HP ProBook 6560b Maintenance And Service Manual page 99

NOTE: For discrete models, thoroughly clean thermal material from the surfaces of the system board
components (1)(3)(5), the heat sink (2)(4)(6) each time you remove the heat sink. All heat sink and
processor spare part kits include thermal material.
In the following illustration, the location denoted by callout (2) on the heat sink uses thermal grease.
The location denoted by callout (4) on the heat sink uses a GPU thermal pad. The location denoted by
callout (6) on the heat sink uses a PCH thermal pad.
NOTE: For UMA models, thoroughly clean thermal material from the surfaces of the system board (1)
(3) and heat sink (2)(4) each time you remove the heat sink. All heat sink and processor spare part
kits include thermal material.
In the following illustration, the location denoted by callout (2) on the heat sink uses thermal grease.
The location denoted by callout (4) on the heat sink uses a PCH thermal pad.
Component replacement procedures
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