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Chengdu Ebyte Electronic Technology Co.,Ltd.
Packaging method
Interface mode
Communication interface
Dimension
RF interface
3 Size and pin definition
Pin No.
Item
1
GND
2
GND
3
GND
4
GND
5
GND
6
RXEN
Copyright ©2012–2021，Chengdu Ebyte Electronic Technology Co.,Ltd.
SMD
Stamp hole
The spacing is 2.54mm
SPI
0-10Mbps
38.5*24 mm
Including shield
Stamp hole / IPEX
Direction
Ground, connect to power reference ground
Ground, connect to power reference ground
Ground, connect to power reference ground
Ground, connect to power reference ground
Ground, connect to power reference ground
RF switch receive control pin, connect external MCU IO, high level
Input
effective
E220-400M30S User Manual
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Description
6
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