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1. Product Outline
■ Product outline
This product is a header board (referred to as "header board") used to connect the MCU board (Mod-
el number : MB2146-301, MB2146-303) which mounted an evaluation MCU in the F
ily of Fujitsu 8-bit microcontrollers to a user system and package product signal line conversion
board (referred to as "conversion board") for connecting with a target board. To build an F
evaluation environment, combine four products shown in Figure 1: the header board, conversion
board, MCU board, and BGM adapter (Model number : MB2146-09).
■ Product configuration
Table 1 lists the product configuration in the header board, and Table 2 lists options.
Name
Header board for SOP-28P
(1.27 mm pitch) package
Conversion board for SOP-28P
(1.27 mm pitch) package
Name
BGM adapter
[Model number : MB2146-09]
MCU board
[Model number : MB2146-301,
MB2146-303]
* :
Several types of evaluation MCUs are available depending on their applications and the power supply voltage. Pur-
chase the one that satisfies the service conditions.
BGM adapter
Figure 1 System configuration
Table 1 Product cofiguration
Description
The board which changes the signal line
of a package product from a MCU board
The package signal line conversion con-
nector for user system mounting
Table 2 Option
Description
ICE unit for F
2
MC-8FX
Built-in MB95FV100B-101,
MB95FV100B-103
MCU board
Header board,
Conversion board
Remarks
-
Capable of purchasing as option individual-
ly[Model number : SSA-28YR1-M17
(from Tokyo Eletech Corporation.) ]
Remarks
-
Built-in F
2
MC-8FX evaluation MCU *
2
MC-8FX fam-
2
MC-8FX
1
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