HP TouchSmart TM2-2150 Maintenance And Service Manual page 80

NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and system
board components, it may be necessary to move the heat sink from side to side to detach the assembly.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board each time the heat sink is removed. Thermal pads are used on the PCH chip (1) and the
heat sink section (2) that services it. Thermal paste is used on the processor (3) and the heat sink
section (4) that services it. Replacement thermal material is included with all system board and heat
sink spare part kits.
70 Chapter 4 Removal and replacement procedures