power supply (HVPS). Current MicroXR designs use a Spellman model PCM50 power supply unit to provide high voltage current to the tube filament. Tools Needed: 9/64”...
Page 435 Chapter 8: Maintenance & Component Replacement (VXR) Run DAQU for one hour, then check to make sure unit is performing to specification. (See Chapter 5, Setup & Adjustment, section 5.3.1 for specification.) 8.24: HVPS C IGURE ABLING AND OUNTING ARDWARE ETAIL Tube Filament Cable Control I/O Interconnect...
Page 436 MicroXR Service Manual 8.10.5: Replace Low Voltage Power Supply Objective: Replace low voltage power supply. Recommended Tools: 7/64” hex head driver (4 - 6” shaft) #1 & #2 Phillips head screwdrivers. Before You Begin: Power down the system and disconnect the AC power cable from the chamber.
Page 437 Chapter 8: Maintenance & Component Replacement (VXR) Return the defective low voltage power supply to Thermo Electron service department for evaluation. 8.25: L . (S . 8.25) IGURE OLTAGE OWER UPPLY EE ALSO Pin1: -15V [+/-] 750mV Pin2: -5V [+/-] 100mV...
Page 438 Reverse steps above to install the new servo amplifier Remove the lockout device and re-attach A/C power cable to the unit. Power up the chamber and start XPert Analysis. Return the defective servo amplifier to Thermo Electron service department for evaluation. 8-72...
Page 439 Electronics Overview This chapter provides illustrations, functional descriptions and diagnostics/troubleshooting tips for MicroXR circuit boards and key electronic components. Chapter Topics 9.1: Electronics Interconnect Diagrams 9.2: Circuit Board Installation Matrix 9.3: Circuit Boards 9.4: Power Supply (OEM) Reference 9-86...
Page 440 MicroXR Service Manual...
Page 441 Chapter Nine: Electronics 9.1: Electronics Interconnect Diagrams This section provides diagrams of overall chamber electronics interconnections. For detailed, board-level schematics refer to the MicroXR Schematics Package (Vol. 4) Electronic Schematics > Interconnects > System Interconnects. MicroXR Model ZXR/LXR (1 of 2)
Page 442 MicroXR Service Manual...
Page 443 Chapter Nine: Electronics 9.2: Circuit Board Installation Matrix Table 9.1 lists major circuit boards installed in MicroXR production units, including part numbers and most recent revision (A, B, C, etc.).
Page 444 MicroXR Service Manual 9.1 : M XR C ABLE ICRO IRCUIT OARD NSTALLATION ODEL...
Page 445 9.3: Circuit Boards This section provides illustrations, functional overviews and diagnostic/troubleshooting tips for major circuit boards used in all MicroXR platforms. (Note: Refer to Chapters 3 (Product Overview), 5 (System Setup) and 8 (Maintenance & Component Replacement) for in-situ board photos and illustrations.)
Page 446 MicroXR Service Manual 9.3.1: Preamplifier Part Number: 20539 (Rev. F) Description: Preamp (Proportional Counter Detector) Used in: ZXR, LXR, GXR, GXRC, MXRP...
Page 447 Chapter Nine: Electronics...
Page 448 MicroXR Service Manual 9.3.1.1: Preamplifier - Functional Overview The preamp board is located within a brass enclosure mounted to the side of the proportional counter detector cylinder. The preamp is a charge amplifier that converts X-ray photon charges in the proportional counter detector to a voltage level between 50 to 200mV peak. It then shapes this voltage level into a pulse 4 - 11 µsec in width.
Page 449 Chapter Nine: Electronics 9.3.2: Amplifier Part Number: 26032 (Rev. D) Description: Amplifier (Proportional Counter Detector) Used in: ZXR, LXR, GXR, GXRC, MXRP 9-11...
Page 450 MicroXR Service Manual 9.3.2.1: Amplifier - Functional Overview The amplifier is located in a rectangular brass enclosure which is mounted either flush to the top plate, or to a bracket extending perpendicularly from the top plate, depending on model type.
Page 451 Chapter Nine: Electronics 9.3.3: System Control Board Part Number: 26066 (Rev. 4) Description: System Control Board Used in: ZXR, LXR J7, AMP Signal in 9-13...
Page 452 MicroXR Service Manual 9.3.3.1: System Control Board (SCB) Summary The System Control Board (SCB) can be thought of as the control center of ZXR and LXR- series chambers. It is responsible for the following: Interfacing to the external computer via the AT Link card.
Page 453 Chapter Nine: Electronics jumper plug. This can be used to enable or disable the "over temperature" shutdown function for diagnostic purposes. Measure In Progress and High Voltage Panel Lights: The PIC monitors the HV monitor, HV program, Over Counts and Shutter Open signals. When the PIC decides its time to turn on a lamp, it supplies 5V to the gate of Q5 or Q6.
Page 454 HV is less than 28kV. As long as the HV is on it will be at least 3.125kV. There are 16 steps (0-15) with each step equal to 3.125kV. On MicroXR systems, the HV automatically ramps to 47kV, although the circuitry allows any voltage from 28kV to 50kV to be used.
Page 455 Chapter Nine: Electronics develop enough beam current to satisfy the regulator, so it drives the tube filament as hard as it can to reach its programmed beam current. The current regulator's response time is slow and would permit the filament to exceed 1.85A for about 700MS. To prevent this from occur- ring, the first stage (OP1/B) is set to about 1.3A, so that the overshoot is below the 1.85A maximum current of the filament.
Page 456 MicroXR Service Manual 9.3.3.2.4: Data Acquisition Section A/D Converter: The A/D converter receives its input from the MUX via U4. U4 is used as a buffer and R10 and R11 divide the output from the MUX in half. This is because the A/D converter has a maximum input of 2.5V, and several voltages exceed this.
Page 457 Chapter Nine: Electronics Diagnostic Output Connector: This 9-pin D connector is mounted on the rear of the SCB and is accessible via the chamber rear panel. Each output is current limited by a 2K series resistor. This protects the unit in the event someone shorts one of the outputs to ground. Connector pin outs are as follows: BIT # MESSAGE...
Page 458 MicroXR Service Manual U38 Pulse Detector: Comparator U38 detects pulses with amplitudes greater than 100mV and provides a low going pulse for the duration on the input pulse. U38 also provides a positive going pulse, which is integrated and used to detect an overcounts error by the PIC micro-controller U7.
Page 459 Chapter Nine: Electronics FPGA U41 is the brain of the pulse processing section. It controls the following functions: Hand shaking. Computer interface. Live time clock. Pulse Pile-up detection. Data line multiplexing to the DAC's. Gatti Slider. Auto-Store-State-Machine. Since the FPGA has no user-serviceable parts and can not be debugged in the field, only a limited discussion of the gate array functions will be provided, which will be sufficient to determine whether it is functioning properly.
Page 460 MicroXR Service Manual 9.3.3.2.7: Miscellaneous SCB Features U49 (CS-13) is an output port. Currently only 2 bits are used; spot lamp ON/OFF and chamber flood ON/OFF. The other 6 bits are brought to J2 for later use. U30 (CS-11) is used to drive the motor drivers on the PS4000.
Page 461 Chapter Nine: Electronics 9.3.3.3: SCB Troubleshooting & Diagnostic Tips The four LED’s at the upper left corner of the SCB will give you a quick look at the status of the board. LED #1 is on the left side as you are looking in from the front of the chamber.
Page 462 MicroXR Service Manual 9.3.4: AT-Link II Card Part Number: 16513-1 (Rev. C) Description: AT-Link II Used in: All Units Read/Write Interface JP1: Uses IRQ 7 Only 9-24...
Page 463 Chapter Nine: Electronics 9.3.4.1: AT-Link Functional Overview The AT Link II board is the interface from the computer to the chamber. It is an 8-bit card that plugs into any ISA slot in IBM compatible computers. The AT Link II board has moveable address at 300H, 308H, 310H, 318H, 320H, 328H, 330H, 338H, 340H, 348H, 350H, 358H, 360H and 368H.
Page 464 MicroXR Service Manual SW1 POSITION 300H 308H 310H 318H 320H 328H 330H 338H 340H 348H 350H 358H 360H 368H 9.3.4.2: AT-Link Troubleshooting & Service Tips If communication between the chamber and computer is not established or is intermittent, check the indicator LED’s on the SCB (Z/LXR) or IPPB & PS6000 (G, M, V series) to determine if +5V from the computer is present.
Page 465 Chapter Nine: Electronics 9.3.5: System Status Control Board Part Number: 20223 (Rev. A) Description: System Status Control Board Used in: GXR, MXR, VXR units U29: I/O Interface 9-27...
Page 466 MicroXR Service Manual 9.3.5.1: System Status Control Board (SSCB) - Summary The System Status Control Board (SSCB) is responsible for the following functions on G, M, and V series chambers: Monitoring of all system voltages. Running chamber diagnostics (DAQU). Retaining chamber configuration data.
Page 467 Chapter Nine: Electronics Below is a chart of the 16-bit data stream sent out by the PIC micro-controller to the FPGA. Bits 13, 14 & 15 are always 101, and used to verify the validity of the data. The FPGA will ignore any packet of data that doesn't start with 101.
Page 468 MicroXR Service Manual 9.3.5.2.3: Data Acquisition Section A/D Converter: The A/D converter receives its input from the MUX via U9. U9 is used as a buffer and R13 and R14 divide the output from the MUX in half. This is because the A/D converter has a maximum input of 2.5V, and several voltages exceed this.
Page 469 Chapter Nine: Electronics Diagnostic MTA Connector: An 8-pin mta connector (Location, P2) is used for diagnostic monitoring. Each output is current limited by a 10K series resistor. This protects the unit in the event someone shorts one of the outputs to ground. Connector pin outs are as follows: BIT # MESSAGE...
Page 470 MicroXR Service Manual 9.3.5.3: SSCB Troubleshooting & Service Tips The SSCB has (4) four LEDS at the upper left corner. These will give you a quick look at the status of the board. LED #1 is on the left side as you are looking in from the front of the chamber.
Page 471 Chapter Nine: Electronics 9.3.6: Stepper Stage Driver Part Number: 14085 (Rev. H) Description: Stepper Stage Driver Used in: 1.1V 1.5V 9-33...
Page 472 MicroXR Service Manual 9.3.6.1: Stepper/Stage Driver Board - Functional Overview The stage driver board contains a DC rectifier, the stepper motor phase switches, current supply and sense electronics, and the limit switch input buffers. The current to step a motor is switched on with a TTL signal to one of the UDN2962 motor driver chips pins 2 or 11.
Page 473 Chapter Nine: Electronics 9.3.7: Servo Motion Controller (MEI Board) Part Number: 16594 (Rev.C) Description: Servo Motion Controller (MEI) Used in: GXR, MXR, VXR units 9-35...
Page 474 MicroXR Service Manual 9.3.7.1: Servo Stage Driver Board - Functional Overview Controllers U13 (X-axis), U9 (Y-axis) and U1 (Z-axis) provide position and velocity control for DC servo motors. The motor controller IC’s (HCTL-1100) receive input from XPert Analysis and position feedback from an incremental encoder with quadrature output. An 8-bit, bi-directional multiplexed address/data bus interfaces the IC’s to XPert Analysis.
Page 475 Chapter Nine: Electronics 9.3.8: Safety Stepper Board Part Number: 20321 (Rev. B) Description: Safety/Stepper Board Used in: GXR, MXR, VXR units Jumpers: J11: Laser Disabled J12: Shutter Invert J13: Spare I ndicators: D38: Shutter Closed D39: V Switch D37: oor Closed D40: Tube in Place (TIP)
Page 476 MicroXR Service Manual 9.3.8.1: Safety/Stepper Board (SSB) Functional Overview The Safety/Stepper Board drives all of the safety stepper motors along with monitoring chamber safety operations. It has the following features: Four (4) bits of output Two Solenoid Driver Five (5) Stepper Motor Drivers Chamber Safety Logic 9.3.8.1.1: Solenoid Driver...
Page 477 Chapter Nine: Electronics 9.3.8.1.2: Stepper Motor Drivers The Safety/Stepper Board can drive five stepper motors. U5 & U8 drive the collimator motor, U6 & U9 drive the filter motor, U11&U14 drive the zoom motor and U11&U14 are spare drivers. THRA & B are used to set the motor current to 0.9V. The current to step a motor is switched on with a TTL signal to one of the UDN2962 motor driver chips, pins 2 or 11.
Page 478 MicroXR Service Manual displayed on the screen, the status of this relay is shown. If the relay is closed, the HVPS supply should have 120/240VAC on its input. If the relay is open, the HVPS will not have 120/240VAC. The Safety Loop: In order for the HV Relay to energize, all the safety conditions must be met first.
Page 479 Chapter Nine: Electronics 9.3.9: PS4000 Power Supply Part Number: 26064 (Rev. B) Description: PS4000 Power Supply Used in: ZXR, LXR units 9-41...
Page 480 MicroXR Service Manual 9.3.9.1: PS4000 Power Supply - Functional Overview The PS-4000 is the main power module for the MicroXR system. It has the following features: AC input and voltage selection of 100/120/220/240 VAC. Supplies +5VDC @ 1.5A, 15VDC @ .5A, +12VDC @ .5A, +30VDC @ 4A.
Page 481 Chapter Nine: Electronics At this point, the relay will energize, but the chamber will not turn on unless it is plugged into the proper AC line voltage (determined by the PEM setting). There are two fuses in the PEM; both must be installed. If everything is working correctly, the line voltage will next proceed to the line filter, FI1, then back to the PEM.
Page 482 MicroXR Service Manual 9.3.9.1.2: Part Two This section describes the following: +5VDC Regulator. +12VDC Regulator. ±15VDC regulators. +24VDC Unregulated for the X-RAY tube. +5VDC Regulator: RG1 (LM2576-5) is a monolithic step-down switching regulator providing an output voltage of 5.0V and delivering 3.0A. This device has internal frequency compensation and the oscillator is fixed at 52Kz.
Page 483 Chapter Nine: Electronics 9.3.9.1.3: Part Three This section describes the following: Laser/Spot Light Driver. Chamber Flood Light Driver Solenoid Drivers Stepper Motor Drivers Laser/Spot Light Driver: Q6, which is controlled by the computer via the SCB, is used to turn the red Laser or spotlight on and off.
Page 484 MicroXR Service Manual supply voltage, and is sensed by R15. When the load current reaches the trip point ( ), the TRIP comparator output goes high and turns OFF the source driver. After the source driver is turned OFF, the load current continues to circulate through the sink driver and an internal ground clamp diode.
Page 485 Chapter Nine: Electronics 9.3.9.2: PS4000 Troubleshooting & Service Tips 9.3.9.2.1: HV Control In order for the HV to be turned on the following conditions must be true: The DOORS or SHUTTER must be closed. The X-RAY tube must be mounted to the top plate. The tube ring must be installed.
Page 486 MicroXR Service Manual DESCRIPTION +5VDC +12VDC -15VDC +15VDC TUBE VCC +24VDC, UNREGULATED. MISC +30VDC, UNREGULATED, Used for lamp driver, solenoid driver and stepper motor drivers. ATV: Power from the computer. Signal from the ATlink II card, through the SCB. RELAY 2: LED lights when VAC is supplied to the HVPS.
Page 487 Chapter Nine: Electronics 9.3.10.1: PS6000 Power Supply Part Number: 20622 (Rev. B) Description: PS6000 Power Supply Used in: GXR, MXR, VXR units 9-49...
Page 488 MicroXR Service Manual 9.3.10.2: PS6000 Power Supply - Functional Overview The PS-6000 is the main power module for the MicroXR system. It has the following features: AC input and voltage selection of 100/120/220/240 VAC. Supplies +5VDC @ 1.5A, +12VDC @ .5A, +30VDC @ 4A.
Page 489 Chapter Nine: Electronics SP-1, V1, V2 & V3 are added to provide surge protection for 220-240VAC. SP-1 uses discharge electrodes. M4, M5 & M6 are Metal-Oxide Varistors (MOV) used in a 3-mode configuration, in which there is one MOV across the line, another from line to ground and a third from netural to ground.
Page 490 MicroXR Service Manual +24V Unregulated: The +24V is an unregulated DC voltage that is isolated from the rest of the system used to power the X-ray tube. This voltage is sent to the TCR board where it is used by the LM3526 switching regulator.
Page 491 Chapter Nine: Electronics 9.3.10.2: PS6000 Troubleshooting & Service Tips 9.3.10.2.1: LED Bar Graph The PS6000 has a bar graph LED mounted on the left side of the PC board. These LED's can give a quick indication of a problem. Remember, the fact that an LED is lit does not necessarily mean everything is functioning properly.
Page 492 MicroXR Service Manual 9.3.11: Tube Current Regulation Board Part Number: 20227 (Rev. B) Description: Tube Current Regulator Used in: GXR, MXR, VXR units 2A/125V Ultra Fast Blow Fuse LED: When on, voltage is supplied to tube. When off, fuse is blown or tube filament is open.
Page 493 Chapter Nine: Electronics 9.3.11.1: Tube Current Regulation Board (TCR) - Summary Constant x-ray flux on the specimen being measured is an essential condition for accurate XRF measurements. With all other components held constant, the x-ray flux is directly proportional to the electron beam (tube) current flowing from the cathode (filament) to the anode within the x-ray tube.
Page 494 MicroXR Service Manual measured at TP2 with respect to TP1. This voltage should always be present if power is supplied to J1 regardless of the state of any other signal on the board. R1 is a precision four terminal resistor used to sense the filament current. Although the current of LED D15 also flows through R1, its current about 2 mA and contributes less than a 0.2% error to the...
Page 495 Chapter Nine: Electronics passively summed with the inverted filament current programming signal through R34 and R37. The result is the filament current error signal that is sent analog switch U10. The filament current signal, filtered by R60 and C33, is also fed to current limit comparator U6C and buffer U4A for transmission to the SSCB.
Page 496 MicroXR Service Manual The third method occurs automatically while in TCR mode if the filament current reaches 1.7 amps. When this happens, the output of comparator U6C (TP15) goes low. This forces the filament current level control (TP17) low and selects the 1.7 amp set point. Also transistor Q4 is switched off.
Page 497 Chapter Nine: Electronics 9.3.12: Integrated Pulse Processing Board Part Number: 20220 (Rev. C) Description: Integrated Pulse Processing Board Used in: GXR, MXR, VXR units 9-59...
Page 498 MicroXR Service Manual 9.3.12.1: Integrated Pulse Processing Board (IPPB) - Summary The Interface Pulse Processing Board (IPPB) is responsible for the following functions: Interfacing to the external computer via the AT Link II card. Processing of the X-ray pulses from the amplifier.
Page 499 Chapter Nine: Electronics U17 Peak Detector: Comparator U17 and R11, R12 & C25 make up the Peak Detector. The output goes low at the start of a pulse and goes back high when the pulse crosses its peak. U18 Analog To Digital Converter: Converting the pulse amplitude to a digital value is performed by U18, a 12-bit sampling analog to digital converter (ADC).
Page 500 MicroXR Service Manual Hand shaking. Computer interface. Live time clock. Pulse Pile-up detection. Data line multiplexing to the DAC's. Gatti Slider. Auto-Store-State-Machine. Since the FPGA has no user serviceable parts and can not be debugged in the field, only a limited discussion of the gate array functions will be provided, which will be sufficient to determine whether it is functioning properly.
Page 501 Chapter Nine: Electronics 9.3.12.3: IPPB Troubleshooting & Service Tips The IPPB has (4) four LEDS at the upper left corner. These will give you a quick look at the status of the board. LED #1 is on the left side as you are looking in from the front of the chamber.
Page 502 MicroXR Service Manual 9.3.13: Detector Filter Sensor Board Part Number: 16031 (Rev. D) Description: Detector Filter Sensor Board (DFSB) Used in: ZXR, LXR units 9.3.13.1: DFSB Functional Overview The DFSB is used to determine the position of the detector filter. Two OPTO’s can sense up to three positions.
Page 503 Chapter Nine: Electronics 9.3.14: Servo Interconnect Board (ZXR, LXR) Part Number: 16383 (Rev. E) Description: Servo Interconnect Board Used in: LXR units only U3, U4 Stepper Stage Drivers Crash Protection Signal Input Interface to Servo Stage, Amplifier and Servo Motor Encoder XYZ Sensor Inputs (Home...
Page 504 MicroXR Service Manual 9.3.14.1: Servo Interconnect Board (SIB) Functional Overview Stepper Motor Drivers U3 & U4 on the Servo Interconnect Board is used to drive the Z stage. Current is adjusted by monitoring TP-5 while setting trimpot (R3), and is normally set to 1.5V. The current to step a motor is switched on with a TTL signal to one of the UDN2962 motor driver chips pins 2 or 11.
Page 505 Chapter Nine: Electronics 9.3.14: Servo Interconnect Board (G, M, V-series) Part Number: 21182-1,2,3 (See below) Description: Servo Interconnect Board 21182-1: Rotary Encoded Systems (GXR, GXRS) Used in: 21182-2: Dual Rotary-Linear Encoded Systems (GXRC, MXRP, MXR, VXR) 21182-3: Bayside Stages (Console Systems Only) 25-pin RS232 100-pin Cent.
Page 506 SIB interfaces to the computer via a 100-pin Centronics main cable and a 25-pin RS232 encoder cable, which are located on rear left/right sides of the MicroXR chamber. J7 is a TTL input from the crash protection circuit. When a crash condition occurs, the stage will stop moving in the Z direction.
Page 507 Chapter Nine: Electronics 9.3.15: System Sensor Board Part Number: 16474 (Rev B) Description: System Sensor Board Used in: ZXR, LXR Units 9-69...
Page 508 MicroXR Service Manual 9.3.15.1: System Sensor Board (SSB) Functional Overview The SSB is located behind a shield mounted to the collimator assembly. It performs the following functions: Senses the position of the shutter. Senses the position of the collimator. Senses the position of the detector filter.
Page 509 OFF, making Q1 turn ON and this makes J6-16 high when the shutter is fully open. OPT4 OPT4 is used for the primary filter and is not used in the MicroXR systems. J6-17 will always be high. OPT5 Used to sense that the shutter is fully closed.
Page 510 MicroXR Service Manual 9.3.16: Control Panel Board (Z, L Series) Part Number: 16600 (Rev. B) Description: Control Panel & Circuit Board (CPB) Used in: ZXR, LXR Units LED1 (HV ON) LED2 (In Progress) 9-72...
Page 511 Chapter Nine: Electronics 9.3.16.1: Control Panel Board (CPB) Functional Overview The CPB incorporates the following features: Power ON/OFF switch HV OFF switch / HV ON lamp. HV Key switch. Measurement In Progress lamp. Start / Stop Measurement. Chamber lamp dimmer. Slow Z UP, Slow Z DOWN, Fast Z UP &...
Page 512 MicroXR Service Manual The lamp dimmer puts out 0 to 5V to J1-15. This voltage goes back to the PS-4000 via the ICB, and is used to control the brightness of the chamber lamp. The top door switches are wired to the CPB. This change was made in conjunction with adding the relay on the ICB.
Page 513 Chapter Nine: Electronics 9.3.17: Control Panel Board (G, M, V Series) Part Number: 16600 (Rev. B) Description: Control Panel & Circuit Board (CPB) Used in: G, M, V-Series Chambers Start/Stop Measuring Power High Voltage (Detach CPB to On/Off access LED bank) 9-75...
Page 514 Turn the High Voltage off immediately! Failure of a panel safety interlock is generally attributable to a problem on the SCB and/or software/firmware issues. If either interlock fails, you should contact the Thermo Electron Service Department and report the problem.
Page 515 Chapter Nine: Electronics 9.3.18: 1.85kV Power Supply Board Part Number: 20530 (Rev. E) Description: 1.85kV Power Supply Used in: ZXR, LXR, GXR, GXRC, MXRP (Proportional Counter Systems) TP1 & TP2: 3-Pin connector 1.85kV Terminal (Sense Voltage Out) 4-Pin connector (AC Power In) 9-77...
Page 516 MicroXR Service Manual 9.3.18.1: 1.85kV PS - Functional Overview The 1.85kV Power Supply delivers a 1850V bias voltage to the proportional counter detector. The 1850V output is achieved by the pulse width modulated switching technique. A 15VDC input voltage is chopped by U1 into a PWM square wave with a frequency about 20KHz.
Page 517 Chapter Nine: Electronics 9.3.19: Motion Control Board (Galil) Part Number: 21171 (Rev. A) Description: Motion Control Board (Galil) Used in: GXRC, MXRP, MXR, MXRV, VXR & all console units. 9-79...
Page 518 Windows Plug-n-Play hardware device. The DMC-1730 controls both linear and circular interpretation. There are many jumpers that can be used to configure the board. The current MicroXR configuration requires NO changes to the factory settings. If further information is required, please refer to the Galil User Manual.
Page 519 Chapter Nine: Electronics 9.3.20: Safety & Solenoid I/O Part Number: 25092 (Rev. C) Description: Safety & Solenoid I/O Used in: CXRH 9-81...
Page 520 MicroXR Service Manual 9.3.20.1: Safety & Solenoid I/O Board - Summary The Safety and Solenoid I/O Board is responsible for the following functions on CXR console chambers: Monitors status of Stage, IDE Wafer Handler/Robot and Loader Unit (OCL), X-Ray High Voltage, Wafer Loading and Wafer Door Movement.
Page 521 Chapter Nine: Electronics 9.3.21: X I/O Board Part Number: 16430 Description: I/OX Board Used in: LXR with MPO Option (0.85V) (0.85V) (0.85V) 9-83...
Page 522 MicroXR Service Manual 9.3.21.1: X-I/O Board Functional Overview The X-I/O board provides the MicroXR system with 2 Solenoid drivers, 3 stepped motor drivers and additional I/O. This board has a serial interface to the ICB. U1 is an FPGA used to convert the serial data to parallel data.
Page 523 Chapter Nine: Electronics 9.3.21.1.2: Stepper Motor Drivers The X-I/O can drive three stepper motors. U5 & U6 drive one motor while U7 & U8 drive the second motor and U9 & U10 for the third. Current is adjusted by monitoring TP-1, TP-2 and TP-3 while setting R13, R16 and R18 respectively, and is normally set to .085V.
Page 524 9.4: Power Supplies (OEM) 9.4.1: Overview This section provides brief functional descriptions and manufacturer specification sheets for OEM power supply components used in MicroXR systems. Installation and configuration details are located in other sections of this manual, as referenced in table below. Note: Electronic versions of these specification sheets are provided in PDF format on the CD-ROM (Vol 3, Technical Bulletins) supplement to this manual.
Page 525 Chapter Nine: Electronics Part Number: 595-05-003 Description: 50 kV High Voltage Power Supply (HVPS) Used in: All Units 9-87...
Page 526 MicroXR Service Manual 9.4.2: HVPS Functional Overview The HVPS powers the X-ray tube. It requires a programming voltage of 1V per 10,000V of output to a maximum of 50,000V. The programming voltage is supplied via the System Control Board (SCB) on ZXR and LXR systems, or the System Status Control Board (SSCB) on GXR, MXR, and VXR systems (see section 9.3).
Page 527 Chapter Nine: Electronics Ramp the high voltage. Does the High Voltage ramps up to the required 47kV? If so, then the supply is not the problem; if it does not, then the supply is bad and must be replaced. Arcing Noise, Intermittent Failure to Ramp Up Check cable for damage, dirty terminals;...

Thermo Electron MicroXR Service Manual

Chapter 1: Introduction

Chapter 2: Safety

Chapter 3: Product Overview

Chapter 4: Theory of Operation

Chapter 6: Software

Chapter 7: Troubleshooting

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