Introduction
Specifications
Latest Specification Information
The specifications listed here are correct at the
time of sending them to the press. Certain items
(particularly processor types/speeds) may be
changed, delayed or updated due to the manu-
facturer's release schedule. Check with your
service center for more details.
CPU
The CPU is not a user serviceable part. Ac-
cessing the CPU in any way may violate your
warranty.
1 - 2 Specifications
Processor
Intel® Celeron® 847 Processor
1.10GHz, 32nm, 2MB L3 Cache, DDR3-1333MHz, TDP:
17W
Intel® Celeron® 877 Processor
1.40GHz, 32nm, 2MB L3 Cache, DDR3-1333MHz, TDP:
17W
Display
17.3" (43.94cm) HD+ / FHD
Core Logic
Intel® NM70 Chipset
Memory
Two 204 Pin SO-DIMM Socket Supporting DDR3 1333/
1600MHz Memory (The real memory operating frequency
depends on the FSB of the processor)
Memory Expandable up to 16GB
BIOS
One 48Mb SPI Flash ROM
AMI BIOS
Video Adapter
Intel® HD Graphics
Dynamic Frequency (Intel Dynamic Video Memory Technol-
ogy for up to 1.7GB)
Microsoft DirectX®10.1 Compatible
Audio
High Definition Audio Compliant Interface
2 * Built-In Speakers
Built-In Microphone
Storage
(Factory Option) One Changeable 12.7mm(h) Super Multi
Optical Device Drive
One Changeable 2.5" 9.5mm (h) SATA HDD
Interface
Three USB 2.0 Ports
One Headphone-Out Jack
One Microphone-In Jack
One External Monitor Port
One HDMI-Out Port
One RJ-45 LAN Jack
One DC-in Jack
Security
Kensington Lock Slot
BIOS Password
Keyboard
Full-size "WinKey" keyboard (with numeric keypad)
Pointing Device
Built-in Touchpad
Communication
10Mb/100Mb Ethernet LAN
(Factory Option) 300K Pixel /2M HD PC Camera Module
WLAN/ Bluetooth Half Mini-Card Modules:
(Factory Option) Intel® Centrino® Wireless-N 105 Wireless
LAN (802.11b/g/n)
(Factory Option) Intel® Centrino® Wireless-N 135 Wireless
LAN (802.11b/g/n) + Bluetooth 3.0
(Factory Option) Third-Party Wireless LAN (802.11b/g/n)
(Factory Option) Third-Party Wireless LAN (802.11b/g/n) +
Bluetooth 4.0